Abstract: A method for forming a semiconductor package is disclosed herein. The method includes forming a package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate includes a recess region below the first major surface defined with a die region and a non-die region surrounding the die region. A semiconductor die is disposed in the die region within the recess region. A dam structure is disposed within the recess region. The dam structure surrounds the semiconductor die and extends upwardly to a height below the first major surface of the package substrate. The method also includes dispensing a liquid encapsulant material into the recess region. The liquid encapsulant material is surrounded by the dam structure and extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.

Abstract: An improved method for forming a semiconductor package is disclosed herein. The method includes forming a multi-layer package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate comprises a recess region. A semiconductor die is attached to the die region within the recess region. A dam structure is formed within the recess region. The dam structure surrounds the semiconductor die and extends upward to a height below the first major surface of the package substrate. A liquid encapsulant material is dispensed into the recess region. The liquid encapsulant material is surrounded by the dam structure. The liquid encapsulant extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die attach region. A die having first and second major die surfaces is attached onto the die attach region. The second major die surface is attached to the die attach region. The first major die surface includes an die active region and a cover adhesive region surrounding the die active region. The method also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the die active region. The protective cover includes a discontinuity on at least one of the side surfaces.

Abstract: Approaches presented herein enable optimizing a display of tabular data from a 2-D table as a folding 3-D table having a plurality of vectors in a GUI. More specifically, a scaling ratio is calculated to fit the plurality of vectors within a display area of the GUI based on a cumulative width of the plurality of vectors and a width of the display area of the GUI. A maximum angle of rotation for at least one vector is calculated based on a legibility of the vector. The scaling ratio can be applied to a width of at least one vector to yield a modified width of the vector. The 2-D table is then rendered as a 3-D table in which the at least one vector is depicted as a modified vector angled within a maximum angle of rotation between a horizontal and a vertical axis.

Abstract: An embodiment related to a method for forming a device is disclosed. The method includes providing a package substrate having a first die attach pad (DAP) and a first bond pad, forming a first conductive die-substrate bonding layer on the first DAP, and attaching a first major surface of a first die to the first DAP. The first die includes a first die contact pad on a second major surface of the first die. A first conductive clip-die bonding layer with spacers is formed on the first die contact pad of the first die. A first conductive clip-substrate bonding layer is formed on the first bond pad of the package substrate. The method also includes attaching a first clip bond to the first die and the first bond pad. The first clip bond includes a first horizontal planar portion attached to the first die over the first die contact pad and a second vertical portion attached to the first bond pad.

Abstract: An external information platform in conjunction with an intelligent wearable outfit provides various functional modules for measuring physiological signals in a modular design. An appropriate functional module (or even more than one functional module if desired) may be selected therefrom and arranged in the wearable outfit to extend and change functions of the wearable outfit, making the intelligent wearable outfit suitable for most users who can manage personal health appropriately.

Abstract: Approaches presented herein enable optimizing a display of tabular data from a 2-D table as a folding 3-D table having a plurality of vectors in a GUI. More specifically, a scaling ratio is calculated to fit the plurality of vectors within a display area of the GUI based on a cumulative width of the plurality of vectors and a width of the display area of the GUI. A maximum angle of rotation for at least one vector is calculated based on a legibility of the vector. The scaling ratio can be applied to a width of at least one vector to yield a modified width of the vector. The 2-D table is then rendered as a 3-D table in which the at least one vector is depicted as a modified vector angled within a maximum angle of rotation between a horizontal and a vertical axis.

Abstract: Approaches presented herein enable optimizing a display of tabular data from a 2-D table as a folding 3-D table having a plurality of vectors in a GUI. More specifically, a scaling ratio is calculated to fit the plurality of vectors within a display area of the GUI based on a cumulative width of the plurality of vectors and a width of the display area of the GUI. This scaling ratio is applied to a width of at least one vector to yield a modified width of the vector. The 2-D table is then rendered as a 3-D table in which the at least one vector is depicted as a modified vector angled between a horizontal and a vertical axis. This modified vector has an actual width equal to the modified width and a diagonal length equal to the width of the at least one vector.

Abstract: An intelligent wearable outfit, and an external information platform and a computer program product which are in conjunction with the intelligent wearable outfit, provide various functional modules for measuring physiological signals in a modular design. An appropriate functional module (or even more than one functional module if desired) may be selected therefrom and arranged in the wearable outfit to extend and change functions of the wearable outfit, making the intelligent wearable outfit suitable for most users who can manage personal health appropriately.

Abstract: A sexual stimulating system with feedback control includes a physiological sensor, a sexual stimulator, and a processing module. The physiological sensor measures a physiological response of a user under sexual stimulation, and generates a sensor signal according to a result of the measurement of the physiological response. The sexual stimulator applies the sexual stimulation. The processing module is electrically connected to the physiological sensor and the sexual stimulator, receives the sensor signal, performs an analytical procedure upon the sensor signal for generating digital data, and generates a driving signal according to the digital data to control a degree of the sexual stimulation.

