Patents by Inventor Hsuan Lin
Hsuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12260917Abstract: A storage device for generating an identity code, includes a first storage circuit, a second storage circuit and a reading circuit. The first storage circuit stores several first data having several bits. The second storage circuit stores several second data having several bits. The reading circuit reads the second data from the second storage circuit to form a first sequence, and simultaneously reads the first data from the first storage circuit to form a second sequence. The reading circuit includes a processing circuit which simultaneously receives the first sequence and the second sequence, selects a first portion of the second sequence to form a target sequence according to the first sequence, and outputs the target sequence to serve as an identity code. Logical values of the bits of the first data and the second data are randomly distributed or pre-defined by a user.Type: GrantFiled: April 1, 2024Date of Patent: March 25, 2025Assignee: MACRONIX INTERNATIONAL CO., LTD.Inventors: Yu-Hsuan Lin, Dai-Ying Lee, Ming-Hsiu Lee
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Patent number: 12260913Abstract: A hyperdimensional computing device includes a non-volatile memory cell array and a first operation circuit. The non-volatile memory cell array is coupled to a plurality of first word lines. The non-volatile memory cell array has a plurality of memory cell groups, a plurality of first memory cells of each of the memory cell groups are coupled to a same first word line of the first word lines, and the memory cell groups respectively store a plurality of data vectors. The first operation circuit receives at least one of the data vectors through bit lines and generates a bundled data vector according to the at least one of the data vectors.Type: GrantFiled: February 9, 2023Date of Patent: March 25, 2025Assignee: MACRONIX International Co., Ltd.Inventors: Yu-Hsuan Lin, Po-Hao Tseng
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Publication number: 20250095720Abstract: A memory device includes a first memory cell performing a logic operation. The first memory cell includes first and second switches. The first switch writes a first weight bit into a first storage node. The second switch generates a first current signal according to the first weight bit and a first input bit. The second switch receives a first bit line signal carrying the first input bit and a first word line signal. A control terminal of the second switch is coupled to the first storage node. When the first input bit has a first logic value, the first bit line signal and the first word line signal has a first voltage level. When the first input bit has a second logic value, the first bit line signal has a second voltage level smaller than the first voltage level.Type: ApplicationFiled: September 19, 2023Publication date: March 20, 2025Inventors: Yu-Hsuan LIN, Yu-Yu LIN, Feng-Min LEE
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Publication number: 20250091267Abstract: The present invention provides a manufacturing method for a stopper used in medical containers, the stopper having a septum and a housing supporting the septum, the manufacturing method comprising firstly creating the septum using a first molding process with a thermoplastic elastomer composition; then creating the housing using a second molding process with a plastic composition, by the second molding process the septum being pre-compressed in a radial direction perpendicular to a needle penetration direction of the septum; and subjecting the stopper to a steam sterilization, wherein after the septum experiences the steam sterilization, the septum exhibits a residual pre-compression level of 12% to 30% in the radial direction compared to when the septum is uncompressed, and the residual pre-compression level is measured based on a thickness or average diameter of the septum.Type: ApplicationFiled: September 13, 2024Publication date: March 20, 2025Applicant: TSRC CorporationInventors: Yuanpang Samuel Ding, Chien-Liang Chou, Ching-Han Kuo, Pang-Hsuan Lin
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Publication number: 20250080978Abstract: A method for secure data transmission is provided. The method includes requesting a key from an encryption and decryption application in a near real-time radio access network (RAN) intelligent controller (Near-RT RIC). The method includes receiving the key from the encryption and decryption application. The method includes encrypting data by using the key, and generating encrypted data. The method includes storing the encrypted data to a database in the Near-RT RIC through a shared data layer.Type: ApplicationFiled: December 11, 2023Publication date: March 6, 2025Inventors: Pei-Hsuan LIN, Wei-Chuang HUANG
