Patents by Inventor Hsuan Lin
Hsuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240365249Abstract: A method for dynamically allocating transmitting (TX) powers to multiple TX modules of a radio module includes: for each of the multiple TX modules: mapping a radio frequency (RF) exposure limit to a TX power limit; obtaining a first TX power limit corresponding a first time interval and a second TX power limit corresponding a second time interval, wherein the first time interval is earlier than the second time interval; in response to a TX power corresponding to the first time interval being smaller than the first TX power limit, calculating and storing a value of an unused TX power corresponding the first time interval in at least one power pool within a memory; and in response to a TX power corresponding to the second time interval being larger than the second TX power limit, obtaining the value of the unused TX power from the at least one power pool.Type: ApplicationFiled: April 26, 2024Publication date: October 31, 2024Applicant: MEDIATEK INC.Inventors: Shihao Ju, Yi-Hsuan Lin
-
Publication number: 20240363723Abstract: Methods of manufacturing electronic devices are described. Embodiments of the present disclosure advantageously provide methods of manufacturing electronic devices that meet reduced thickness, reduced leakage, lower thermal budget, and Vt requirements (including multi-Vt), and have improved device performance and reliability. The method comprises forming a P-dipole stack and an N-dipole stack on a semiconductor substrate by: depositing an interfacial layer (e.g., silicon oxide (SiOx)) on the top surface of the channel; depositing a hafnium-containing layer comprising hafnium oxide (HfOx) and having a thickness of less than or equal to 5 ? on the interfacial layer; and depositing a dipole layer comprising lanthanum nitride (LaN) on the hafnium-containing layer.Type: ApplicationFiled: April 28, 2023Publication date: October 31, 2024Applicant: Applied Materials, Inc.Inventors: Srinivas Gandikota, Tengzhou Ma, Geetika Bajaj, Debaditya Chatterjee, Hsin-Jung Yu, Pei Hsuan Lin, Yixiong Yang
-
Publication number: 20240355394Abstract: A memory device and associated operation method are provided. The operation method is applied to the memory device to determine whether a search input and in-memory data are matched. The memory device includes a memory array and a control circuit, and the memory array includes M*N memory cells. The operation method includes the following steps. A select voltage is applied to an n-th word line. A pass-through voltage is applied to (N?1) word lines. A first search voltage is applied to an m-th first bit-line, and a second search voltage is applied to an m-th second bit-line. An m-th first sensing current and an m-th second sensing current bit are selectively generated. Then, a sensing circuit in the control circuit generates a sensing circuit output. The sensing circuit output represents whether the m-th first sensing current and the m-th second sensing current are generated.Type: ApplicationFiled: June 21, 2024Publication date: October 24, 2024Inventors: Po-Hao TSENG, Feng-Min LEE, Yu-Hsuan LIN
-
Publication number: 20240355740Abstract: A method includes forming a dielectric layer over a conductive feature, and etching the dielectric layer to form an opening. The conductive feature is exposed through the opening. The method further includes forming a tungsten liner in the opening, wherein the tungsten liner contacts sidewalls of the dielectric layer, depositing a tungsten layer to fill the opening, and planarizing the tungsten layer. Portions of the tungsten layer and the tungsten liner in the opening form a contact plug.Type: ApplicationFiled: June 30, 2023Publication date: October 24, 2024Inventors: Feng-Yu Chang, Sheng-Hsuan Lin, Shu-Lan Chang, Kai-Yi Chu, Meng-Hsien Lin, Pei-Hsuan Lee, Pei Shan Chang, Chih-Chien Chi, Chun-I Tsai, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai, Syun-Ming Jang, Wei-Jen Lo
-
Patent number: 12125748Abstract: The present disclosure provides embodiments of a semiconductor device. In one embodiment, the semiconductor device includes a gate structure, a source/drain feature adjacent the gate structure, a first dielectric layer over the source/drain feature, an etch stop layer over the gate structure and the first dielectric layer, a second dielectric layer over the etch stop layer, a source/drain contact that includes a first portion extending through the first dielectric layer and a second portion extending through the etch stop layer and the second dielectric layer, a metal silicide layer disposed between the second portion and etch stop layer, and a metal nitride layer disposed between the first portion and the first dielectric layer.Type: GrantFiled: July 20, 2022Date of Patent: October 22, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chih-Hsuan Lin, Xi-Zong Chen, Chih-Teng Liao
