Patents by Inventor Hua Feng

Hua Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11325278
    Abstract: Disclosed are methods and systems for optimizing printing of a ceramic isolation layer. In some embodiments, the method includes the following steps: preparing a workpiece before printing; printing the workpiece by an optimal printing solution, the optimal printing solution satisfying a setting of key data when printing the ceramic isolation layer; and processing the workpiece after printing to obtain a finished workpiece. In other embodiments, the optimal printing solution is determined by the following steps: printing and processing the ceramic isolation layer and the workpiece isolated by the ceramic isolation layer for multiple times; adjusting the key data by determining a strength of the ceramic isolation layer after printing and deformation data of the workpiece; selecting the ceramic isolation layer parameters and the printing parameters; and taking the setting of the key data as the optimal solution when the deformation data reaches a preset threshold.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: May 10, 2022
    Assignee: Suzhou Fusion Tech Co., Ltd.
    Inventors: Jun Wang, Hanshen Wang, Jingwei Hu, Hua Feng, Jianzhe Li, Jinjing Zhang, Xiaoyu Wu, Wangping Long
  • Publication number: 20220117081
    Abstract: A circuit board includes a substrate, a driver circuit, at least one light-emitting element, a grounding circuit, and an antenna unit. The substrate includes a first circuit layer and a second circuit layer. The driver circuit is located on the first circuit layer. The light-emitting element is located on the first circuit layer and is electrically connected to the driver circuit, so that the driver circuit controls the light-emitting element to emit light. The grounding circuit is located on the second circuit layer and is electrically connected to the driver circuit. The grounding circuit includes a plurality of conductive traces, and the conductive traces are arranged toward one side to form a clearance area on the second circuit layer. The antenna unit is located on the first circuit layer and corresponds to the clearance area to receive and transmit a radio frequency signal.
    Type: Application
    Filed: September 30, 2021
    Publication date: April 14, 2022
    Inventors: Zhen-De Jiang, Pin-Tang Chiu, Chia-Ho Lin, Zhi-Hua Feng
  • Publication number: 20220102862
    Abstract: A three-dimensional electronic component includes a first surface, a second surface, a third surface, and a fourth surface, and an antenna structure. The antenna structure includes a first radiating metal portion, a second radiating metal portion, an adjusting metal branch, a first ground connection portion, a second ground connection portion, a feed point, and a ground point. The first radiating metal portion on the first surface extends to the second surface. The second radiating metal portion on the first surface extends to the third surface. A gap is between the first radiating metal portion and the second radiating metal portion. The adjusting metal branch on the first surface is connected to the first radiating metal portion. The feed point on the first radiating metal portion is close to the gap. The ground point on the second radiating metal portion is close to the gap.
    Type: Application
    Filed: September 16, 2021
    Publication date: March 31, 2022
    Inventors: Zhi-Hua Feng, Chia-Ho Lin, Pin-Tang Chiu, Zhen-De Jiang
  • Patent number: 11282751
    Abstract: A semiconductor device includes. A first epi-layer and a second epi-layer are each located in a first region of the semiconductor device. A first dielectric fin is located between the first epi-layer and the second epi-layer. The first dielectric fin has a first dielectric constant. A third epi-layer and a fourth epi-layer are each located in a second region of the semiconductor device. A second dielectric fin is located between the third epi-layer and the fourth epi-layer. The second dielectric fin has a second dielectric constant that is less than the first dielectric constant.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: March 22, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Min-Yann Hsieh, Hua Feng Chen, Jhon Jhy Liaw
  • Publication number: 20220083022
    Abstract: 3D printing slicing methods, apparatuses, devices, and storage mediums are disclosed. In an embodiment, a 3D printing slicing method includes the following steps: (1) acquiring a 3D model and a target texture picture; (2) obtaining a first model and obtaining a first picture; (3) establishing a mapping set between the first model and the first picture; (4) slicing a target layer of the first model by a slice plane to obtain at least one intersection point; (5) looking up at least one mapping point corresponding to the at least one intersection point in the first picture according to the mapping set, and obtaining corresponding outer contour points by revising coordinates of the at least one intersection point; and (6) obtaining an outer contour boundary line of the target layer by connecting the outer contour points successively.
    Type: Application
    Filed: November 15, 2020
    Publication date: March 17, 2022
    Applicant: Shanghai Fusion Tech Co., Ltd.