Abstract: Approaches presented herein enable optimizing a display of tabular data from a 2-D table as a folding 3-D table having a plurality of vectors in a GUI. More specifically, a scaling ratio is calculated to fit the plurality of vectors within a display area of the GUI based on a cumulative width of the plurality of vectors and a width of the display area of the GUI. This scaling ratio is applied to a width of at least one vector to yield a modified width of the vector. The 2-D table is then rendered as a 3-D table in which the at least one vector is depicted as a modified vector angled between a horizontal and a vertical axis. This modified vector has an actual width equal to the modified width and a diagonal length equal to the width of the at least one vector.

Abstract: Approaches presented herein enable optimizing a display of tabular data from a 2-D table as a folding 3-D table having a plurality of vectors in a GUI. More specifically, a scaling ratio is calculated to fit the plurality of vectors within a display area of the GUI based on a cumulative width of the plurality of vectors and a width of the display area of the GUI. This scaling ratio is applied to a width of at least one vector to yield a modified width of the vector. The 2-D table is then rendered as a 3-D table in which the at least one vector is depicted as a modified vector angled between a horizontal and a vertical axis. This modified vector has an actual width equal to the modified width and a diagonal length equal to the width of the at least one vector.

Abstract: Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a wafer having first and second major surfaces. The wafer is prepared with a plurality of dies and a plurality of external electrical contacts disposed on the first major surface of the wafer. The method includes processing the wafer. Processing the wafer includes separating the wafer into a plurality of individual dies. An individual die includes first and second major surfaces and first and second sidewalls, and the external electrical contacts are formed on the first major surface of the die. An encapsulant material is formed. The encapsulant material covers at least a portion of the first and second sidewalls of the die.

Abstract: Approaches presented herein enable optimizing a display of tabular data from a 2-D table as a folding 3-D table having a plurality of vectors in a GUI. More specifically, a scaling ratio is calculated to fit the plurality of vectors within a display area of the GUI based on a cumulative width of the plurality of vectors and a width of the display area of the GUI. This scaling ratio is applied to a width of at least one vector to yield a modified width of the vector. The 2-D table is then rendered as a 3-D table in which the at least one vector is depicted as a modified vector angled between a horizontal and a vertical axis. This modified vector has an actual width equal to the modified width and a diagonal length equal to the width of the at least one vector.

Abstract: Methods for the production of carbon-based and other nanostructures are provided.

Abstract: An improved method for forming a semiconductor package is disclosed herein. The method includes forming a multi-layer package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate comprises a recess region. A semiconductor die is attached to the die region within the recess region. A dam structure is formed within the recess region. The dam structure surrounds the semiconductor die and extends upward to a height below the first major surface of the package substrate. A liquid encapsulant material is dispensed into the recess region. The liquid encapsulant material is surrounded by the dam structure. The liquid encapsulant extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.

Abstract: Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a wafer having first and second major surfaces. The wafer is prepared with a plurality of dies and a plurality of external electrical contacts disposed on the first major surface of the wafer. The method includes processing the wafer. Processing the wafer includes separating the wafer into a plurality of individual dies. An individual die includes first and second major surfaces and first and second sidewalls, and the external electrical contacts are formed on the first major surface of the die. An encapsulant material is formed. The encapsulant material covers at least a portion of the first and second sidewalls of the die.

Abstract: Semiconductor packages and methods for forming a semiconductor package are disclosed. The method includes providing a wafer having first and second major surfaces. The wafer is prepared with a plurality of dies and a plurality of external electrical contacts disposed on the first major surface of the wafer. The method includes processing the wafer. Processing the wafer includes separating the wafer into a plurality of individual dies. An individual die includes first and second major surfaces and first and second sidewalls, and the external electrical contacts are formed on the first major surface of the die. An encapsulant material is formed. The encapsulant material covers at least a portion of the first and second sidewalls of the die.

Abstract: A system includes a main body worn on an animal, a physiological sensing module generating a physiological signal associated with the animal, a processing module receiving the physiological signal, performing an analytical procedure thereon for obtaining digital data associated with an emotional condition of the animal, and outputting a drive signal, and an indication module receiving the drive signal and outputting an indication message accordingly. A health condition of the animal is recognized by comparing the digital data and predetermined reference data and when the health condition is determined to be abnormal, the indication module is controlled to output a notification message.

Abstract: A sexual stimulating system with feedback control includes a physiological sensor, a sexual stimulator, and a processing module. The physiological sensor measures a physiological response of a user under sexual stimulation, and generates a sensor signal according to a result of the measurement of the physiological response. The sexual stimulator applies the sexual stimulation. The processing module is electrically connected to the physiological sensor and the sexual stimulator, receives the sensor signal, performs an analytical procedure upon the sensor signal for generating digital data, and generates a driving signal according to the digital data to control a degree of the sexual stimulation.