-
Patent number: 12124660Abstract: A touch apparatus includes a first conductive layer, a second conductive layer, and a third conductive layer. The first conductive layer includes a power supply electrode and a plurality of first conductive patterns. The second conductive layer includes a common electrode and a plurality of second conductive patterns. The first conductive patterns and the second conductive patterns are electrically connected to form a plurality of first conductive elements. At least one portion of the first conductive elements is first touch electrodes. The third conductive layer includes a plurality of bonding pads and a plurality of second touch electrodes. In a top view of the touch apparatus, the first touch electrodes and the second touch electrodes are staggered.Type: GrantFiled: December 29, 2023Date of Patent: October 22, 2024Assignee: AUO CorporationInventors: Tai-Hsuan Lin, Yu-Feng Chien
-
Patent number: 12114514Abstract: A memory device and a method for manufacturing the memory device are provided. The memory device includes a stack and a plurality of memory strings. The stack is disposed on the substrate, and the stack includes a plurality of conductive layers and a plurality of insulating layers alternately stacked. The memory strings pass through the stack along a first direction, wherein a first memory string in the memory strings includes a first conductive pillar and a second conductive pillar, a channel layer, and a memory structure. The first conductive pillar and the second conductive pillar respectively extend along the first direction and are separated from each other. The channel layer is disposed between the first conductive pillar and the second conductive pillar. The memory structure surrounds the second conductive pillar, and the memory structure includes a resistive memory material.Type: GrantFiled: November 27, 2023Date of Patent: October 8, 2024Assignee: MACRONIX INTERNATIONAL CO., LTD.Inventors: Feng-Min Lee, Erh-Kun Lai, Dai-Ying Lee, Yu-Hsuan Lin, Po-Hao Tseng, Ming-Hsiu Lee
-
Publication number: 20240331862Abstract: The present invention provides a data analytic scheme for screening biomarkers for differential diagnosis of the status of Parkinson's disease, Parkinson's disease with mild cognitive impairment, Parkinson's disease dementia, Alzheimer's disease, and/or multiple system atrophy, the methodology implementing the same and the results of the screening thereof. Biomedical Oriented Logistic Dantzig Selector (BOLD Selector) was developed to identify candidate microRNAs and extracellular vesicle proteins effective at discerning between any two of the above mentioned disease categories from profiling results. The prediction models are finalized by establishing logistic regression formula for each pair of patient group differentiation.Type: ApplicationFiled: March 29, 2024Publication date: October 3, 2024Inventors: Shau-Ping LIN, Ruey-Meei WU, Frederick Kin Hing Phoa, Ming-Che KUO, Yi-Tzang TSAI, Jing-Wen HUANG, Yan-Han LIN, Hsiang-Hsuan LIN WANG, Chia-Lang HSU, Ya-Fang HSU, Pin-Jui KUNG
-
Publication number: 20240328445Abstract: An anti-wear screw includes a U-shaped anti-wear clip and a locking screw. The U-shaped anti-wear clip is used to clamp on a heat dissipation substrate, and the locking screw is passed through the U-shaped anti-wear clip to fix the heat dissipation substrate. In addition, the anti-wear screw further includes a pressure spring installed between the locking screw and the U-shaped anti-wear clip to exert pressure on the U-shaped anti-wear clip and the heat dissipation substrate.Type: ApplicationFiled: November 29, 2023Publication date: October 3, 2024Inventors: Cheng-Ju CHANG, Moo-Ting CHOU, Yi-Le CHENG, Wan-Hsuan LIN, Chung-Chien SU
-
Publication number: 20240332008Abstract: Methods of manufacturing and processing semiconductor devices (i.e., electronic devices) are described. Embodiments of the disclosure advantageously provide electronic devices which meet reduced thickness, lower thermal budget, and Vt requirements, and have improved device performance and reliability. The electronic devices described herein comprise a source region, a drain region, and a channel separating the source region and the drain region, an interfacial layer on a top surface of the channel, a high-? dielectric layer on the interfacial layer, a dipole layer on the high-? dielectric layer, and a capping layer on the dipole layer. In some embodiments, the dipole layer comprises a metal oxynitride (MON), such as aluminum oxynitride (AlON). In some embodiments, the methods comprise annealing the substrate to drive atoms from the dipole layer into one or more of the interfacial layer or the high-? dielectric layer.Type: ApplicationFiled: March 27, 2023Publication date: October 3, 2024Applicant: Applied Materials, Inc.Inventors: Geetika Bajaj, Tianyi Huang, Hsin-Jung Yu, Yixiong Yang, Srinivas Gandikota, Chi-Chou Lin, Pei Hsuan Lin