    Inventors: Jinjing Zhang, Jianzhe Li, Hua Feng
  • Publication number: 20220063127
    Abstract: Disclosed are methods and systems for optimizing printing of a ceramic isolation layer. In some embodiments, the method includes the following steps: preparing a workpiece before printing; printing the workpiece by an optimal printing solution, the optimal printing solution satisfying a setting of key data when printing the ceramic isolation layer; and processing the workpiece after printing to obtain a finished workpiece. In other embodiments, the optimal printing solution is determined by the following steps: printing and processing the ceramic isolation layer and the workpiece isolated by the ceramic isolation layer for multiple times; adjusting the key data by determining a strength of the ceramic isolation layer after printing and deformation data of the workpiece; selecting the ceramic isolation layer parameters and the printing parameters; and taking the setting of the key data as the optimal solution when the deformation data reaches a preset threshold.
    Type: Application
    Filed: August 18, 2021
    Publication date: March 3, 2022
    Applicant: Suzhou Fusion Tech Co., Ltd.
    Inventors: Jun Wang, Hanshen Wang, Jingwei Hu, Hua Feng, Jianzhe Li, Jinjing Zhang, Xiaoyu Wu, Wangping Long
  • Patent number: 11251181
    Abstract: Embodiments of the disclosure provide a semiconductor device including a substrate, an insulating layer formed over the substrate, a plurality of fins formed vertically from a surface of the substrate, the fins extending through the insulating layer and above a top surface of the insulating layer, a gate structure formed over a portion of fins and over the top surface of the insulating layer, a source/drain structure disposed adjacent to opposing sides of the gate structure, the source/drain structure contacting the fin, a dielectric layer formed over the insulating layer, a first contact trench extending a first depth through the dielectric layer to expose the source/drain structure, the first contact trench containing an electrical conductive material, and a second contact trench extending a second depth into the dielectric layer, the second contact trench containing the electrical conductive material, and the second depth is greater than the first depth.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: February 15, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wen-Che Tsai, Min-Yann Hsieh, Hua Feng Chen, Kuo-Hua Pan
  • Patent number: 11217477
    Abstract: Devices and methods that include for configuring a profile of a liner layer before filling an opening disposed over a semiconductor substrate. The liner layer has a first thickness at the bottom of the opening and a second thickness a top of the opening, the second thickness being smaller that the first thickness. In an embodiment, the filled opening provides a contact structure.
    Type: Grant
    Filed: November 26, 2019
    Date of Patent: January 4, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Joanna Chaw Yane Yin, Hua Feng Chen
  • Patent number: 11177562
    Abstract: An electronic device is provided. The electronic device includes a metal housing, an insulation element, and an antenna unit. The insulation element is disposed on the metal housing and includes a first heat dissipation hole. The antenna unit is disposed on the insulation element and includes a radiation portion and a feeding portion. The radiation portion is composed of a conductor. The feeding portion is electrically connected to the radiation portion and a grounding plane. In this way, according to the electronic device, space configuration inside the electronic device is saved and a shielding effect of the metal housing is prevented from affecting stability of sending and receiving a signal.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 16, 2021
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Bo-Hua Yang, Yu-Hsiang Huang, Shao-Kai Liu, Zhi-Hua Feng
  • Publication number: 20210331416
    Abstract: Methods, systems, and storage media for controlling a fast-moving path of a printer nozzle. In some embodiments, a method for controlling fast movement of a printer nozzle includes the following steps. (1) Obtaining a start position and an end position. The start position is a position of a fast-moving start point of the printer nozzle, and the end position is a position of a fast-moving end point of the printer nozzle. (2) Determining an optimal fast-moving path on a horizontal plane corresponding to a slice of a print target according to the start position and the end position, so that a length of the fast-moving path outside a polygon in the slice is the shortest. (3) Controlling the printer nozzle to move relative to a base of the printer according to the optimal fast-moving path on the horizontal plane.
    Type: Application
    Filed: June 15, 2020
    Publication date: October 28, 2021
    Applicant: Shanghai Fusion Tech Co., Ltd.
