Patents by Inventor Hsin-Hsien Wu

Hsin-Hsien Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11965217
    Abstract: A method and a kit for detecting Mycobacterium tuberculosis are provided. The method includes a step of performing a nested qPCR assay to a specimen. The nested qPCR assay includes a first round of amplification using external primers and a second round of amplification using internal primers and a probe. The external primers have sequences of SEQ ID NOs. 1 and 2, and the internal primers and the probe have sequences of SEQ ID NOs. 3 to 5.
    Type: Grant
    Filed: May 24, 2021
    Date of Patent: April 23, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yi-Chen Li, Chih-Cheng Tsou, Min-Hsien Wu, Hsin-Yao Wang, Chien-Ru Lin
  • Publication number: 20240128876
    Abstract: A switching control circuit for use in controlling a resonant flyback power converter generates a first driving signal and a second driving signal. The first driving signal is configured to turn on the first transistor to generate a first current to magnetize a transformer and charge a resonant capacitor. The transformer and charge a resonant capacitor are connected in series. The second driving signal is configured to turn on the second transistor to generate a second current to discharge the resonant capacitor. During a power-on period of the resonant flyback power converter, the second driving signal includes a plurality of short-pulses configured to turn on the second transistor for discharging the resonant capacitor. A pulse-width of the short-pulses of the second driving signal is short to an extent that the second current does not exceed a current limit threshold.
    Type: Application
    Filed: June 15, 2023
    Publication date: April 18, 2024
    Inventors: Yu-Chang Chen, Ta-Yung Yang, Kun-Yu Lin, Fu-Ciao Syu, Chia-Hsien Yang, Hsin-Yi Wu
  • Publication number: 20240120844
    Abstract: A resonant flyback power converter includes: a first and a second transistors which form a half-bridge circuit for switching a transformer and a resonant capacitor to generate an output voltage; a current-sense device for sensing a switching current of the half-bridge circuit to generate a current-sense signal; and a switching control circuit generating a first and a second driving signals for controlling the first and the second transistors. The turn-on of the first driving signal controls the half-bridge circuit to generate a positive current to magnetize the transformer and charge the resonant capacitor. The turn-on of the second driving signal controls the half-bridge circuit to generate a negative current to discharge the resonant capacitor. The switching control circuit turns off the first transistor when the positive current exceeds a positive-over-current threshold, and/or, turns off the second transistor when the negative current exceeds a negative-over-current threshold.
    Type: Application
    Filed: April 10, 2023
    Publication date: April 11, 2024
    Inventors: Kun-Yu LIN, Ta-Yung YANG, Yu-Chang CHEN, Hsin-Yi WU, Fu-Ciao SYU, Chia-Hsien YANG
  • Publication number: 20230378003
    Abstract: In a method, a structure including two or more materials having different coefficients of thermal expansion is prepared, and the structure is subjected to a cryogenic treatment. In one or more of the foregoing and following embodiments, the structure includes a semiconductor wafer and one or more layers are formed on the semiconductor wafer.
    Type: Application
    Filed: August 4, 2023
    Publication date: November 23, 2023
    Inventors: Li-Chao YIN, Hung-Bin LIN, Hsin-Hsien WU, Chih-Ming KE, Chyi Shyuan CHERN, Ming-Hua LO
  • Patent number: 11784541
    Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: October 10, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan, Yu-Chuan Huang
  • Patent number: 11739768
    Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: August 29, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan
  • Publication number: 20230204047
    Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.
    Type: Application
    Filed: May 18, 2022
    Publication date: June 29, 2023
    Inventors: Graham CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chin-Hui PAN
  • Publication number: 20230133593
    Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.
    Type: Application
    Filed: April 1, 2022
    Publication date: May 4, 2023
    Inventors: Graham CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chin-Hui PAN, Yu-Chuan HUANG
  • Publication number: 20230083690
    Abstract: An electric gripper is disclosed and includes a carrier, an actuator, two dual-lever assemblies and an angle sensor. The actuator is disposed on the carrier and includes a sliding portion. The two dual-lever assemblies are disposed on the carrier and located at two opposite lateral sides of the sliding portion. Each of the two dual-lever assemblies includes a driving lever, a limiting lever and a gripping piece. The driving levers are staggered to each other. The limiting levers are staggered to each other. When the sliding portion slides a first distance in the first direction, the sliding portion drives the driving levers to rotate an angle, and the gripping pieces move toward each other to displace a second distance in a second direction. The angle sensor is disposed on the carrier and configured to measure the angle, to correspond to the first distance and the second distance.
