Abstract: A bonded assembly may be formed by: disposing a packaging substrate having substrate-side bonding structures over a transparent plate; heating the packaging substrate using radiative heating in which a radiative heating source provides radiation to a bottom surface of the packaging substrate through the transparent plate; attaching a semiconductor die having die-side bonding structures to a bottom of a thermocompressive bonding head; bringing the semiconductor die and the packaging substrate to indirect contact with each other with an array of solder material portions therebetween; and bonding the semiconductor die to the packaging substrate by reflowing and solidifying the solder material portions.

Abstract: A gripper structure is disclosed and includes a screw-rod main body, a first rotatory nut, a second rotatory nut, a first driving module, a second driving module, a first clamping element and a second clamping element. The first rotatory nut and the second rotatory nut are disposed on two sides of the screw-rod main extended along a first direction body, respectively, and bilaterally symmetrical to each other. The first driving module and the second driving module are configured to drive the first rotatory nut and the second rotatory nut to rotate, respectively. The first rotatory nut and the second rotatory nut are allowed to pass through a midline of the screw-rod main body. When the first driving module drives the first rotatory nut or/and the second driving module drives the second rotatory nut, the first clamping element and the second clamping element are relatively displaced in the first direction to achieve a clamping operation.

Abstract: In a method, a structure including two or more materials having different coefficients of thermal expansion is prepared, and the structure is subjected to a cryogenic treatment. In one or more of the foregoing and following embodiments, the structure includes a semiconductor wafer and one or more layers are formed on the semiconductor wafer.

Abstract: In a method, a structure including two or more materials having different coefficients of thermal expansion is prepared, and the structure is subjected to a cryogenic treatment. In one or more of the foregoing and following embodiments, the structure includes a semiconductor wafer and one or more layers are formed on the semiconductor wafer.

Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.

Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.

Abstract: A fan includes a frame member, a fan body, a surrounding plate and a housing unit. The frame member surrounds an axis and defines an accommodating space in which the fan body is disposed. The fan body is rotatable about the axis. The surrounding plate surrounds the frame member and is formed with at least one plate hole extending in a transverse direction transverse to an axial direction of the axis therethrough. The housing unit surrounds the surrounding plate and has a plurality of housing holes extending in the axial direction of the axis therethrough. The housing unit and the surrounding plate cooperatively define a surrounding space therebetween that is surrounded by the housing holes.

Abstract: A grounding structure for a motor stator includes a silicon steel sheet unit, and upper and lower insulating frames clamping the silicon steel sheet unit therebetween. The grounding structure further includes a conductive member and a circuit board. The conductive member is clamped between the silicon steel sheet unit and the lower insulating frame, and protruding from a lower end of the lower insulating frame. The circuit board is disposed at a lower side of the lower insulating frame, and includes a negative contact that is connected to a lower edge of the conductive member.

Abstract: An electric gripper is disclosed and includes a carrier, an actuator, two dual-lever assemblies and an angle sensor. The actuator is disposed on the carrier and includes a sliding portion. The two dual-lever assemblies are disposed on the carrier and located at two opposite lateral sides of the sliding portion. Each of the two dual-lever assemblies includes a driving lever, a limiting lever and a gripping piece. The driving levers are staggered to each other. The limiting levers are staggered to each other. When the sliding portion slides a first distance in the first direction, the sliding portion drives the driving levers to rotate an angle, and the gripping pieces move toward each other to displace a second distance in a second direction. The angle sensor is disposed on the carrier and configured to measure the angle, to correspond to the first distance and the second distance.

Abstract: A fan casing for mounting of a fan includes a frame including four corner segments and four side segments that are arranged alternately with the corner segments, a seat disposed in the frame, and four support members extending radially and outwardly from the seat and connected respectively to the corner segments. Each support member includes a base connected to the seat and having a width reducing in a direction away from the seat, and a rib connected between the base and the corresponding corner segment. The bases are interconnected to surround the seat. Any two adjacent bases are interconnected to form an arc surface facing the corresponding side segment and adapted to absorb shock.

Abstract: An ozone generator and an ozone generating method, where the ozone generator includes a dielectric substrate, a first electrode disposed on a first surface of the dielectric substrate, and a second electrode disposed on the dielectric substrate and corresponding to the first electrode. The first electrode comprises a plurality of first finger portions and a plurality of superficial structures integrally formed on the plurality of first finger portions.

Abstract: In a method, a structure including two or more materials having different coefficients of thermal expansion is prepared, and the structure is subjected to a cryogenic treatment. In one or more of the foregoing and following embodiments, the structure includes a semiconductor wafer and one or more layers are formed on the semiconductor wafer.