    Inventors: Jinjing Zhang, Jianzhe LI, Hua FENG
  • Patent number: 11126162
    Abstract: 3D printing slicing methods, apparatuses, devices, and storage mediums are disclosed. In an embodiment, a 3D printing slicing method includes the following steps: (1) acquiring a 3D model and a target texture picture; (2) obtaining a first model and obtaining a first picture; (3) establishing a mapping set between the first model and the first picture; (4) slicing a target layer of the first model by a slice plane to obtain at least one intersection point; (5) looking up at least one mapping point corresponding to the at least one intersection point in the first picture according to the mapping set, and obtaining corresponding outer contour points by revising coordinates of the at least one intersection point; and (6) obtaining an outer contour boundary line of the target layer by connecting the outer contour points successively.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: September 21, 2021
    Assignee: Shanghai Fusion Tech Co., Ltd.
    Inventors: Jinjing Zhang, Jianzhe Li, Hua Feng
  • Patent number: 11110657
    Abstract: A switching device for double nozzles of a 3D printer, which includes two transmission blocks, a rotary part and two spring parts. The two transmission blocks are in mirror image structures with each other and are respectively mounted on two nozzle devices; each transmission block is provided with a pressure supporting and transmiting portion, and the pressure supporting and transmiting portion includes a pressing-down stopping portion, a pressure transmiting portion, and a restoring stopping portion which are connected in sequence; the rotary part is connected to the case and is provided with two pressing parts; the two spring parts respectively sleeve the two nozzle devices, and the spring part supports the corresponding transmission block; the rotary part can rotate in a reciprocating manner, the rotary part drives the pressing parts to move on the two pressure supporting and transmiting portions.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: September 7, 2021
    Assignee: SHANGHAI FUSION TECH CO., LTD.
    Inventors: Jianzhe Li, Hua Feng, Junjie Zong, Wangping Long
  • Patent number: 11083235
    Abstract: An insulated glove, including a covering, a lining and a plurality of heat insulators. The lining is sheathed in the covering, and the lining and the covering form a sandwich structure. Each of the heat insulators includes a first connecting end and a second connecting end which are respectively connected to the covering and the lining, so that the heat insulators are located in the sandwich structure. A cavity capable of insulating heat is formed between the heat insulators, the lining and the covering. The glove has a simple and reasonable structure and is flexible and convenient to use, which has good heat insulation and anti-scald effect, as well as an anti-shock effect.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: August 10, 2021
    Assignee: Nantong Jiadeli Safety Products Co., Ltd
    Inventor: Hua Feng
  • Patent number: 11072116
    Abstract: Switching devices for a printing mode of a 3D printer are disclosed. In some embodiments, the switching devices includes: a component platform with at least two platform bodies (200); at least two handpiece guiding parts (110); at least two platform guiding parts (210); at least two handpiece transmission mechanisms (120); a handpiece drive mechanism configured to drive the handpiece transmission mechanisms (120) to move synchronously; at least two platform transmission mechanisms (220); and a platform drive mechanism configured to drive the platform transmission mechanisms (220) to move synchronously.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: July 27, 2021
    Assignee: Shanghai Fusion Tech Co., Ltd.
    Inventors: Jianzhe Li, Hua Feng, Xi Cao, Wangping Long
  • Patent number: 11059218
    Abstract: A method for adjusting height of a 3d printer nozzle. In an embodiment, the method uses a fully wavy line as a reference line. The method includes the following steps. Determining an initial value of a height difference between the nozzle and a bottom of a probe by using a feeler gauge. Moving the nozzle vertically to adjust the height based on the initial value, obtaining a printing height of a first line, and printing the first line. Determining whether the first line is a fully wavy line. Adjusting the height of the nozzle for N times according to a preset step value, and printing N lines with corresponding heights. Determining whether the N lines have a fully wavy line. Calculating the height difference between the nozzle and the bottom of the probe by an equation. Adjusting the height of the nozzle.
    Type: Grant
    Filed: March 18, 2020
    Date of Patent: July 13, 2021
    Assignee: Shanghai Fusion Tech Co., Ltd.
