Abstract: A overload protection switch with a reverse restart switching structure that has a seesaw lampshade provided with a protruding block which extending downward from the outside of the seesaw lampshade to ensure that the seesaw lampshade and the moving rod are accurately positioned in the ON and OFF positions in the housing to form a three-stage switching type with bidirectional positioning and forms an overload protection switch that can continuously maintain sufficient insulation distance and does not reduce the insulation distance due to fatigue decay of the binary alloy conductive plate.

Abstract: A safety gate is configured to be mounted at a gateway and has a frame and a gate body. The frame is configured to be mounted between two walls disposed at two sides of the gateway. The frame has two sides and two first positioning assemblies respectively disposed at the two sides of the frame. The gate body is disposed in the frame and has two sides and two first pivot assemblies respectively disposed at the two sides of the gate body. The first pivot assembly at each side of the gate body is configured to detachably and pivotally connect with the first positioning assembly at a respective one of the sides of the frame.

Abstract: An image sensor includes a photoelectric conversion layer, a plurality of deep trench isolations, a first color filter, a first deflector, and a covering layer. The photoelectric conversion layer includes a first photodiode and a second photodiode. The deep trench isolations separate the first photodiode and the second photodiode, in which a pixel dimension is determined by a distance between two adjacent deep trench isolations. The first color filter is disposed on the first photodiode and the second photodiode. The first deflector is disposed on the first color filter. The covering layer covers and surrounds the first deflector. A refractive index of the covering layer is greater than a refractive index of the first deflector, and a difference value between the refractive index of the covering layer and the refractive index of the first deflector is in a range from 0.15 to 0.6.

Abstract: The present disclosure provides a semiconductor structure, including a substrate, a gate structure over the substrate, including a work function layer over the substrate, a dielectric layer at least partially surrounding the gate structure, and a capping layer over the gate structure, wherein a bottom of the capping layer includes at least one protrusion protruding toward the substrate.

Abstract: A circuit for parameter PSRR measurement includes a filter, a first regulator and a second regulator. The filter may be configured for receiving an AC input signal and a DC input signal, and for outputting a combined output signal according to the AC input signal and the DC input signal. The first regulator may be configured for receiving the combined output signal, and for outputting a first output signal having a first AC component signal and a first DC component signal. The second regulator may be configured for receiving the first output signal, and for outputting a second output signal having a second AC component signal and a second DC component signal. A parameter PSRR of the second regulator may be obtained according to a ratio between the second AC component signal and the first AC component signal.

Abstract: A detection circuit is used for a display controller configured to generate a plurality of backlight data according to a plurality of image data. The detection circuit includes a resize circuit and a comparison circuit. The resize circuit is configured to receive the plurality of image data and convert the plurality of image data into a plurality of region data. The comparison circuit, coupled to the resize circuit, is configured to: receive at least one first region data from the resize circuit; receive at least one first backlight data corresponding to the at least one first region data from the display controller; compare the at least one first region data with the at least one first backlight data to generate a comparison result; and output a control signal to control an output setting of the display controller according to the comparison result.

Abstract: A device for encouraging and guiding a spirometer user includes a housing, a main valve, a visual assembly, and a sound making assembly. The housing has a guiding channel, a first outlet channel, a second outlet channel, and an inlet channel. The main valve is disposed in a housing communicating with the guiding channel, the first outlet channel, the second outlet channel or the inlet channel and configured to regulate or control fluid flowing paths. The visual assembly includes a check valve in the second outlet channel, and at least one movable member. The sound making assembly includes a check valve and a sound maker. So, it can generate the visual and sound encouraging effects for learning how to use a spirometer correctly.

Abstract: Improved control of via anchor profiles in metals at a contact layer can be achieved by slowing down an anchor etching process and by introducing a passivation operation. By first passivating a metallic surface, etchants can be prevented from dispersing along grain boundaries, thereby distorting the shape of the via anchor. An iterative scheme that involves multiple cycles of alternating passivation and etching operations can control the formation of optimal via anchor profiles. When a desirable anchor shape is achieved, the anchor maintains structural integrity of the vias, thereby improving reliability of the interconnect structure.

Abstract: An image sensor includes groups of sensor units, and a color filter layer having color units that disposed within the groups of sensor units, respectively. The color units of the color filter layer include a yellow color unit or a white color unit. The image sensor further includes a dielectric structure disposed on the color filter layer, and a meta surface disposed on the dielectric structure.

Abstract: The present disclosure provides a light sensing element including a unit. The unit includes a plurality of photodiodes, a color filter disposed above the photodiodes, and a light host embedded in the color filter. The light host is a hollow structure disposed above the photodiodes. The color filter includes a first portion surrounding the light host, a second portion surrounded by the light host, and a third portion covering and physically contacting the first portion, the light host, and the second portion.

