Abstract: A manufacturing system includes a substrate disposed on a conveyer system. The conveyer system includes a pair of side supports. The substrate is moved on the conveyer system until the substrate is disposed over a bottom support block. The bottom support block is raised to physically contact the substrate. A transfer arm module is provided. The transfer arm module includes a flat bottom surface and an opening formed in the flat bottom surface. The transfer arm module is disposed with the flat bottom surface physically contacting the substrate opposite the bottom support block. A vacuum is enabled through the opening of the transfer arm module. The substrate is lifted off the bottom support block using the vacuum. The substrate is moved over a printing pallet using the transfer arm module. The vacuum is disabled when the substrate is in a positioning area of the printing pallet.

Abstract: An organometallic complex, a catalyst composition employing the same, and a method for preparing polyolefin are provided. The organometallic compound has a structure represented by Formula (I) wherein M is Ti, Zr, or Hf; X is —O—, or —NR6—; R1 and R2 are independently hydrogen, C1-6 alkyl group, C6-12 aryl group, or R1 and R2 are combined with the carbon atoms, to which they are attached, to form an C6-12 aryl moiety; R3, R4 and R5 are independently fluoride, chloride, bromide, C1-6 alkyl group, C6-12 aryl group, C3-6 hetero aryl group, C7-13 aryl alkyl group or C7-12 alkyl aryl group; and R6 is hydrogen, C6-12 aryl group or C7-12 alkyl aryl group.

Abstract: A semiconductor device structure includes a first dielectric wall, a plurality of first semiconductor layers vertically stacked and extending outwardly from a first side of the first dielectric wall, each first semiconductor layer has a first width, a plurality of second semiconductor layers vertically stacked and extending outwardly from a second side of the first dielectric wall, each second semiconductor layer has a second width, a plurality of third semiconductor layers disposed adjacent the second side of the first dielectric wall, each third semiconductor layer has a third width greater than the second width, a first gate electrode layer surrounding at least three surfaces of each of the first semiconductor layers, the first gate electrode layer having a first conductivity type, and a second gate electrode layer surrounding at least three surfaces of each of the second semiconductor layers, the second gate electrode layer having a second conductivity type opposite the first conductivity type.

Abstract: A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.

Abstract: The systems and cold plate pedestal and assembly described decrease mechanical stresses in integrated circuits, while also providing efficient thermal coupling between heat producing components and a cold plate. A cold plate assembly includes a cold plate with a pedestal portion a groove formed in a surface of the pedestal portion. The cold plate assembly also includes a thermal pad layer formed in the groove and a phase change material (PCM) layer formed on the surface of the pedestal portion and a surface of the thermal pad layer formed in the groove.

Abstract: A laparoscopic image smoke removal method based on a generative adversarial network, and belongs to the technical field of computer vision. The method includes: processing a laparoscopic image sample to be processed using a smoke mask segmentation network to acquire a smoke mask image; inputting the laparoscopic image sample to be processed and the smoke mask image into a smoke removal network, and extracting features of the laparoscopic image sample to be processed using a multi-level smoke feature extractor to acquire a light smoke feature vector and a heavy smoke feature vector; and acquiring, according to the light smoke feature vector, the heavy smoke feature vector and the smoke mask image, a smoke-free laparoscopic image by filtering out smoke information and maintaining a laparoscopic image by using a mask shielding effect. The method has the technical effects of robustness and ability of being embedded into a laparoscopic device for use.

Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: A supported metallocene catalyst includes a carrier and a metallocene component. The carrier includes an inorganic oxide particle and an alkyl aluminoxane material. The inorganic oxide particle includes at least one inorganic oxide compound selected from the group consisting of an oxide of Group 3A and an oxide of Group 4A. The alkyl aluminoxane material includes an alkyl aluminoxane compound and an alkyl aluminum compound that is present in amount ranging from greater than 0.01 wt % to less than 14 wt % base on 100 wt % of the alkyl aluminoxane material. The metallocene component is supported on the carrier, and includes one of a metallocene compound containing a metal from Group 3B, a metallocene compound containing a metal from Group 4B, and a combination thereof. A method for preparing the supported metallocene catalyst and a method for preparing polyolefin using the supported metallocene catalyst are also disclosed.

Abstract: An optical sensor having a common light sensing circuit for synchronously sensing a plurality of color light signals is provided. A plurality of photoelectric components respectively convert the plurality of color light signals into a plurality of photocurrents. A plurality of gain amplifiers respectively multiply the plurality of photocurrents by a plurality of gains to output a plurality of amplified photocurrents. An arithmetic circuit adds up the plurality of amplified photocurrents to output a total amplified photocurrent signal. A common analog-to-digital converter converts the total amplified photocurrent signal into a digital signal. A counter circuit counts bit values of the digital signal to output a counting signal.

Abstract: A light sensor having a voltage reversing mechanism is provided. A photoelectric component converts a first light signal into a first photocurrent. A capacitor is charged to a first voltage by the first photocurrent. A counter counts a first coarse count value according to the first voltage. The photoelectric component converts a second light signal into a second photocurrent. The capacitor is charged from a reversed first voltage to a second voltage by the second photocurrent. The counter counts a second coarse count value according to the second voltage. The counter counts a fine count value according to the second coarse count value. One of the first light signal and the second light signal is emitted by both of an ambient light source and a light-emitting component and then reflected by a tested object, and the other one of them is emitted by only the ambient light source.

