Abstract: A light emitting diode (LED) includes an active layer having one or more multilayer potential barriers and at least one well layer. Each multilayer potential barrier includes interlacing first and second InAlGaN thin layers. The first and second InAlGaN thin layers have compositions selected with respect to the well layer such that a polarization effect is substantially reduced.

Abstract: An epitaxial structure of light emitting diode with a current modulation layer, and more specifically, a high-resistivity material is injected to change the current conduction path, and implementation of the main structure is to grow a high-resistivity material (e.g., InxAlyGa1-x-yN) over the N-type conductive layer or the P-type conductive layer till part of current conduction path is exposed through high-temperature H2 in-situ etching in the reacting furnace and to grow the N-type or the P-type conductive layer for coverage. This design for forming a current modulation layer without second epitaxial growth provides the injected current with a better spreading path in the N-type conductive layer and the P-type conductive layer, which more effectively and uniformly injects the current to the active layer and improves luminous efficiency.

Abstract: An image monitoring apparatus includes a casing, a camera module in the casing, and a lighting module disposed on the casing and located above or under the camera module on a plane corresponding to a vertical angle of view of the camera module. A horizontal light-emitting plane of a LED of the lighting module is perpendicular to the plane corresponding to the vertical angle of view. A lens of the lighting module covers the LED and has a convex light-exit surface, a bottom surface, and a concave light-entrance surface. A long axis of the convex light-exit surface is located at the horizontal light-emitting plane. A section thickness of the lens from the concave light-entrance surface to the convex light-exit surface along the long axis is greater than a section thickness of the lens from the concave light-entrance surface to the convex light-exit surface along a normal of the bottom surface.

Abstract: A slide rail assembly for a rack system is installed to a chassis. The chassis includes a first chassis and a second chassis. The slide rail assembly includes an outer rail and an inner rail. The inner rail is movably connected to the outer rail. The first chassis of the chassis is installed to the inner rail, and the second chassis of the chassis is movably connected to the inner rail. The second chassis is movable relative to the first chassis to adjust the total length of the chassis.

Abstract: A method for manufacturing a structure having an air gap includes following steps. A plurality of patterns is formed in a pattern region of a substrate. A sacrificial layer is formed on the substrate, and a top surface of the sacrificial layer is lower than a top surface of the patterns to expose a plurality of upper portions of the patterns. A hard mask layer is formed to cover the sacrificial layer and the upper portions of the patterns. An etching-back process is performed to the hard mask layer to expose the sacrificial layer outside the pattern region, and the hard mask layer remaining inside the pattern region seals the opening between the upper portions of the patterns. The sacrificial layer is removed to form an air gap between the two adjacent patterns.

Abstract: A nitride light-emitting diode including: a substrate with sub-micro patterns over the surface, which is divided into a growth region and a non-growth region; a growth blocking layer, formed in the non-growth region of the substrate for blocking epitaxial growth in the non-growth region of the substrate; a light-emitting epitaxial layer, comprising an n-type layer, a light-emitting layer and a p-type layer, formed in the growth region of the substrate, which extends to the non-growth region through lateral epitaxy and covers the growth blocking layer; wherein, the refractive index of the growth blocking layer is less than that of the light-emitting epitaxial layer and the growth blocking layer forms undulating morphology along the sub-micro patterns of the substrate, thus increasing light extraction interface of LED, generating refractive index difference between the light-emitting epitaxial layer and the light extraction interface and improving light extraction efficiency.

Abstract: An epitaxial structure of light emitting diode with a current modulation layer, and more specifically, a high-resistivity material is injected to change the current conduction path, and implementation of the main structure is to grow a high-resistivity material (e.g., InxAlyGa1-x-yN) over the N-type conductive layer or the P-type conductive layer till part of current conduction path is exposed through high-temperature H2 in-situ etching in the reacting furnace and to grow the N-type or the P-type conductive layer for coverage. This design for forming a current modulation layer without second epitaxial growth provides the injected current with a better spreading path in the N-type conductive layer and the P-type conductive layer, which more effectively and uniformly injects the current to the active layer and improves luminous efficiency.

Abstract: A method for manufacturing a structure having an air gap includes following steps. A plurality of patterns is formed in a pattern region of a substrate. A sacrificial layer is formed on the substrate, and a top surface of the sacrificial layer is lower than a top surface of the patterns to expose a plurality of upper portions of the patterns. A hard mask layer is formed to cover the sacrificial layer and the upper portions of the patterns. An etching-back process is performed to the hard mask layer to expose the sacrificial layer outside the pattern region, and the hard mask layer remaining inside the pattern region seals the opening between the upper portions of the patterns. The sacrificial layer is removed to form an air gap between the two adjacent patterns.

Abstract: A foldable electronic device includes a first body, a second body and a hinge body. The hinge body is pivoted to the first body around a first pivoting axis and pivoted to the second body around a second pivoting axis so that the first body is able to rotate relatively to the second body. When the first body rotates to a first position relatively to the second body, a first front surface of the first body is closed to a second front surface of the second body on a closing plane, and a pivoting plane where the first pivoting axis and the second pivoting axis are located on and the closing plane are oblique to each other.

Abstract: A slide rail assembly for a rack system is installed to a chassis. The chassis includes a first chassis and a second chassis. The slide rail assembly includes an outer rail and an inner rail. The inner rail is movably connected to the outer rail. The first chassis of the chassis is installed to the inner rail, and the second chassis of the chassis is movably connected to the inner rail. The second chassis is movable relative to the first chassis to adjust the total length of the chassis.