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Patent number: 12242321Abstract: The disclosure provides a power management method. The power management method is applicable to an electronic device. The electronic device is electrically coupled to an adapter, and includes a system and a battery. The adapter has a feed power. The battery has a discharge power. The power management method of the disclosure includes: reading a power value of the battery; determining a state of the system; and discharging power to the system, when the system is in a power-on state and the power value is greater than a charging stopping value, by using the battery, and controlling, according to the discharge power and the feed power, the adapter to selectively supply power to the system. The disclosure further provides an electronic device using the power management method.Type: GrantFiled: April 27, 2023Date of Patent: March 4, 2025Assignee: ASUSTEK COMPUTER INC.Inventors: Wen Che Chung, Hui Chuan Lo, Hao-Hsuan Lin, Chun Tsao, Jun-Fu Chen, Ming-Hung Yao, Jia-Wei Zhang, Kuan-Lun Chen, Ting-Chao Lin, Cheng-Yen Lin, Chunyen Lai
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Publication number: 20250067943Abstract: An image sensing module includes: a substrate; an optical sensing element disposed on the substrate; and a light-guide component disposed on the optical sensing element, and including a first light adjusting layer and a second light adjusting layer. The second light adjusting layer is disposed on the first light adjusting layer. The first light adjusting layer has a first light transmitting region, and the second light adjusting layer has a second light transmitting region. The first light transmitting region and the second light transmitting region are disposed corresponding to the optical sensing element.Type: ApplicationFiled: November 20, 2023Publication date: February 27, 2025Inventors: Yi-Hsuan LIN, Chi-Wen CHEN, Craig Thomas JOHNSON
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Publication number: 20250066899Abstract: A method includes: positioning a wafer on an electrostatic chuck of a physical vapor deposition apparatus, the wafer including an opening exposing a conductive feature; setting a temperature of the wafer to a room temperature; forming a tungsten thin film in the opening by the physical vapor deposition apparatus, the tungsten thin film including a bottom portion that is on an upper surface of the conductive feature exposed by the opening, a top portion that is on an upper surface of a dielectric layer through which the opening extends and a sidewall portion that is on a sidewall of the dielectric layer exposed by the opening; removing the top portion and the sidewall portion of the tungsten thin film from over the opening; and forming a tungsten plug in the opening on the bottom portion by selectively depositing tungsten by a chemical vapor deposition operation.Type: ApplicationFiled: August 23, 2023Publication date: February 27, 2025Inventors: Chun-Yen LIAO, I. LEE, Shu-Lan CHANG, Sheng-Hsuan LIN, Feng-Yu CHANG, Wei-Jung LIN, Chun-I TSAI, Chih-Chien CHI, Ming-Hsing TSAI, Pei Shan CHANG, Chih-Wei CHANG
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Publication number: 20250062147Abstract: A semiconductor processing system includes a first semiconductor processing site and a second semiconductor processing site. The system includes an unmanned electric vehicle configured to carry a portable cleanroom stocker between the first and second semiconductor processing sites. The portable cleanroom stocker is configured to maintain cleanroom conditions within the portable cleanroom stocker during transportation.Type: ApplicationFiled: November 1, 2024Publication date: February 20, 2025Inventors: Rong Syuan FAN, Jen-Yuan CHANG, Mei-Hsuan LIN
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Publication number: 20250062202Abstract: A semiconductor die and methods of forming the same and a package structure are provided. The semiconductor die includes a semiconductor substrate, a plurality of conductive pads over the semiconductor substrate, a passivation layer over the semiconductor substrate and partially covering the plurality of conductive pads, an interconnecting line disposed on the passivation layer, and a plurality of connectors disposed on and electrically connected to the plurality of conductive pads. Each of the plurality of connectors includes a stacked structure of a first conductive pillar and a second conductive pillar disposed directly on the first conductive pillar, wherein a span of the second conductive pillar is smaller than a span of the first conductive pillar, and an orthogonal projection of the second conductive pillar falls within an orthogonal projection of the first conductive pillar, and the interconnecting line is located beside and spaced apart from the plurality of connectors.Type: ApplicationFiled: August 17, 2023Publication date: February 20, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Yi Sung, Ta-Hsuan Lin, Hua-Wei Tseng, Mill-Jer Wang