Abstract: A circuit for parameter PSRR measurement includes a filter, a first regulator and a second regulator. The filter may be configured for receiving an AC input signal and a DC input signal, and for outputting a combined output signal according to the AC input signal and the DC input signal. The first regulator may be configured for receiving the combined output signal, and for outputting a first output signal having a first AC component signal and a first DC component signal. The second regulator may be configured for receiving the first output signal, and for outputting a second output signal having a second AC component signal and a second DC component signal. A parameter PSRR of the second regulator may be obtained according to a ratio between the second AC component signal and the first AC component signal.

Abstract: The present disclosure relates to an integrated chip processing tool. The integrated chip processing tool includes a gas distribution ring configured to extend along a perimeter of a process chamber. The gas distribution ring includes a lower ring extending around the process chamber. The lower ring has a plurality of gas inlets arranged along a bottom surface of the lower ring and a plurality of gas conveyance channels arranged along an upper surface of the lower ring directly over the plurality of gas inlets. The gas distribution ring further includes an upper ring disposed on the upper surface of the lower ring and covering the plurality of gas conveyance channels. A plurality of gas outlets are arranged along opposing ends of the plurality of gas conveyance channels. A plurality of gas conveyance paths extending between the plurality of gas inlets and the plurality of gas outlets have approximately equal lengths.

Abstract: A device is provided. The device includes an operational amplifier, an output circuit, a first capacitor, and a second capacitor. The operational amplifier is configured to generate an output according to a feedback signal. The output circuit is configured to generate a first current signal in response to a supply voltage and the output of the operational amplifier. The first current signal includes a first ripple signal. The first capacitor and the second capacitor are coupled in parallel between the operational amplifier and the output circuit. The first capacitor is configured to receive the first current signal and feedback to the operational amplifier the first ripple signal.

Abstract: The present disclosure provides a printed circuit board and a method thereof. The printed circuit board has a first substrate, at least one first trace layer and at least one second trace layer. The first substrate has a first surface and a second surface. The first surface and the second surface are corresponding to each other along an axis. The first trace layer is formed on the first surface and/or the second surface of the first substrate. The first trace layer has at least one first trace and at least one first gap beside the first trace by etching. The second trace layer is formed on the first trace layer. The second trace layer has at least one second trace and at least one second gap beside the second trace by etching.

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

Abstract: A pre-treatment apparatus can be added as a module of a wafer track system, where the pre-treatment is designed to reduce friction at the edges of a substrate. Reducing edge friction can help prevent back side edge particles during attachment to a vacuum chuck in a subsequent processing operation that can occur, for example, in an exposure device. The pre-treatment apparatus can be configured to deliver one or more gases to treat top and/or bottom surfaces of a substrate. The pre-treatment apparatus can treat back side edges of a substrate to reduce edge friction of the substrate and to prevent overlay defects.

Abstract: The present disclosure relates to structures and methods of quantum devices. A quantum device comprises a substrate with an insulation surface and at least one quantum component disposed on the insulation surface of the substrate. The at least one quantum component may comprise multiple plateau members and at least one quantum dot. Each plateau member is disposed at an angle against an adjacent plateau member. Each quantum dot is formed within an insulation body and disposed at an included-angle location of two adjacent plateau members of the multiple plateau members. In addition, the at least one quantum component is operable under high temperature, such as above 4 K.

Abstract: The present invention relates to an image sensing structure, including: a sensing circuit, a storage circuit and a processing circuit. The sensing circuit is used to generate multiple sensing signals in different periods; the storage circuit is used to store the sensing signals. The storage circuit sequentially outputs a first sensing signal of a target object in a first period and a second sensing signal of the target object in a second period to the processing circuit. The processing circuit performs dynamic event detection processing through the first sensing signal and the second sensing signal. Also, the present invention relates to an image sensing device including the image sensing structure.

Abstract: The present invention relates to an image sensing device comprising: an image sensing array and an image processing circuit. The image sensing array includes sensing units, and the sensing units respectively generate multiple pieces of pixel data. The multiple pieces of pixel data are generated according to different frame rates under different exposure periods, and include a first pixel data of a first subframe and a second pixel data of a second subframe. The first pixel data is generated by exposing a first exposure period for a first frame rate, and the second pixel data is generated by exposing a second exposure period for a second frame rate. The first frame rate is less than the second frame rate. The first exposure period is greater than the second exposure period, and multiple pieces of the second pixel data are generated during one image capturing operation.

Abstract: A pixel package includes a base material, a circuit structure, light-emitting semiconductor elements, a non-light-emitting semiconductor element, and a light-transmitting adhesive layer. The base material has an upper surface, a lower surface, and a side surface. The circuit structure is buried in the base material and includes an first circuit layer exposed from the upper surface, bottom electrodes exposed from the lower surface, and a middle circuit layer between the upper circuit layer and the plurality of bottom electrodes and covered by the base material. The light-emitting semiconductor elements are on the upper surface and electrically connected to the circuit structure. The non-light-emitting semiconductor element is buried in the base material and directly connected to the middle circuit layer, and at least one outside surface is exposed. The light-transmitting adhesive layer covers the light-emitting semiconductor elements and is in direct contact with the base material.