Abstract: An integrated controller for electronic apparatuses includes a host and an AC/DC converting module. The host includes at least one power terminal set to connect to an electronic apparatus. The power terminal set includes a power input terminal, a power output terminal and a power neutral terminal. The power input terminal is connected to a fire wire to receive AC power. The power output terminal is connected to a wire-input end of the electronic apparatus, and the power neutral terminal is connected to a wire-output end of the electronic apparatus. Therefore, the AC/DC converting module receives the AC power via the power input terminal and the power neutral terminal and converts the AC power to DC power which is required by the integrated controller. The integrated controller is mounted in an original position for a wall-embedded switch is positioned to replace the wall-embedded switch.

Abstract: A method for setting system configuration of a computer connected with a one-to-many wireless device group during booting of the computer is provided. The wireless device group includes a wireless connector electrically connected to the computer and a wireless input device and a wireless audio device: The method of the invention comprises the steps of: setting the wireless connector in a first state to form wireless connection with the wireless input device; performing system configuration setup by a user through the wireless input device after the computer has loaded a Basic Input/Output System to perform Power-On Self Test and judge that the first state conforms to a test threshold; and triggering the wireless connector to switch to a second state of forming wireless connection with the wireless input device and wireless audio device so that the computer can transmit audio data to the wireless audio device through the wireless connector.

Abstract: A lighting emitting diode including: an n side layer and a p side layer formed by nitride semiconductors respectively; an active layer comprising a nitride semiconductor is between the n side layer and the p side layer; wherein, the n-side layer is successively laminated by an extrinsically-doped buffer layer and a compound multi-current spreading layer; the compound multi-current spreading layer is successively-laminated by a first current spreading layer, a second current spreading layer and a third current spreading layer; the first current spreading layer and the third current spreading layer are alternatively-laminated layers comprising a u-type nitride semiconductor layer and an n-type nitride semiconductor layer; the second current spreading layer is a distributed insulation layer formed on the n-type nitride semiconductor layer; and the first current spreading layer is adjacent to the extrinsically-doped buffer layer; and the third current spreading layer is adjacent to the active layer.

Abstract: Disclosed are a light emitting diode having an n-doped ohm contact buffer layer and a manufacturing method therefor. In the present invention, a highly n-doped ohm contact buffer layer with an electronic concentration up to 1×1018 cm3 is formed on the n side of a light emitting epitaxy layer; when a growth substrate is removed, the n-type ohm contact buffer layer on the surface is exposed, which is a no-nitride polarity-face n-type GaN base material with a lower energy gap; an n-type ohm contact electrode is prepared on the n-type ohm contact buffer layer and follows the Ti/Al ohm contact electrode, which can overcome the problem of the existing vertical gallium nitride-based vertical light emitting diode that the voltage of the thin film GaN base light emitting device is unreliable because the ohm contact electrode on the nitride-face GaN base semiconductor layer is easy to crack due to temperature.

Abstract: A slide assembly includes a first rail, a second rail, a stop member and a friction member. The first rail includes two sidewalls with a connection wall connected therebetween. The second rail is slidably located between the two sidewalls of the first rail. The stop member is fixed to the connection wall and has a stop plate which is perpendicular to the connection wall. The friction member is fixed to the second rail and has an extension portion. The extension portion has a guide face. When the second rail is moved relative to the first rail after the friction member touches the stop plate and overlaps the stop member by the guide face, the friction member is slidably and flexibly in contact with the stop plate.

Abstract: An electronic device including a first body and a second body is provided. The first body has a first connection end. The second body has a second connection end, in which the second connection end has a first magnetic component and a first convex arc surface, and the second body is detachably connected to the first body through a magnetic attractive force between the first magnetic component and the first connection end. The first body and the second body are configured to rotate around a rotation axis relatively to each other, and the first convex arc surface faces the first connection end and extends along a direction parallel to the rotation axis.

Abstract: A slide assembly includes a first rail, a second rail, a stop member and a friction member. The first rail includes two sidewalls with a connection wall connected therebetween. The second rail is slidably located between the two sidewalls of the first rail. The stop member is fixed to the connection wall and has a stop plate which is perpendicular to the connection wall. The friction member is fixed to the second rail and has an extension portion. The extension portion has a guide face. When the second rail is moved relative to the first rail after the friction member touches the stop plate and overlaps the stop member by the guide face, the friction member is slidably and flexibly in contact with the stop plate.

Abstract: A nitride light-emitting diode is provided including a current spreading layer. The current spreading layer includes a first layer having a plurality of distributed insulating portions configured to have electrical current flow therebetween; and a second layer including interlaced at least one substantially undoped nitride semiconductor layer and at least one n-type nitride semiconductor layer configured to spread laterally the electrical current from the first layer.

Abstract: An electronic device including a conductive casing, a conductive sheet, a conductive elastic pad, a circuit board and a sound output unit is provided. The conductive casing has an inner surface and a plurality of through holes extended from the inner surface to the outside of the conductive casing to pass through the conductive casing. The conductive sheet is disposed on the inner surface and covers part of the through holes. The conductive elastic pad is disposed in the conductive casing and contacts the conductive sheet. The circuit board is disposed in the conductive casing and connected with the conductive elastic pad. The sound output unit is disposed in the conductive casing and electrically connected to the circuit board. The sound output unit is adapted to output a sound transmitted to the outside of the electronic device by another part of the through holes. A conductive structure is also provided.

Abstract: An electronic device is provided, which includes a display, a housing and a supporting structure. The display is disposed in the housing and a side of the housing opposite to the display has a storeroom. The supporting structure is disposed at the storeroom and has a flexible sheet, a first supporting-part and a second supporting-part. One end of the flexible sheet is fixed to the storeroom, the first supporting-part and the second supporting-part are respectively disposed at the flexible sheet, and the second supporting-part is bent relatively to the first supporting-part through the flexible sheet so as to provide the housing with a supporting force.