Abstract: A package structure includes a frontside redistribution layer (RDL) structure with a recessed portion, a lower encapsulation layer on the frontside RDL structure and a plurality of through vias connected to the frontside RDL structure to an upper package, a first semiconductor die on the frontside RDL structure and in the lower encapsulation layer, and an integrated passive device (IPD) connected to the frontside RDL structure in the recessed portion that connects to the first semiconductor die. A method of forming a package structure includes forming a molded portion with a lower encapsulation layer, a plurality of through vias in the lower encapsulation layer and a first semiconductor die in the lower encapsulation layer, forming a RDL structure with a recessed portion on the molded portion, the plurality of through vias connect the frontside RDL structure to an upper package, and attaching an IPD in the recessed portion.

Abstract: An automatic system updating apparatus and method are provided, which identifies the event of system update and collects the updating results to the allowlist. The apparatus determines whether at least one pending event intercepted from a file system belongs to a system update event based on a plurality of update rules. The apparatus executes the at least one pending event and generates at least one executable file corresponding to the at least one pending event in response to the at least one pending event belonging to the system update event, and the new generated at least one executable file is not included in an allowlist. The apparatus adds the at least one executable file corresponding to the at least one pending event to the allowlist based on a security setting.

Abstract: An ESD protection circuit is coupled to a first pad and includes an ESD detection circuit, a P-type transistor, an N-type transistor, and a discharge circuit. The ESD detection circuit determines whether an ESD event occurs on the first pad to generate a detection signal at a first node. The P-type transistor comprises a source coupled to the first pad, a drain coupled to a second node, and a gate coupled to the first node. The N-type transistor comprises a drain coupled to the second node, a source coupled to a ground, and a gate coupled to a second pad. The discharge circuit is coupled between the first pad and the ground and controlled by a driving signal at the second node. When the ESD protection circuit is in an operation mode, the first pad receives a first voltage, and a second pad receives a second voltage.

Abstract: An environment detection apparatus is provided. In one embodiment, the detection apparatus comprises: a first sensing device, a second sensing device in fluid communication with the first sensing device and a spectrum analyzer electrically connected to the first sensing device and the second sensing device. The first sensing device includes a pair of first electrodes configured to provide a first alternating current signal directly to a gas flowing into the first sensing device. The second sensing device includes a first filter configured to capture a solid in the gas flowing into the second sensing device and a pair of second electrodes configured to provide a second alternating current signal directly to the first filter with the solid captured by the first filter.

Abstract: In a semiconductor package having a redistribution structure, two or more semiconductor dies are connected to a first side of the redistribution structure and an encapsulant surrounds the two or more semiconductor dies. An integrated passive device (IPD) is connected on a second side of the redistribution structure. The second side is opposite to the first side and the IPD is electrically coupled to the redistribution structure. An interconnect device is connected on the second side of the redistribution structure and is electrically coupled to the redistribution structure. Two or more external connections are on the second side of the redistribution structure and are electrically coupled to the redistribution structure.

Abstract: The present disclosure provides a low-dissipation flexible copper clad laminate, which includes a copper foil and a polyimide film. The polyimide film is attached to the copper foil. The polyimide film includes a polyimide, and the polyimide has a structure represented by formula (I). Formula (I) is defined as in the specification.

Abstract: A method for improving transmission power management with compliance to regulations of radiofrequency exposure, which may comprise: at a current time, estimating whether a window average power, which may reflect average power transmitted using a radio technology during a moving time window, will exceed a power limit after the current time; if true, proceeding to at least one of a first handling subroutine and a second handling subroutine to set a power cap, and causing power transmitted to be capped by the power cap after the current time. The first handling subroutine may comprise: scheduling to set the power cap lower at a scheduled time. Estimating whether the window average power will exceed the power limit may involve discarding one of a plurality of power records. The second handling subroutine may comprise: setting the power cap not higher than the discarded one of the plurality of power records.

Abstract: An electronic apparatus with convenient airflow-reversing function includes a chassis, a rotation mechanism, a fan device, a connection rod, and a handle. The chassis includes a bottom plate. The rotation mechanism is pivoted on the bottom plate. The fan device is disposed on the rotation mechanism. The connection rod is pivoted on the rotation mechanism. The handle is pivoted on the chassis, and is rotatably connected to the connection rod. When the handle is rotated, the connection rod drives the rotation mechanism and the fan device to rotate to change the airflow direction.

Abstract: A semiconductor structure includes a substrate, a conductive region, a first insulation layer, a second insulation layer, a gate structure, a low-k spacer, a gate contact, and a conductive region contact. The low-k spacer is formed between a sidewall of the gate structure and the first insulation layer. The gate contact is landed on a top surface of the gate structure. A proximity distance between a sidewall of the gate contact and the conductive region contact along a top surface of the second insulation layer is in a range of from about 4 nm to about 7 nm. A method for manufacturing a semiconductor structure is also provided.

Abstract: Disclosed herein, among other things, are systems and methods for temperature detection for hearing device applications. A method includes obtaining a first temperature measurement from a first sensor from a first side of a housing of a hearing device, and obtaining a second temperature measurement from a second sensor from a second side of the housing. The first temperature measurement is compared to the second temperature measurement, and a determination is made whether the hearing device is positioned on a right side or a left side of a wearer of the hearing device, based on the comparison. The hearing device is configured as a right device or a left device based on the determination.