Abstract: A light sensor having a voltage reversing mechanism is provided. A photoelectric component converts a first light signal into a first photocurrent. A capacitor is charged to a first voltage by the first photocurrent. A counter counts a first coarse count value according to the first voltage. The photoelectric component converts a second light signal into a second photocurrent. The capacitor is charged from a reversed first voltage to a second voltage by the second photocurrent. The counter counts a second coarse count value according to the second voltage. The counter counts a fine count value according to the second coarse count value. One of the first light signal and the second light signal is emitted by both of an ambient light source and a light-emitting component and then reflected by a tested object, and the other one of them is emitted by only the ambient light source.

Abstract: A light sensing method having a sensing order adjusting mechanism is provided. The method includes steps of: in a previous sensing cycle, sensing a first light signal that is emitted by both of an ambient light source and a light-emitting component and then is reflected by a tested object; in the previous sensing cycle, sensing a second light signal that is emitted by both of the ambient light source and the light-emitting component and then is reflected by the tested object; in the previous sensing cycle, sensing an ambient light signal emitted by only the ambient light source; and in a next sensing cycle, sensing the first light signal, the second light signal and the ambient light signal in an order different from that in the previous sensing cycle.

Abstract: A light sensor having a control complexity reducing mechanism is provided. When light is emitted to a photodiode by both of an ambient light source and a light-emitting component, a first coarse count value is counted by a counter and then is sampled and held by a first sample and hold circuit. When light is emitted to the photodiode by only the ambient light source, a second coarse count value is counted by the counter and then is sampled and held by a second sample and hold circuit. After the coarse count values are held, the counter performs a fine counting operation on light intensity of the light emitted by both of the ambient light source and the light-emitting component to generate a first fine count value, and on light intensity of the light emitted by only the ambient light source to generate a second fine count value.

Abstract: An embodiment related to a device. The device includes a first die with first and second die surfaces. The second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad. The device also includes a first clip bond including a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion. The first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface. The device further includes a first conductive clip-die bonding layer with spacers on the first die contact pad of the first die.

Abstract: The present disclosure is directed to a high throughput clip bonding tool or system which is flexible and easily adapts to different clip bond pitches or sizes. The clip bonding system may be an integrated system with various modules, including a clip singulation module, a feeder module, a transfer module and a clip attach module within a shared footprint. For example, an incoming clip source may be fed to the clip singulation module for clip singulation before the singulated clips are transferred by the feeder and transfer modules to a clip presentation area for clip alignment before pickup. A pickup tool of the clip attach module is configured to facilitate pickup and attachment of clips onto the semiconductor packages to be clip bonded. For example, the pickup head is programmable to facilitate clip bonding process of different applications which may require clips and packages with different sizes.

Abstract: A method of improving performance of an averager is provided. The method includes steps of: (a) multiplying a value of a (n-1)th piece of output data by a value “N” to calculate a temporary value; (b) determining whether or not a difference between an nth piece of input data and the (n-1)th piece of output data is larger than or smaller than a zero value, if yes, compensating the temporary value to obtain a correction value and performing step(c), if no, setting the correction value and performing step(c); (c) dividing the correction value by the value “N” to obtain a first value; (d) subtracting the first value from the correction value and adding up the correction value and the nth piece of input data to obtain a second value; and (e) dividing the second value by the value “N” to calculate an output value of the averager.

Abstract: Disclosed are an anode material for lithium secondary batteries, the anode material including an Si-based anode active material and a film layer formed as a double self-assembled monolayer as the result of an amino trimethoxy silane (ATS) SAM precursor and a fluoro ethylene carbonate (FEC) SAM precursor being sequentially bonded to the surface of the Si-based anode active material, and method of manufacturing the same.

Abstract: A rapid sensing value estimation circuit and a method thereof are provided. The circuit includes a first sensing unit, an integration sensing circuit and a rapid estimation circuit. The rapid estimation circuit includes a clock generator, a second counter, a first digital comparator, an arithmetic module and a remainder calculation module. The clock generator generates a clock signal with a first frequency. The second counter counts the clock signal within the integration time to generate a second count value. The first digital comparator determines whether the second count value exceeds a first predetermined count value when the first count value increases. The arithmetic module calculates an estimated count value result and a remainder, and the remainder calculation module can further calculate and estimate values of decimal places of this signal based on the remainder.

Abstract: A semiconductor manufacturing equipment cleaning system has a multi-station cleaning and inspection system. Within semiconductor manufacturing equipment cleaning system, a tray cleaning station uses a first rotating brush passing over a first surface of a carrier and possibly semiconductor die, and a second rotating brush passing over a second surface of the carrier and semiconductor die opposite the first surface of the carrier and semiconductor die. Debris and contaminants dislodged from the first surface and second surface of the carrier by the first rotating brush and second rotating brush are removed under vacuum suction. A conveyor transports the carrier through the multi-station cleaning and inspection system. The first rotating brush and second rotating brush move in tandem across the first surface and second surface of the carrier. Air pressure is injected across the first rotating brush and second rotating brush to further remove debris and contaminants.

Abstract: A signal gain determination circuit including a digital comparator, a digital controller and an arithmetic module, and a signal gain determination method are provided. A sensing integration circuit generates a first count during a first integration time according to a first sensing signal. The digital comparator compares the first count and a predetermined count to generate a comparison result. The digital controller generates a control signal for indicating a signal gain to a signal amplifier of the sensing integration circuit according to the comparison result. The signal amplifier adjusts the first sensing signal according to the signal gain to generate a second sensing signal, so that the sensing integration circuit generates a second count corresponding to the second sensing signal during a second integration time. The arithmetic module generates an output count corresponding to the first sensing signal according to the second count and the signal gain.