-
Publication number: 20240329646Abstract: A drone monitoring and control system includes: a drone, a mobile vehicle configured to carry the drone, a computing device and a display device. The drone is disposed with an operation payload and a camera. The drone performs an output operation of the operation payload. The computing device outputs a first environment image according to a first image captured by the camera, generates a flight trajectory of the drone and a movement trajectory of the mobile vehicle according to an operation data set including a target location of a target object and 3D terrain data, controls the drone to move to a set location according to the flight trajectory, and controls the drone to stay at the set location when a distance between the target and set locations is less than a preset distance. The display device displays the first environment image and the 3D terrain data.Type: ApplicationFiled: March 27, 2024Publication date: October 3, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Yi-Yuan CHEN, Cheng-Hsuan LIN, Hsin-Tien YEH
-
Patent number: 12107415Abstract: An electrostatic discharge protection circuit is provided. The electrostatic discharge protection circuit includes first, second, and third transistors and a discharge circuit. The first transistor has a first gate, a first drain coupled to the bonding pad, and a first source coupled to a first node. The second transistor has a second gate coupled to a power terminal, a second drain coupled to the first gate, and a second source coupled to a ground. The third transistor has a third gate coupled to the power terminal, a third drain coupled to the first node, and a third source coupled to the ground. The discharge circuit is controlled by a driving voltage at the first node. In response to an electrostatic discharge event occurring on the bonding pad, the discharge circuit provides a discharge path between the bonding pad and the ground according to the driving voltage.Type: GrantFiled: November 17, 2022Date of Patent: October 1, 2024Assignee: Vanguard International Semiconductor CorporationInventors: Chih-Hsuan Lin, Shao-Chang Huang, Wen-Hsin Lin, Yeh-Ning Jou, Hwa-Chyi Chiou, Chun-Chih Chen
-
Patent number: 12094534Abstract: The application provides a content addressable memory (CAM) memory device, a CAM cell and a method for searching and comparing data thereof. The CAM device includes: a plurality of CAM cells; and an electrical characteristic detection circuit coupled to the CAM cells; wherein in data searching, a search data is compared with a storage data stored in the CAM cells, the CAM cells generate a plurality of memory cell currents, the electrical characteristic detection circuit detects the memory cell currents to generate a plurality of sensing results, or the electrical characteristic detection circuit detects a plurality of match line voltages on a plurality of match lines coupled to the CAM cells to generate the plurality of search results; and the storage data is a single-bit multi-level storage data and/or the search data is a single-bit multi-level search data.Type: GrantFiled: September 1, 2023Date of Patent: September 17, 2024Assignee: MACRONIX INTERNATIONAL CO., LTD.Inventors: Yu-Hsuan Lin, Po-Hao Tseng
-
Patent number: 12087579Abstract: A method for forming a semiconductor device includes receiving a substrate having a first opening and a second opening formed thereon, wherein the first opening has a first width, and the second opening has a second width less than the first width; forming a protecting layer to cover the first opening and expose the second opening; performing a wet etching to widen the second opening with an etchant, wherein the second opening has a third width after the performing of the wet etching, and the third width of the second opening is substantially equal to the first width of the first opening; and performing a photolithography to transfer the first opening and the second opening to a target layer.Type: GrantFiled: May 4, 2021Date of Patent: September 10, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chung-Yang Huang, Hao-Ming Chang, Ming Che Li, Yu-Hsin Hsu, Po-Cheng Lai, Kuan-Shien Lee, Wei-Hsin Lin, Yi-Hsuan Lin, Wang Cheng Shih, Cheng-Ming Lin
-
