Abstract: A dual-slope optical sensor is provided. Two terminals of a first charging switch are respectively connected to an optoelectronic component and a first terminal of a capacitor. Two terminals of a second charging switch are respectively connected to a second terminal of the capacitor and grounded. First terminals of third charging and discharging switches are respectively connected to the first and second terminals of the capacitor. First terminals of fourth charging and discharging switches are respectively coupled to first and second reference voltages. Two terminals of a first discharging switch are respectively connected to the optoelectronic component and the second terminal of the capacitor. A first input terminal of a comparator is connected to second terminals of the third charging switch and the fourth discharging switch. A second input terminal of the comparator is connected to second terminals of the fourth charging switch and the third discharging switch.

Abstract: A method of stabilizing data of digital signals is provided. The method includes steps of: setting a boundary coefficient; reading a piece of digital data; defining a value of the piece of digital data as a center value; outputting the value of the piece of digital data; reading a next piece of digital data; subtracting a value of the next piece of digital data from the previously outputted value to obtain a positive difference or a negative difference; and determining whether or not an absolute value of the positive or negative difference is larger than the boundary coefficient, if not, outputting the center value, if yes, updating the center value such that the updated center value is equal to the value of the next piece of digital data, and outputting the updated center value.

Abstract: A method of stabilizing data of digital signals is provided. The method includes steps of: (a) determining whether or not next input data is larger than previous output data, if yes, adding a base value to a trend value and then performing step(c), if no, performing step(b); (b) determining whether or not the next input data is smaller than the previous output data, if yes, subtracting the base value from the trend value and performing step(c), if no, performing step(c); (c) determining whether or not the trend value is larger than a positive threshold, if yes, subtracting a trend correction coefficient from the previous output data, if no, performing step(d); and (d) determining whether or not the trend value is smaller than a negative threshold, if yes, adding the trend correction coefficient to the previous output data; if no, outputting the previous output data.

Abstract: In an approach for an API key access authorization, a processor receives a transaction identity, a part of a token, and an API key identity attribute from a server. The transaction identity is generated in the server associated with generating the token. A processor receives a request from a client with the transaction identity for the part of the token. A processor looks up a transaction table via the transaction identity as an index. The transaction identity is associated with the part of the token and the API key identity attribute. A processor retrieves a client identity attribute through a second server via an IP address of the client. The second server registers the client. A processor matches a policy via the API key identity attribute and the client identity attribute. A processor sends the part of the token to the client.

Abstract: Methods for the production of carbon-based and other nanostructures are provided.

Abstract: The present disclosure relates to a composite scaffold containing DFO and rhBMP-2 capable of synergistically stimulating bone formation, a preparation method and use thereof. The composite scaffold contains a matrix, a PEGS gel layer and rhBMP-2, wherein the matrix is an MBG scaffold grafted with DFO on the surface, the PEGS gel layer is carried on the surface of the matrix, and rhBMP-2 is carried inside the PEGS gel layer. In the present disclosure, the function of DFO and rhBMP-2 in vivo and in vitro can be regulated by precisely controlling the immobilization mode and spatial distribution of DFO and rhBMP-2 in the scaffold, and the all-round repair of “rapid enrichment of target cells—angiogenesis-guided bone” can be achieved.

Abstract: Disclosed are an anode material for lithium secondary batteries, the anode material including an Si-based anode active material and a film layer formed as a double self-assembled monolayer as the result of an amino trimethoxy silane (ATS) SAM precursor and a fluoro ethylene carbonate (FEC) SAM precursor being sequentially bonded to the surface of the Si-based anode active material, and method of manufacturing the same.

Abstract: The anode material for a lithium secondary battery includes: an Si-based anode active material; and a film layer including a self-assembly monolayer (SAM) formed through bonding of SAM precursors onto a surface of the Si-based anode active material.

Abstract: A dual-slope optical sensor is provided. Two terminals of a first charging switch are respectively connected to an optoelectronic component and a first terminal of a capacitor. Two terminals of a second charging switch are respectively connected to a second terminal of the capacitor and grounded. First terminals of third charging and discharging switches are respectively connected to the first and second terminals of the capacitor. First terminals of fourth charging and discharging switches are respectively coupled to first and second reference voltages. Two terminals of a first discharging switch are respectively connected to the optoelectronic component and the second terminal of the capacitor. A first input terminal of a comparator is connected to second terminals of the third charging switch and the fourth discharging switch. A second input terminal of the comparator is connected to second terminals of the fourth charging switch and the third discharging switch.

Abstract: A signal gain determination circuit including a digital comparator, a digital controller and an arithmetic module, and a signal gain determination method are provided. A sensing integration circuit generates a first count during a first integration time according to a first sensing signal. The digital comparator compares the first count and a predetermined count to generate a comparison result. The digital controller generates a control signal for indicating a signal gain to a signal amplifier of the sensing integration circuit according to the comparison result. The signal amplifier adjusts the first sensing signal according to the signal gain to generate a second sensing signal, so that the sensing integration circuit generates a second count corresponding to the second sensing signal during a second integration time. The arithmetic module generates an output count corresponding to the first sensing signal according to the second count and the signal gain.

