Abstract: A method of light-emitting diode (LED) packaging includes coupling a number of LED dies to corresponding bonding pads on a sub-mount. A mold apparatus having concave recesses housing LED dies is placed over the sub-mount. The sub-mount, the LED dies, and the mold apparatus are heated in a thermal reflow process to bond the LED dies to the bonding pads. Each recess substantially restricts shifting of the LED die with respect to the bonding pad during the heating.

Abstract: A motor stator includes a stator unit and at least one auxiliary unit. The stator unit includes a circuit substrate, and a plurality of spaced-apart induction coils embedded within the circuit substrate. The auxiliary unit includes an auxiliary coil attached to and disposed outwardly of the circuit substrate.

Abstract: An apparatus includes a process chamber configured to perform an ion implantation process. A cooling platen or electrostatic chuck is provided within the process chamber. The cooling platen or electrostatic chuck is configured to support a semiconductor wafer. The cooling platen or electrostatic chuck has a plurality of temperature zones. Each temperature zone includes at least one fluid conduit within or adjacent to the cooling platen or electrostatic chuck. At least two coolant sources are provided, each fluidly coupled to a respective one of the fluid conduits and configured to supply a respectively different coolant to a respective one of the plurality of temperature zones during the ion implantation process. The coolant sources include respectively different chilling or refrigeration units.

Abstract: An embodiment of the disclosure includes a method of fabricating a plurality of light emitting diode devices. A plurality of LED dies is provided. The LED dies are bonded to a carrier substrate. A patterned mask layer comprising a plurality of openings is formed on the carrier substrate. Each one of the plurality of LED dies is exposed through one of the plurality of the openings respectively. Each of the plurality of openings is filled with a phosphor. The phosphor is cured. The phosphor and the patterned mask layer are polished to thin the phosphor covering each of the plurality of LED dies. The patterned mask layer is removed after polishing the phosphor.

Abstract: The present disclosure provides a method of patterning a phosphor layer on a light emitting diode (LED) emitter. The method includes providing at least one LED emitter disposed on a substrate; forming a polymer layer over the at least one LED emitter; providing a mask over the polymer layer and the at least one LED emitter; etching the polymer layer through the mask to expose the at least one LED emitter within a cavity having polymer layer walls; and coating the at least one LED emitter with phosphor.

Abstract: A method includes providing an LED element including a substrate and a gallium nitride (GaN) layer disposed on the substrate. The GaN layer is treated. The treatment includes performing an ion implantation process on the GaN layer. The ion implantation process may provide a roughened surface region of the GaN layer. In an embodiment, the ion implantation process is performed at a temperature of less than approximately 25 degrees Celsius. In a further embodiment, the substrate is at a temperature less than approximately zero degrees Celsius during the ion implantation process.

Abstract: A method of forming a through-silicon-via (TSV) opening includes forming a TSV opening through a substrate. A recast of a material of the substrate on sidewalls of the TSV opening is removed with a first chemical. The sidewalls of the TSV opening are cleaned with a second chemical by substantially removing a residue of the first chemical.

Abstract: An embodiment of the disclosure includes a method of fabricating a plurality of light emitting diode devices. A plurality of LED dies is provided. The LED dies are bonded to a carrier substrate. A patterned mask layer comprising a plurality of openings is formed on the carrier substrate. Each one of the plurality of LED dies is exposed through one of the plurality of the openings respectively. Each of the plurality of openings is filled with a phosphor. The phosphor is cured. The phosphor and the patterned mask layer are polished to thin the phosphor covering each of the plurality of LED dies. The patterned mask layer is removed after polishing the phosphor.

Abstract: A motor stator includes an insulating frame having a plurality of projecting rods, an induction unit, and a plurality of conductive members. The induction unit includes an induction circuit board, a plurality of induction coils embedded within the induction circuit board, and a plurality of coil windings wound respectively on the projecting rods. The conductive members extend through the insulating frame and the induction circuit board for establishing an electrical connection between each of the induction coils and a corresponding one of the coil windings. The turn numbers of the coil windings are not limited by the area and thickness of the induction circuit board, and can be increased. Alternatively, the coil windings may be positioned to increase the magnetic pole slot number when energized. As such, a driving force of the motor stator can be increased.