Abstract: An electronic device includes a battery module, a battery connector and a controller is provided. The battery connector includes a first connector and a second connector. The first connector is installed on the battery module and includes a first metal component and an enable pin. The first metal component is disposed on a housing of the first connector and is coupled to the enable pin. The second connector includes a second metal component, a detection pin and a ground pin. The second metal component is disposed on a housing of the second connector. The detection pin is coupled to the second metal component. The ground pin is coupled to a ground potential and its position corresponds to the position of the enable pin. The controller determines a connection status of the first connector and the second connector according to an external signal on the detection pin.

Abstract: A method includes forming a metal pad, depositing a passivation layer on the metal pad, and planarizing the passivation layer, so that the passivation layer includes a planar top surface. The method further includes etching the passivation layer to form an opening in the passivation layer, wherein the metal pad is exposed to the opening, and forming a conductive via including a lower portion in the opening, and an upper portion higher than the passivation layer. A polymer layer is then dispensed to cover the conductive via.

Abstract: A support structure including a first bracket, a second bracket, and at least one elastic member is provided. The first bracket includes multiple first alignment hole groups. The second bracket is detachably connected to the first bracket along a first axis. The second bracket includes multiple second alignment hole groups. The second bracket is adapted to slide relative to the first bracket along the first axis to change a length of the support structure along the first axis. The at least one elastic member is detachably connected to the first bracket and the second bracket. When the second bracket is connected to the first bracket, at least one of the first alignment hole groups is aligned with at least one of the second alignment hole groups to form at least one insertion space. A portion of the at least one elastic piece is located in the corresponding at least one insertion space and connected to the first bracket and the second bracket.

Abstract: A method for performing mapping between one or more radio modules and one or more radiofrequency (RF) groups includes: separating the one or more radio modules into the one or more RF groups according to one or more messages, wherein the one or more messages comprise a previous TX power ratio, a TX power ratio margin, one or more weighting information, one or more TX performance indices, one or more receiving (RX) performance indices, one or more configurations, or one or more usage scenarios; accumulating RF exposure of the one or more radio modules to at least one RF group among the one or more RF groups; and determining at least one transmitting (TX) power limit corresponding to the at least one RF group according to accumulated RF exposure of the at least one RF group.

Abstract: A method for dynamically allocating radio frequency (RF) exposure across multiple RF groups including a first RF group and a second RF group includes: estimating RF exposure of the first RF group according to at least one message of the first RF group, in order to generate estimated RF exposure; calculating RF exposure of the second RF group according to at least one message of the second RF group, the estimated RF exposure, and one or more equations, in order to generate calculated RF exposure, wherein the one or more equations are associated with a predetermined regulation; and determining a TX power limit corresponding to the first RF group and a TX power limit corresponding to the second RF group according to the estimated RF exposure and the calculated RF exposure, respectively.

Abstract: A composite film includes a first thermoplastic elastomer film layer and a second thermoplastic elastomer film layer, wherein the first thermoplastic elastomer film layer includes a first styrenic block copolymer. The second thermoplastic elastomer film layer is disposed on the first thermoplastic elastomer film layer, wherein the second thermoplastic elastomer film layer includes a second styrenic block copolymer, diffusion particles dispersed in the second thermoplastic elastomer film layer, and a surface microstructure disposed on the surface of the second thermoplastic elastomer film layer.

Abstract: A reservoir device, comprises a first transistor and a second transistor. A gate of the first transistor is coupled to a write word line, a drain of the first transistor is coupled to a write bit line. A source of the second transistor is coupled to a read source line, a drain of the second transistor is coupled to a read bit line, and a gate of the second transistor is coupled to a source of the first transistor. A storage node is located on a coupling point between the gate of the second transistor and the source of the first transistor. The reservoir device selectively performs a write operation, a read operation or a refresh operation in response to an input voltage received by the write word line, the write bit line, the read source line and the read bit line respectively.

Abstract: An electrostatic field strength measuring apparatus includes an electrostatic field detection device and a processor. The electrostatic field detection device includes a ring light source configured to emit a light signal to a target object, and a reflection detector disposed within and surrounded by the ring light source and configured to receive a reflection signal, of the light signal, reflected by a surface of the target object and generate an electrical signal based upon the reflection signal. The processor is configured to determine, based upon the electrical signal, measures of electrostatic field strength at the surface of the target object.

Abstract: An electrostatic discharge (ESD) protection structure including a P-type substrate, a P-type structure, an N-type buried layer, an element active region, a P-type guard ring, and an N-type structure is provided. The P-type structure is formed in the P-type substrate and serves as an electrical contact of the P-type substrate. The N-type buried layer is formed in the P-type substrate. The element active region is formed on the N-type buried layer. The P-type guard ring is formed on the N-type buried layer and surrounds the element active region. The N-type structure is formed on the N-type buried layer and disposed between the P-type guard ring and the P-type structure.

Abstract: An indoor occupancy distribution analysis system is provided, which includes a base station and a network management device that communicate with each other. The base station is configured to collect performance indicators corresponding to each user equipment from the base station. The performance indicators are associated with the communication between the user equipment and the base station. The network management device is configured to receive these performance indicators, input them into a classifier, obtain the inference result output by the classifier, and derive occupancy distribution from the inference result.