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Publication number: 20250063783Abstract: A device includes a fin extending from a semiconductor substrate, a gate stack over and along a sidewall of the fin, an isolation region surrounding the gate stack, an epitaxial source/drain region in the fin and adjacent the gate stack, and a source/drain contact extending through the isolation region, including a first silicide region in the epitaxial source/drain region, the first silicide region including NiSi2, a second silicide region on the first silicide region, the second silicide region including TiSix, and a conductive material on the second silicide region.Type: ApplicationFiled: November 5, 2024Publication date: February 20, 2025Inventors: Yan-Ming Tsai, Chih-Wei Chang, Ming-Hsing Tsai, Sheng-Hsuan Lin, Hung-Hsu Chen, Wei-Yip Loh
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Patent number: 12218012Abstract: A semiconductor device with multiple silicide regions is provided. In embodiments a first silicide precursor and a second silicide precursor are deposited on a source/drain region. A first silicide with a first phase is formed, and the second silicide precursor is insoluble within the first phase of the first silicide. The first phase of the first silicide is modified to a second phase of the first silicide, and the second silicide precursor being soluble within the second phase of the first silicide. A second silicide is formed with the second silicide precursor and the second phase of the first silicide.Type: GrantFiled: July 27, 2023Date of Patent: February 4, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wei-Yip Loh, Yan-Ming Tsai, Hung-Hsu Chen, Chih-Wei Chang, Sheng-Hsuan Lin
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Patent number: 12198766Abstract: An artificial neural network operation circuit and an in-memory computation device of the artificial neural network operation circuit are proposed. The in-memory computation device includes a memory cell array, a compensation memory cell string, and an operator. The memory cell array has a plurality of memory cells to store a plurality of weight values. The memory cell array has a plurality of word lines and a plurality of bit lines. Each compensation memory cell of the compensation memory cell string stores a unit weight value. The operator multiplies a signal on a compensation bit line by peak weight information of the weight values to generate a first signal and adds the first signal to each signal on the bit lines to obtain a plurality of computation results, respectively.Type: GrantFiled: February 22, 2023Date of Patent: January 14, 2025Assignee: Macronix International Co., Ltd.Inventors: Yu-Hsuan Lin, Yu-Yu Lin, Hsiang-Lan Lung
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Patent number: 12191199Abstract: The present disclosure describes a method to a metallization process with improved gap fill properties. The method includes forming a contact opening in an oxide, forming a barrier layer in the contact opening, forming a liner layer on the barrier layer, and forming a first metal layer on the liner layer to partially fill the contact opening. The method further includes forming a second metal layer on the first metal layer to fill the contact opening, where forming the second metal layer includes sputter depositing the second metal layer with a first radio frequency (RF) power and a direct current power, as well as reflowing the second metal layer with a second RF power.Type: GrantFiled: March 29, 2021Date of Patent: January 7, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Tien-Pei Chou, Ken-Yu Chang, Sheng-Hsuan Lin, Yueh-Ching Pai, Yu-Ting Lin
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Publication number: 20250008173Abstract: The present disclosure relates to a system and a method for distributor analysis. The method includes: determining a first group of distributors corresponding to a first range of achievement scores; determining a second group of distributors corresponding to a second range of achievement scores; comparing a value of a stream parameter of a distributor from the second group of distributors with an average value of the stream parameter of the first group of distributors; and informing the distributor of a result of the comparing process.Type: ApplicationFiled: December 1, 2023Publication date: January 2, 2025Inventors: Jayneel PAWAR, Hemant MEHTA, Uday Kumar EDUDULA, Ajay Prakash MANGALE, Shih-Che TSENG, Tze-Hsuan LIN, Shao-Tang CHIEN, Chi-Wei LIN, Hsuan MO, Yung-Chi HSU