Abstract: A motor stator includes a stator unit and an auxiliary induction unit. The stator unit includes a circuit substrate, and a plurality of induction coils embedded within the circuit substrate. The auxiliary induction unit includes an insulating member, a magnetic conductor, and at least one coil winding assembly. The coil winding assembly includes a conductive rod and an auxiliary coil. The rod has an insert rod section extending through the magnetic conductor, the insulating member, and the circuit substrate, and a wound rod section permitting the auxiliary coil to be wound thereon, such that the auxiliary coil is disposed outwardly of the magnetic conductor. During assembly, the induction coil assembly is mounted to the magnetic conductor, and the insulating member is superposed on the circuit substrate. Subsequently, the rod is inserted through the insulating member and into the circuit substrate.

Abstract: A motor stator includes a stator unit and at least one auxiliary unit. The stator unit includes a circuit substrate, and a plurality of spaced-apart induction coils embedded within the circuit substrate. The auxiliary unit includes an auxiliary coil attached to and disposed outwardly of the circuit substrate.

Abstract: An optical emitter includes a Light-Emitting Diode (LED) on a package wafer, transparent insulators, and one or more transparent electrical connectors between the LED die and one or more contact pads on the packaging wafer. The transparent insulators are deposited on the package wafer with LED dies attached using a lithography or a screen printing method. The transparent electrical connectors are deposited using physical vapor deposition, chemical vapor deposition, spin coating, spray coating, or screen printing and may be patterned using a lithography process and etching.

Abstract: Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.

Abstract: Optical emitters are fabricated by forming and shaping photoresist reflectors on a package wafer using lithography processes, and bonding Light-Emitting Diode (LED) dies to the package wafer.

Abstract: A secure erase system for a solid state memory device is disclosed. A memory area provides a data block for storing data and a key block for storing at least one key. A translation unit maps a logical address to a physical address associated with the memory area. An encryption unit encrypts plaintext data to be written to the memory area with the associated key and decrypts the encrypted data to be read by a host with the associated key. The key associated with a logical erase group to be secure erased is deleted after receiving a command requesting to erase the data associated with the logical erase group.

Abstract: A system for screening a small molecule library with 250,000 molecules to find out a compound of an anti-hypertensive drug aiming at human Angiotensin II type IA receptor is provided. The system includes a first database having a three-dimensional structure datum of a human Angiotensin II type IA receptor, a second database having molecular data of a plurality of small molecules, and a computer acquiring the three-dimensional structure datum and the molecular data from the first database and the second database respectively, wherein the computer has a molecular docking software for calculating a free energy of the human Angiotensin II type IA receptor bound to each of the plurality of small molecules, ranks the plurality of small molecules according to the respective free energy so as to select a top small molecule in the ranking as the compound of the drug.

Abstract: A fan device includes: a fan housing configured with a receiving space defined among opposite top and bottom walls, and a surrounding side wall; and a fan impeller mounted in the receiving space, disposed adjacent to an air outlet in the top wall and operable to rotate about a central axis transverse to the top and bottom walls of the fan housing. The fan impeller includes a hub body disposed coaxially with the central axis, and a plurality of angularly spaced apart fan blades extending outwardly and radially from the hub body. An angular distance between each adjacent pair of the fan blades is different from that of any other adjacent pair of the fan blades.

Abstract: A fan device includes: a fan housing configured with a receiving space defined among opposite top and bottom walls, and a surrounding side wall; a fan impeller mounted in the receiving space, disposed adjacent to an air outlet in the top wall and operable to rotate about a central axis transverse to the top and bottom walls of the fan housing; and an air-guiding unit mounted fixedly in the receiving space and disposed adjacent to an air inlet in the bottom wall. The air-guiding unit includes a central connecting member disposed axially with the central axis, and a plurality of angularly spaced apart air-guiding blades interconnecting the central connecting member and the surrounding sidewall. An angular distance between each adjacent pair of the air-guiding blades is different from that of any other adjacent pair of the air-guiding blades.

Abstract: A flash memory system includes a path selector to determine to write to a non-volatile memory, a volatile memory or both the non-volatile memory and the volatile memory when the flash memory system is to write data. A record is stored in the non-volatile memory which is updated the status of the non-volatile memory after each one or more writing operations. When the flash memory system is powered on after a power loss, it could be recovered to a command executed prior to the power loss or to any checkpoint prior to the power loss by using the record.

Abstract: A semiconductor furnace suitable for chemical vapor deposition processing of wafers. The furnace includes a thermal reaction chamber having a top, a bottom, a sidewall, and an internal cavity for removably holding a batch of vertically stacked wafers. A heating system is provided that includes a plurality of rotatable heaters arranged and operative to heat the chamber. In one embodiment, spacing between the sidewall heaters is adjustable. The heating system controls temperature variations within the chamber and promotes uniform film deposit thickness on the wafers.