Publication number: 20240282766Abstract: A semiconductor structure including a substrate, a first well, a first doped region, a second doped region, a third doped region, a second well, a fourth doped region, and a fifth doped region is provided. The substrate has a first conductivity type. The first well is disposed in the substrate and has a second conductivity type. The first doped region is disposed in the first well and has the second conductivity type. The second doped region is disposed in the first well and has the first conductivity type. The third doped region is disposed in the first well and has the first conductivity type. The second well is disposed in the first well. The fourth doped region is disposed in the second well and has the first conductivity type. The fifth doped region is disposed in the second well and has the second conductivity type.Type: ApplicationFiled: February 17, 2023Publication date: August 22, 2024Applicant: Vanguard International Semiconductor CorporationInventors: Yeh-Ning JOU, Chih-Hsuan LIN, Wen-Hsin LIN, Hwa-Chyi CHIOU, Kai-Chieh HSU
-
Publication number: 20240282382Abstract: An artificial neural network operation circuit and an in-memory computation device of the artificial neural network operation circuit are proposed. The in-memory computation device includes a memory cell array, a compensation memory cell string, and an operator. The memory cell array has a plurality of memory cells to store a plurality of weight values. The memory cell array has a plurality of word lines and a plurality of bit lines. Each compensation memory cell of the compensation memory cell string stores a unit weight value. The operator multiplies a signal on a compensation bit line by peak weight information of the weight values to generate a first signal and adds the first signal to each signal on the bit lines to obtain a plurality of computation results, respectively.Type: ApplicationFiled: February 22, 2023Publication date: August 22, 2024Applicant: Macronix International Co., Ltd.Inventors: Yu-Hsuan Lin, Yu-Yu Lin, Hsiang-Lan Lung
-
Patent number: 12069857Abstract: The application discloses an integrated memory device, a manufacturing method and an operation method thereof. The integrated memory cell includes: a first memory cell; and an embedded second memory cell, serially coupled to the first memory cell, wherein the embedded second memory cell is formed on any one of a first side and a second side of the first memory cell.Type: GrantFiled: August 23, 2021Date of Patent: August 20, 2024Assignee: MACRONIX INTERNATIONAL CO., LTD.Inventors: Yu-Hsuan Lin, Feng-Min Lee, Po-Hao Tseng
-
Publication number: 20240274199Abstract: A hyperdimensional computing device includes a non-volatile memory cell array and a first operation circuit. The non-volatile memory cell array is coupled to a plurality of first word lines. The non-volatile memory cell array has a plurality of memory cell groups, a plurality of first memory cells of each of the memory cell groups are coupled to a same first word line of the first word lines, and the memory cell groups respectively store a plurality of data vectors. The first operation circuit receives at least one of the data vectors through bit lines and generates a bundled data vector according to the at least one of the data vectors.Type: ApplicationFiled: February 9, 2023Publication date: August 15, 2024Applicant: MACRONIX International Co., Ltd.Inventors: Yu-Hsuan Lin, Po-Hao Tseng
-
Publication number: 20240265966Abstract: An in-dynamic memory search device and an operation method thereof are provided. The in-dynamic memory search device includes at least one word line, at least two bit lines, at least one match line, at least one unit cell, at least two search lines, at least one pre-charge unit and at least one sense unit. The unit cell includes two storage elements and two search transistors. Each of the storage elements includes a write transistor and a read transistor. The write transistor is connected to the word line and one of the bit lines. The read transistor is connected to the write transistor and the match line. The search transistors are respectively connected to the read transistors. The search lines are respectively connected to the search transistors. The pre-charge unit is connected to the match line. The sense unit is connected to the match line.Type: ApplicationFiled: February 6, 2023Publication date: August 8, 2024Inventors: Po-Hao TSENG, Feng-Min LEE, Yu-Hsuan LIN
-
Publication number: 20240267604Abstract: An image capturing device includes a base, a light sensing element, an image capturing lens, and multiple light sources. The light sensing element is disposed on the base. The image capturing lens is disposed above the light sensing element. The light sources are disposed on the base and arranged beside the image capturing lens. Each of the light sources emits a light beam. A chief ray direction of the light beam has a horizontal component and a vertical component. The horizontal component and the vertical component are both greater than zero.Type: ApplicationFiled: June 15, 2023Publication date: August 8, 2024Applicant: Chicony Electronics Co., Ltd.Inventors: Yu-Hsuan Lin, Chien-Yueh Chen