Abstract: Methods for the production of carbon-based and other nanostructures are provided.

Abstract: An embodiment related to a device. The device includes a first die with first and second die surfaces. The second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad. The device also includes a first clip bond including a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion. The first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface. The device further includes a first conductive clip-die bonding layer with spacers on the first die contact pad of the first die.

Abstract: A rapid sensing value estimation circuit and a method thereof are provided. The circuit includes a first sensing unit, an integration sensing circuit and a rapid estimation circuit. The rapid estimation circuit includes a clock generator, a second counter, a first digital comparator, an arithmetic module and a remainder calculation module. The clock generator generates a clock signal with a first frequency. The second counter counts the clock signal within the integration time to generate a second count value. The first digital comparator determines whether the second count value exceeds a first predetermined count value when the first count value increases. The arithmetic module calculates an estimated count value result and a remainder, and the remainder calculation module can further calculate and estimate values of decimal places of this signal based on the remainder.

Abstract: A method for forming a semiconductor package is disclosed. The method includes providing a package substrate having top and bottom major package substrate surfaces, the top major package surface including a die attach region. A die having first and second major die surfaces is attached onto the die attach region. The second major die surface is attached to the die attach region. The first major die surface includes an die active region and a cover adhesive region surrounding the die active region. The method also includes applying a cover adhesive to the cover adhesive region on the first major die surface. A protective cover with first and second major cover surfaces and side surfaces is attached to the die using the cover adhesive. The second major cover surface contacts the cover adhesive. The protective cover covers the die active region. The protective cover includes a discontinuity on at least one of the side surfaces.

Abstract: An embodiment related to a method for forming a device is disclosed. The method includes providing a package substrate having a first die attach pad (DAP) and a first bond pad, forming a first conductive die-substrate bonding layer on the first DAP, and attaching a first major surface of a first die to the first DAP. The first die includes a first die contact pad on a second major surface of the first die. A first conductive clip-die bonding layer with spacers is formed on the first die contact pad of the first die. A first conductive clip-substrate bonding layer is formed on the first bond pad of the package substrate. The method also includes attaching a first clip bond to the first die and the first bond pad. The first clip bond includes a first horizontal planar portion attached to the first die over the first die contact pad and a second vertical portion attached to the first bond pad.

Abstract: A method for forming a semiconductor package is disclosed herein. The method includes forming a package substrate having a first major surface and a second major surface opposite to the first major surface. The package substrate includes a recess region below the first major surface defined with a die region and a non-die region surrounding the die region. A semiconductor die is disposed in the die region within the recess region. A dam structure is disposed within the recess region. The dam structure surrounds the semiconductor die and extends upwardly to a height below the first major surface of the package substrate. The method also includes dispensing a liquid encapsulant material into the recess region. The liquid encapsulant material is surrounded by the dam structure and extends upwardly to a height below the height of the dam structure. A package lid is attached to the package substrate.

Abstract: In an approach for an API key access authorization, a processor receives a transaction identity, a part of a token, and an API key identity attribute from a server. The transaction identity is generated in the server associated with generating the token. A processor receives a request from a client with the transaction identity for the part of the token. A processor looks up a transaction table via the transaction identity as an index. The transaction identity is associated with the part of the token and the API key identity attribute. A processor retrieves a client identity attribute through a second server via an IP address of the client. The second server registers the client. A processor matches a policy via the API key identity attribute and the client identity attribute. A processor sends the part of the token to the client.

Abstract: A rapid sensing value estimation circuit and a method thereof are provided. The rapid sensing value estimation circuit includes a first sensing unit, an integration sensing circuit and a rapid estimation circuit. The rapid estimation circuit includes a clock generator, a second counter, a first digital comparator, and an arithmetic module. The clock generator generates a clock signal. The second counter counts the clock signal to generate a second count value. The first digital comparator determines whether the second count value exceeds a first predetermined count value when the first count value increases. The arithmetic module estimates the first count value at an end of an integration time according to a ratio of the second maximum count value to the second count value and the first count value when the second count value exceeding the first predetermined count value, to generate an estimated count value result.

Abstract: The present disclosure is directed to a high throughput clip bonding tool or system which is flexible and easily adapts to different clip bond pitches or sizes. The clip bonding system may be an integrated system with various modules, including a clip singulation module, a feeder module, a transfer module and a clip attach module within a shared footprint. For example, an incoming clip source may be fed to the clip singulation module for clip singulation before the singulated clips are transferred by the feeder and transfer modules to a clip presentation area for clip alignment before pickup. A pickup tool of the clip attach module is configured to facilitate pickup and attachment of clips onto the semiconductor packages to be clip bonded. For example, the pickup head is programmable to facilitate clip bonding process of different applications which may require clips and packages with different sizes.

Abstract: An external information platform in conjunction with an intelligent wearable outfit provides various functional modules for measuring physiological signals in a modular design. An appropriate functional module (or even more than one functional module if desired) may be selected therefrom and arranged in the wearable outfit to extend and change functions of the wearable outfit, making the intelligent wearable outfit suitable for most users who can manage personal health appropriately.