Patents by Inventor Hua Huang
Hua Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12136570Abstract: The present disclosure provides low resistance contacts and damascene interconnects with one or more graphene layers in fin structures of FETs. An example semiconductor device can include a substrate with a fin structure that includes an epitaxial region. The semiconductor device can also include an etch stop layer on the epitaxial region, and an interlayer dielectric layer on the etch stop layer. The semiconductor device can further include a metal contact, above the epitaxial region, formed through the etch stop layer and the interlayer dielectric layer, and a graphene film at interfaces between the metal contact and each of the epitaxial region, the etch stop layer, and the interlayer dielectric layer.Type: GrantFiled: December 14, 2021Date of Patent: November 5, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mrunal Abhijith Khaderbad, Wei-Yen Woon, Cheng-Ming Lin, Han-Yu Lin, Szu-Hua Chen, Jhih-Rong Huang, Tzer-Min Shen
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Publication number: 20240363464Abstract: A package structure is provided. The package structure includes a die, an encapsulant, a first redistribution line (RDL) structure, a second RDL structure, and a through via. The encapsulant laterally encapsulates the die. The first redistribution line (RDL) structure on a first side of the die and the encapsulant, wherein the first RDL structure comprises a dielectric layer and a redistribution layer in the dielectric layer. The second RDL structure is located on a second side of the die and the encapsulant. The through via extends through the encapsulant and the first redistribution line structure and connecting the second RDL structure. The through via is laterally separated from the redistribution layer by the dielectric layer therebetween.Type: ApplicationFiled: July 9, 2024Publication date: October 31, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo
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Publication number: 20240361999Abstract: A method of compiling a deep learning model includes reading metadata from a compiled result, the metadata indicating a structure of the deep learning model corresponding to a low-level IR, receiving shape information of an input tensor of the deep learning model, determining a shape of an output tensor of a first computation operation of the computation operations based on the shape information of the input tensor of the deep learning model and the structure of the deep learning model, tiling the output tensor of the first computation operation into one or more tiles according to the shape of the output tensor of the first computation operation and hardware limitations of a processor executing the deep learning model, and patching one or more copies of a templated hardware command into executable hardware commands.Type: ApplicationFiled: April 28, 2023Publication date: October 31, 2024Applicant: MEDIATEK INC.Inventors: Meng-Hsuan YANG, Po-hua HUANG, Hsing-Chang CHOU, Ting Chen TSAN, Yu-Lung LU
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Publication number: 20240364224Abstract: An auxiliary power circuit of a conversion module is used to supply power to a control unit, and an input end of the conversion module includes an even number of energy storage units coupled in series. The auxiliary power circuit includes an even number of primary-side circuits and a secondary-side circuit. Each primary-side circuit includes a first switch unit, a second switch unit, and a resonance tank. The first switch unit is connected to the second switch unit in series, and is correspondingly connected to one of the energy storage units in parallel. The resonance tank is connected to the second switch unit in parallel. The secondary-side circuit is coupled to the resonance tanks of two of the primary-side circuits to acquire power and supply power to the control unit.Type: ApplicationFiled: July 8, 2024Publication date: October 31, 2024Inventors: Che-Wei CHANG, Wen-Lung HUANG, Sheng-Hua LI
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Patent number: 12132980Abstract: A dynamic image processing method is executed by an electronic device communicating with a photographing device and reading an executable code to identify a preset object by using artificial intelligence, and perform dynamic image processing for the preset object. The method includes the steps of identifying the preset object, image filtering and forming a concatenated video. In the step of image filtering, a filter condition is set, the filter condition includes detecting a movement variable of the preset object in the initial image, and when the filter condition meets a threshold, a catch moment in the initial image is selected. In the step of forming a concatenated video, at least one video clip in the initial image is selected according to the catch moment, and the video clip is assembled to form the concatenated video. The present disclosure also provides an electronic device and a terminal device.Type: GrantFiled: October 26, 2022Date of Patent: October 29, 2024Assignee: COMPAL ELECTRONICS, INC.Inventors: Pin-Yu Chou, Yueh-Hua Lee, Yu-Ning Chang, Ming-Hsien Wu, Yu-Syuan Huang
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Patent number: 12133101Abstract: An approach is described for a user equipment (UE), wherein the UE includes radio front end circuitry and processor circuitry coupled to the radio front end circuitry. The processor circuitry receives a reference signal from a source device via a radio link, wherein the reference signal is one of the synchronization signal block (SSB) signal or channel state information reference signal (CSI-RS). The processor circuitry measures a quality of the reference signal, and measures an evaluation time of the reference signal. The processor circuitry determines a first indicator of the radio link based on the quality of the reference signal, and determine a second indicator of the radio link based on the evaluation time of the reference signal. The processor circuitry then determines a status of a connection of the radio link based on the first indicator and the second indicator of the radio link, and generate a message based the status of the connection.Type: GrantFiled: March 30, 2020Date of Patent: October 29, 2024Assignee: APPLE INC.Inventors: Rui Huang, Qiming Li, Jie Cui, Zhibin Yu, Yang Tang, Hua Li