    Type: Application
    Filed: May 11, 2022
    Publication date: March 16, 2023
    Inventors: Chih-Ming Hsu, Hsin-Hsien Wu, Shang-Wei Yang
  • Patent number: 11585357
    Abstract: A fan casing for mounting of a fan includes a frame including four corner segments and four side segments that are arranged alternately with the corner segments, a seat disposed in the frame, and four support members extending radially and outwardly from the seat and connected respectively to the corner segments. Each support member includes a base connected to the seat and having a width reducing in a direction away from the seat, and a rib connected between the base and the corresponding corner segment. The bases are interconnected to surround the seat. Any two adjacent bases are interconnected to form an arc surface facing the corresponding side segment and adapted to absorb shock.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: February 21, 2023
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Graham Chen, Chih-Tsung Hsu, Hsin-Hsien Wu, Chin-Hui Pan, Yu-Ting Liu
  • Publication number: 20230008171
    Abstract: An ozone generator and an ozone generating method, where the ozone generator includes a dielectric substrate, a first electrode disposed on a first surface of the dielectric substrate, and a second electrode disposed on the dielectric substrate and corresponding to the first electrode. The first electrode comprises a plurality of first finger portions and a plurality of superficial structures integrally formed on the plurality of first finger portions.
    Type: Application
    Filed: July 8, 2022
    Publication date: January 12, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuan-Lun PAN, Hsin-Hsien WU, Keh-Perng SHEN, Ming-Shou HO
  • Publication number: 20210217670
    Abstract: In a method, a structure including two or more materials having different coefficients of thermal expansion is prepared, and the structure is subjected to a cryogenic treatment. In one or more of the foregoing and following embodiments, the structure includes a semiconductor wafer and one or more layers are formed on the semiconductor wafer.
    Type: Application
    Filed: October 30, 2020
    Publication date: July 15, 2021
    Inventors: Li-Chao Yin, Hung-Bin Lin, Hsin-Hsien Wu, Chih-Ming Ke, Chyi Shyuan Chern, Ming-Hua Lo
  • Patent number: 10794400
    Abstract: A fan includes a rotating unit and a housing unit. The rotating unit includes a base and a fan body that is rotatably mounted to the base. The housing unit includes an outer ring that surrounds and is connected to the base, a plurality of connecting members that are mounted to an outer peripheral surface of the outer ring and that are spaced apart from each other, and a base member that surrounds the rotating unit and the outer ring and that is connected to the connecting members. The base member has a plurality of receiving holes, and each of the connecting members is made of a shock-absorbing material, and is fixed in a respective one of the receiving holes.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: October 6, 2020
    Assignee: YEN SUN TECHNOLOGY CORP.
    Inventors: Chien-Jung Chen, Hsin-Hsien Wu, Chih-Tsung Hsu
  • Publication number: 20200209186
    Abstract: A gas sensing device comprises a housing, a cover, and a gas sensing module. The housing has an accommodating space. The cover is disposed on the housing. The cover has a top surface, a bottom surface, and a gas passage. The bottom surface faces the accommodating space. The gas passage is communicated with the accommodating space. The gas passage has a first opening and a second opening. The first opening is located on the top surface. The second opening is located on the bottom surface. The area of the first opening is larger than the area of the second opening. A gas sensing system comprises two aforementioned gas sensing devices, and one of the gas sensing devices is provided with a filter module.
    Type: Application
    Filed: December 26, 2019
    Publication date: July 2, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chen Wei LIU, Chun Chi CHEN, Hsin-Hsien WU, Hsin Yi HUANG
  • Publication number: 20200132080
    Abstract: A fan device includes a casing unit and a fan impeller unit mounted in the casing unit. The casing unit includes a casing body formed with a receiving space and an air outlet port, a porous plate formed with a plurality of through holes and is disposed in the receiving space to divide the receiving space into an air-flowing room and a noise-reduction room, and an air-entering tube in spatial communication with the air-flowing room. The fan impeller unit is disposed in the air-flowing room and rotatable to generate airflow partially flowing from the air-flowing room into the noise-reduction room through the through holes.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 30, 2020
    Inventors: Chien-Jung CHEN, Hsin-Hsien WU, Chih-Tsung HSU, Chin-Hui PAN
  • Publication number: 20200088209
    Abstract: A centrifugal fan includes a casing and an impeller module. The casing defines an accommodating space having an air inlet and an air outlet. The impeller module is mounted in the accommodating space for allowing air flow to enter from the air inlet and exit from the air outlet. The impeller module includes a body and a plurality of blade units connected to and annularly distributed along a circumference of the body. Each blade unit has a plurality of blades arranged equi-angularly. A blade spacing which is defined between each adjacent pair of the blades of one of the blade units is different from a blade spacing which is defined between each adjacent pair of the blades of another one of the blade units.