    Inventors: Xi Cao, Hua Feng, Jianzhe Li, Jinjing Zhang, Wangping Long, Xiaoyu Wu, Zhongwei Yu, Xinpeng Fan, Rui Yuan, Huan Liu
  • Publication number: 20210208315
    Abstract: A light diffusion film module including stacked first and second optical films is stacked on an array light source to form a light source module, Light incident and outputting sides of the first optical film are respectively provided with irregularly array-arranged first optical elements and array-arranged second optical elements, which are not aligned in position one by one. Inclined lateral faces of the first optical elements are partially parallel and inclined lateral faces of the second optical elements are partially parallel. The second optical film has a light incident side adjacent to the first optical film, and a light outputting side with regularly arranged third optical elements. Inclined lateral faces of the third optical elements are parallel. As such, the light diffusion film module can effectively and uniformly diffuse the light from the array light source in a short distance and eliminate direct glare under good light emitting efficiency.
    Type: Application
    Filed: January 5, 2021
    Publication date: July 8, 2021
    Inventors: Po-Hung YAO, Chih-Hua FENG
  • Publication number: 20210202713
    Abstract: A method includes forming a transistor, which includes forming a dummy gate stack over a semiconductor region, and forming an Inter-Layer Dielectric (ILD). The dummy gate stack is in the ILD, and the ILD covers a source/drain region in the semiconductor region. The method further includes removing the dummy gate stack to form a trench in the first ILD, forming a low-k gate spacer in the trench, forming a replacement gate dielectric extending into the trench, forming a metal layer to fill the trench, and performing a planarization to remove excess portions of the replacement gate dielectric and the metal layer to form a gate dielectric and a metal gate, respectively. A source region and a drain region are then formed on opposite sides of the metal gate.
    Type: Application
    Filed: February 22, 2021
    Publication date: July 1, 2021
    Inventors: Kuo-Hua Pan, Je-Wei Hsu, Hua Feng Chen, Jyun-Ming Lin, Chen-Huang Peng, Min-Yann Hsieh, Java Wu
  • Patent number: 11045999
    Abstract: A throat structure for a 3D printer according to an embodiment includes a cold zone for heat dissipation, a hot zone for heating, and a thermal insulation zone. The cold zone for heat dissipation has a titanium throat outer tube body and a teflon throat inner tube body, and the teflon throat inner tube body is socketed in the titanium throat outer tube body. The hot zone for heating has a heating block connection zone and a nozzle connection zone. The heating block connection zone is located on an external side of the hot zone for heating, and the nozzle connection zone is located at a lower part of the hot zone for heating. The thermal insulation zone is connected to the titanium throat outer tube body such that an area of the hot zone for heating is reduced and a printing material extrusion amount is controlled.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: June 29, 2021
    Assignee: Shanghai Fusion Tech Co., Ltd.
    Inventors: Wangping Long, Hua Feng, Jianzhe Li
  • Patent number: 11046013
    Abstract: Extruder calibration methods and systems for a dual-extruder 3D printer are disclosed. In an embodiment, an extruder calibration method for a dual-extruder 3D printer having a left extruder and a right extruder includes the following steps: (1) building up a rectangular coordinate system on a heat bed of a 3D printer; (2) obtaining a first offset by calculating an offset between the left extruder and the right extruder in an X-axis direction; (3) obtaining a second offset by calculating an offset between the left extruder and the right extruder in a Y-axis direction; and (4) calibrating the left extruder and the right extruder according to the first offset and the second offset.
    Type: Grant
    Filed: May 31, 2020
    Date of Patent: June 29, 2021
    Assignee: Shanghai Fusion Tech Co., Ltd.
    Inventors: Hua Feng, Jianzhe Li, Jinjing Zhang, Xi Cao, Xiaoyu Wu, Zhongwei Yu, Wangping Long
  • Publication number: 20210172734
    Abstract: Some embodiments of the disclosure provide a flatness detection device. In an embodiment, the flatness detection device includes a back plate, an electromagnet, a cross beam, a probe, and a limiting frame. The limiting frame and the electromagnet are provided side by side on the back plate. The cross beam is located above the limiting frame and the electromagnet. The probe vertically penetrates the cross beam and the limiting frame. A spring is provided between the cross beam and the electromagnet. The spring is movable in a vertical direction by a guide, the movement being at least one of compression and extension.
    Type: Application
    Filed: February 26, 2020
    Publication date: June 10, 2021
    Inventors: Xi CAO, Hua FENG, Jianzhe LI, Jinjing ZHANG, Wangping LONG, Xiaoyu WU, Zhongwei YU, Xingpeng FAN, Rui YUAN, Huan LIU