Abstract: A fan includes a rotating unit and a housing unit. The rotating unit includes a base and a fan body that is rotatably mounted to the base. The housing unit includes an outer ring that surrounds and is connected to the base, a plurality of connecting members that are mounted to an outer peripheral surface of the outer ring and that are spaced apart from each other, and a base member that surrounds the rotating unit and the outer ring and that is connected to the connecting members. The base member has a plurality of receiving holes, and each of the connecting members is made of a shock-absorbing material, and is fixed in a respective one of the receiving holes.

Abstract: A gas sensing device comprises a housing, a cover, and a gas sensing module. The housing has an accommodating space. The cover is disposed on the housing. The cover has a top surface, a bottom surface, and a gas passage. The bottom surface faces the accommodating space. The gas passage is communicated with the accommodating space. The gas passage has a first opening and a second opening. The first opening is located on the top surface. The second opening is located on the bottom surface. The area of the first opening is larger than the area of the second opening. A gas sensing system comprises two aforementioned gas sensing devices, and one of the gas sensing devices is provided with a filter module.

Abstract: A fan device includes a casing unit and a fan impeller unit mounted in the casing unit. The casing unit includes a casing body formed with a receiving space and an air outlet port, a porous plate formed with a plurality of through holes and is disposed in the receiving space to divide the receiving space into an air-flowing room and a noise-reduction room, and an air-entering tube in spatial communication with the air-flowing room. The fan impeller unit is disposed in the air-flowing room and rotatable to generate airflow partially flowing from the air-flowing room into the noise-reduction room through the through holes.

Abstract: A centrifugal fan includes a casing and an impeller module. The casing defines an accommodating space having an air inlet and an air outlet. The impeller module is mounted in the accommodating space for allowing air flow to enter from the air inlet and exit from the air outlet. The impeller module includes a body and a plurality of blade units connected to and annularly distributed along a circumference of the body. Each blade unit has a plurality of blades arranged equi-angularly. A blade spacing which is defined between each adjacent pair of the blades of one of the blade units is different from a blade spacing which is defined between each adjacent pair of the blades of another one of the blade units.

Abstract: The present disclosure generally relates to methods and apparatus for heating a substrate as well as a slot management method for a thermal treatment chamber that in one embodiment includes providing a first substrate to a first slot of a carrier in the thermal treatment chamber via a transfer opening formed in the thermal treatment chamber, the first substrate having a specified anneal time, heating the substrate, moving the carrier to a lowermost position in the thermal treatment chamber using an elevator mechanism coupled to the carrier, and moving the carrier such that the first slot is in a position adjacent to the transfer opening using the elevator mechanism within a carrier transfer time period and transferring the first substrate out of the thermal treatment chamber at a determined time period for anneal.

Abstract: A fan includes a rotating unit and a housing unit. The rotating unit includes a base and a fan body that is rotatably mounted to the base. The housing unit includes an outer ring that surrounds and is connected to the base, a plurality of connecting members that are mounted to an outer peripheral surface of the outer ring and that are spaced apart from each other, and a base member that surrounds the rotating unit and the outer ring and that is connected to the connecting members. The base member has a plurality of receiving holes, and each of the connecting members is made of a shock-absorbing material, and is fixed in a respective one of the receiving holes.

Abstract: The present disclosure generally relates to methods and apparatus for heating a substrate as well as a slot management method for a thermal treatment chamber that in one embodiment includes providing a first substrate to a first slot of a carrier in the thermal treatment chamber via a transfer opening formed in the thermal treatment chamber, the first substrate having a specified anneal time, heating the substrate, moving the carrier to a lowermost position in the thermal treatment chamber using an elevator mechanism coupled to the carrier, and moving the carrier such that the first slot is in a position adjacent to the transfer opening using the elevator mechanism within a carrier transfer time period and transferring the first substrate out of the thermal treatment chamber at a determined time period for anneal.

Abstract: An apparatus and a method for controlling critical dimension (CD) of a circuit is provided. An apparatus includes a controller for receiving CD measurements at respective locations in a circuit pattern in an etched film on a first substrate and a single wafer chamber for forming a second film of the film material on a second substrate. The single wafer chamber is responsive to a signal from the controller to locally adjust a thickness of the second film based on the measured CD's. A method provides for etching a circuit pattern of a film on a first substrate, measuring CD's of the circuit pattern, adjusting a single wafer chamber to form a second film on a second semiconductor substrate based on the measured CD. The second film thickness is locally adjusted based on the measured CD's.