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Patent number: 12132042Abstract: The ability of a grounded gate NMOS (ggNMOS) device to withstand and protect against human body model (HBM) electrostatic discharge (ESD) events is greatly increased by resistance balancing straps. The resistance balancing straps are areas of high resistance formed in the substrate between an active area that includes a MOSFET of the ggNMOS device and a bulk ring that surrounds the active area. A Vss rail is coupled to the substrate beneath the MOSFET through the bulk ring. The substrate beneath the MOSFET provides base regions for parasitic transistors that switch on for the ggNMOS device to operate. The straps inhibit low resistance pathways between the base regions and the bulk ring and prevent a large portion of the ggNMOS device from being switched off while a remaining portion of the ggNMOS device remains switched on. The strap may be divided into segments inserted at strategic locations.Type: GrantFiled: July 25, 2022Date of Patent: October 29, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsiao-Ching Huang, Sheng-Fu Hsu, Hao-Hua Hsu, Pin-Chen Chen, Lin-Yu Huang, Yu-Chang Jong
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Publication number: 20240354658Abstract: A method and apparatus for training a question solving model, a question solving method and apparatus, an electronic device and a readable storage medium are disclosed. The method for training a question solving model includes: acquiring a first sample question; inputting the first sample question and a solving step grabbing template into a large language model to obtain a first sample solving step; inputting the first sample question, the first sample solving step and an answer grabbing template into the large language model to obtain a first sample answer; pre-training a step planning model according to the first sample question and the first sample solving step; pre-training the large language model according to the first sample question, the first sample solving step and the first sample answer; and acquiring the question solving model according to the step planning model and the large language model obtained by pre-training.Type: ApplicationFiled: June 17, 2024Publication date: October 24, 2024Applicant: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.Inventors: Feng HE, Jianhua WANG, Junjie OU, Pingxuan HUANG, Zhifan FENG, Xiaopeng CUI, Qiaoqiao SHE, Hua WU
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Publication number: 20240355906Abstract: Embodiments include a method and device resulting from the method, including using a radical oxidation process to oxidize a spacer layer which lines the opening after removing a dummy gate electrode. The oxidized layer is removed by an etching process. An STI region disposed below the dummy gate electrode may be partially etched.Type: ApplicationFiled: April 20, 2023Publication date: October 24, 2024Inventors: Shao-Hua Hsu, Chia-I Lin, Hsiu-Hao Tsao, Kai-Min Chien, Chen-Huang Huang, An Chyi Wei, Ryan Chia-Jen Chen
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Publication number: 20240353241Abstract: A platform through-beam sensor device includes a transmitter module and a receiver module. A light emitted by a light-emitting element of the transmitter module is shaped into a light pattern range by a transmitter mask. A range of the light received by a light-receiving element of the receiver module is changed to a receiving range by a receiver mask. When the present invention is used, the transmitter module and the receiver module are respectively installed on two ends of a mechanical apparatus that move relative to each other. After determining a safety range of the relative movement of the two ends, a state that the light-receiving element falls into the light pattern range and the light-emitting element falls into the receiving range is set to be within the safety range. Upon exceeding the safety range, a flying platform is controlled to stop, thereby improving the safety of the flying platform.Type: ApplicationFiled: August 25, 2023Publication date: October 24, 2024Applicant: Brogent Technologies Inc.Inventors: GUO-SEN LIAN, SHAO-HUA TSAI, CHENG-LIN HUANG, CHIH-HUANG WANG
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Patent number: 12122834Abstract: The present invention relates to anti-PD-1 antibodies and antigen-binding fragments, and use of these antibodies and antigen-binding fragments in the treatment of cancer or infectious disease.Type: GrantFiled: January 31, 2019Date of Patent: October 22, 2024Assignee: Merck Sharp & Dohme LLCInventors: Laurence Fayadat-Dilman, Veronica Juan, Shireen Khan, Shaopeng Huang, Hua Ying
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Patent number: 12125812Abstract: An integrated circuit package includes first and second dies bonded to each other. The first die includes first die pads over a first device, first bonding pads over the first die pads, a first conductive via disposed between and electrically connected to a first one of the first die pads and a first one of the first bonding pads, and a first thermal via disposed between a second one of the first die pads and a second one of the first bonding pads and electrically insulated from the second one of the first die pads or the second one of the first bonding pads. The second die includes second bonding pads. The first one of the first bonding pads is connected to a first one of the second bonding pads. The second one of the first bonding pads is connected to a second one of the second bonding pads.Type: GrantFiled: February 22, 2022Date of Patent: October 22, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chien-Yuan Huang, Shih-Chang Ku, Chuei-Tang Wang, Chen-Hua Yu