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Patent number: 12182701Abstract: The present invention discloses a memory and a training method for neural network based on memory. The training method includes: obtaining one or more transfer functions of a memory corresponding to one or more influence factors; determining a training plan according to an ideal case and the one or more influence factors; training the neural network according to the training plan and the one or more transfer functions to obtain a plurality of weights of the trained neural network; and programming the memory according to the weights.Type: GrantFiled: July 29, 2021Date of Patent: December 31, 2024Assignee: MACRONIX INTERNATIONAL CO., LTD.Inventors: Yu-Hsuan Lin, Po-Kai Hsu, Ming-Liang Wei
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Patent number: 12166078Abstract: A device includes a fin extending from a semiconductor substrate, a gate stack over and along a sidewall of the fin, an isolation region surrounding the gate stack, an epitaxial source/drain region in the fin and adjacent the gate stack, and a source/drain contact extending through the isolation region, including a first silicide region in the epitaxial source/drain region, the first silicide region including NiSi2, a second silicide region on the first silicide region, the second silicide region including TiSix, and a conductive material on the second silicide region.Type: GrantFiled: May 16, 2022Date of Patent: December 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yan-Ming Tsai, Chih-Wei Chang, Ming-Hsing Tsai, Sheng-Hsuan Lin, Hung-Hsu Chen, Wei-Yip Loh
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Patent number: 12159671Abstract: An in-dynamic memory search device and an operation method thereof are provided. The in-dynamic memory search device includes at least one word line, at least two bit lines, at least one match line, at least one unit cell, at least two search lines, at least one pre-charge unit and at least one sense unit. The unit cell includes two storage elements and two search transistors. Each of the storage elements includes a write transistor and a read transistor. The write transistor is connected to the word line and one of the bit lines. The read transistor is connected to the write transistor and the match line. The search transistors are respectively connected to the read transistors. The search lines are respectively connected to the search transistors. The pre-charge unit is connected to the match line. The sense unit is connected to the match line.Type: GrantFiled: February 6, 2023Date of Patent: December 3, 2024Assignee: MACRONIX INTERNATIONAL CO., LTD.Inventors: Po-Hao Tseng, Feng-Min Lee, Yu-Hsuan Lin
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Patent number: 12159672Abstract: A hybrid in-memory search (IMS) content addressable memory (CAM) cell includes: a first IMS CAM cell; and a second IMS CAM cell, coupled to the first IMS CAM cell. The first IMS CAM cell and the second IMS CAM cell are of different types. When the hybrid IMS CAM cell stores a storage data, the first IMS CAM cell stores a first part of the storage data and the second IMS CAM cell stores the storage data or a second part of the storage data.Type: GrantFiled: February 1, 2023Date of Patent: December 3, 2024Assignee: MACRONIX INTERNATIONAL CO., LTD.Inventors: Po-Hao Tseng, Yu-Hsuan Lin, Tian-Cih Bo, Feng-Min Lee, Yu-Yu Lin
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Publication number: 20240395611Abstract: The present disclosure describes a method to a metallization process with improved gap fill properties. The method includes forming a contact opening in a dielectric layer to expose a source/drain epitaxial layer in a substrate. An aspect ratio of the contact opening is between about 3 and about 10. The method further includes forming a first metal layer in the contact opening and in contact with the source/drain epitaxial layer, forming a barrier layer on the first metal layer, forming a liner layer on the barrier layer, forming second metal layer on the liner layer to partially fill the contact opening, and forming a third metal layer on the second metal layer to fill the contact opening.Type: ApplicationFiled: July 30, 2024Publication date: November 28, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tien-Pei CHOU, Ken-Yu CHANG, Sheng-Hsuan LIN, Yueh-Ching PAI, Yu-Ting LIN