    Type: Application
    Filed: September 11, 2019
    Publication date: March 19, 2020
    Inventors: Chien-Jung CHEN, Chih-Tsung HSU, Hsin-Hsien WU, Chan-Yi WU
  • Patent number: 10460922
    Abstract: The present disclosure generally relates to methods and apparatus for heating a substrate as well as a slot management method for a thermal treatment chamber that in one embodiment includes providing a first substrate to a first slot of a carrier in the thermal treatment chamber via a transfer opening formed in the thermal treatment chamber, the first substrate having a specified anneal time, heating the substrate, moving the carrier to a lowermost position in the thermal treatment chamber using an elevator mechanism coupled to the carrier, and moving the carrier such that the first slot is in a position adjacent to the transfer opening using the elevator mechanism within a carrier transfer time period and transferring the first substrate out of the thermal treatment chamber at a determined time period for anneal.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: October 29, 2019
    Assignee: Applied Materials, Inc.
    Inventors: James Hoffman, Atsushi Kitani, Hsin-Hsien Wu, Chia-Hung Chen
  • FAN
    Publication number: 20190219067
    Abstract: A fan includes a rotating unit and a housing unit. The rotating unit includes a base and a fan body that is rotatably mounted to the base. The housing unit includes an outer ring that surrounds and is connected to the base, a plurality of connecting members that are mounted to an outer peripheral surface of the outer ring and that are spaced apart from each other, and a base member that surrounds the rotating unit and the outer ring and that is connected to the connecting members. The base member has a plurality of receiving holes, and each of the connecting members is made of a shock-absorbing material, and is fixed in a respective one of the receiving holes.
    Type: Application
    Filed: January 4, 2019
    Publication date: July 18, 2019
    Inventors: Chien-Jung CHEN, Hsin-Hsien WU, Chih-Tsung HSU
  • Publication number: 20180337073
    Abstract: The present disclosure generally relates to methods and apparatus for heating a substrate as well as a slot management method for a thermal treatment chamber that in one embodiment includes providing a first substrate to a first slot of a carrier in the thermal treatment chamber via a transfer opening formed in the thermal treatment chamber, the first substrate having a specified anneal time, heating the substrate, moving the carrier to a lowermost position in the thermal treatment chamber using an elevator mechanism coupled to the carrier, and moving the carrier such that the first slot is in a position adjacent to the transfer opening using the elevator mechanism within a carrier transfer time period and transferring the first substrate out of the thermal treatment chamber at a determined time period for anneal.
    Type: Application
    Filed: May 19, 2017
    Publication date: November 22, 2018
    Inventors: James HOFFMAN, Atsushi KITANI, Hsin-Hsien WU, Chia-Hung CHEN
  • Patent number: 10113233
    Abstract: An apparatus and a method for controlling critical dimension (CD) of a circuit is provided. An apparatus includes a controller for receiving CD measurements at respective locations in a circuit pattern in an etched film on a first substrate and a single wafer chamber for forming a second film of the film material on a second substrate. The single wafer chamber is responsive to a signal from the controller to locally adjust a thickness of the second film based on the measured CD's. A method provides for etching a circuit pattern of a film on a first substrate, measuring CD's of the circuit pattern, adjusting a single wafer chamber to form a second film on a second semiconductor substrate based on the measured CD. The second film thickness is locally adjusted based on the measured CD's.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: October 30, 2018
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chun-Lin Chang, Hsin-Hsien Wu, Zin-Chang Wei, Chi-Ming Yang, Chyi Shyuan Chern, Jun-Lin Yeh, Jih-Jse Lin, Jo Fei Wang, Ming-Yu Fan, Jong-I Mou