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Patent number: 12121988Abstract: A heat transmitting device is provided, including a main body and an integrating portion. The main body has at least one opening. The integrating portion is used to seal the opening, and has a first surface and a second surface opposite the first surface. A first welding pattern is formed on the first surface, a second welding pattern is formed on the second surface, and the position of the first welding pattern corresponds to that of the second welding pattern. The type of the first welding pattern and the type of the second welding pattern are asymmetric.Type: GrantFiled: July 17, 2023Date of Patent: October 22, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Shih-Lin Huang, Tai-De Qi, Zhen-Hua Li
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Patent number: 12126393Abstract: This disclosure describes methods, systems, and devices for measuring a reference signal received power (RSRP) in a user equipment (UE) that operates in machine type communication (MTC). In one example, a method involves receiving, from a radio access network (RAN) serving the UE, a resynchronization signal (RSS). The method also involves calculating a reference signal received power (RSRP) of the RSS.Type: GrantFiled: March 27, 2020Date of Patent: October 22, 2024Assignee: Apple Inc.Inventors: Hua Li, Yang Tang, Jie Cui, Qiming Li, Rui Huang
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Patent number: 12126995Abstract: In one embodiment, a method for secured communication between a medical sensor and a computing device includes receiving, by the medical sensor, an authentication request from the computing device. The method includes generating, based on values provided in the authentication request, a challenge-response message for the computing device. The method includes receiving, from the computing device, a responsive challenge-response message. The method includes verifying that the responsive challenge-response message includes an expected value and corresponds to an expected format. The method includes, in response to verifying the responsive challenge-response message, sending a sensor secret value to the computing device.Type: GrantFiled: September 1, 2021Date of Patent: October 22, 2024Assignee: ABBOTT DIABETES CARE INC.Inventors: Xuandong Hua, Kurt E. Leno, Tony S. Lee, Kevin M. Ow-Wing, Danny Chan, Victor Paishi Huang
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Publication number: 20240345130Abstract: A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.Type: ApplicationFiled: June 26, 2024Publication date: October 17, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jian-Ting Chen, Cheng-Han Huang, Kuang-Hua Wang
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Publication number: 20240344241Abstract: Disclosed are proteinaceous coagulation factor XIIa (FXIIa) inhibitors and their use for treating or inhibiting the development of a condition in which inhibiting FXIIa stimulates or effects treatment or inhibition of the development of the condition. Suitable conditions include thromboembolism-associated conditions such as acute coronary syndrome, stroke, deep vein thrombosis and pulmonary embolism, a thrombosis, a thrombosis-associated hematologic disorder such as sickle cell disease or thrombophilia, and an inflammatory condition or a condition related to the kallikrein-kinin system such as hereditary angioedema, multiple sclerosis, rheumatoid arthritis or lupus. The proteinaceous FXIIa inhibitors are also useful for treating or inhibiting thrombus and/or embolus formation. In vitro methods for identifying a disulfide rich peptide which binds to a target substance are also disclosed.Type: ApplicationFiled: October 14, 2022Publication date: October 17, 2024Inventors: David James CRAIK, Simon John DE VEER, Yen-Hua HUANG, Joakim Erik SWEDBERG, Hiroaki SUGA, Wenyu LIU, Toby PASSIOURA
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Publication number: 20240345153Abstract: A GIS partial discharge diagnosing method, a model training method, a device and a system are disclosed. Sensor modules are in communication with each other, so that sensor network position distribution data of each sensor module in a wireless transmission network can be determined. In a training process of a partial discharge diagnosing model, a spatial-temporal feature of the partial discharge is introduced, so that the trained partial discharge diagnosing model is adaptive to different GIS equipment and different sensors layout solutions, and has better model universality and applicability, thus greatly saving a training time of the model and expediting the deployment of the partial discharge diagnosing model. Moreover, the model trained in the present disclosure accounts for the relationship between the position where partial discharge occurs and the sensor network position distribution.Type: ApplicationFiled: August 30, 2023Publication date: October 17, 2024Inventors: Xiaobo Yi, Kai YANG, Jianming WU, Hua ZHANG, Chusheng MIAO, Maowen HAN, Hairong LIN, Haojin HUANG, Laijin FANG
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Publication number: 20240349616Abstract: A method for fabricating magnetoresistive random-access memory cells (MRAM) on a substrate is provided. The substrate is formed with a magnetic tunneling junction (MTJ) layer thereon. When the MTJ layer is etched to form the MRAM cells, there may be metal components deposited on a surface of the MRAM cells and between the MRAM cells by chemical reaction. The metal components are then removed by chemical reaction.Type: ApplicationFiled: June 27, 2024Publication date: October 17, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chang-Lin YANG, Chung-Te LIN, Sheng-Yuan CHANG, Han-Ting LIN, Chien-Hua HUANG
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Publication number: 20240347608Abstract: A semiconductor device is disclosed. The semiconductor device includes a semiconducting material layer, a gate electrode under the semiconducting material layer, a pair of contact terminals over the semiconducting material layer, and a hydrogen-blocking dielectric layer on the semiconducting material layer. The pair of contact terminals penetrates through the hydrogen-blocking dielectric layer to be in contact with the semiconducting material layer at a contact surface, and the contact surface is substantially coplanar with and levelled with an interface between the hydrogen-blocking dielectric layer and the semiconducting material layer.Type: ApplicationFiled: April 12, 2023Publication date: October 17, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi-Cheng Chu, Chien-Hua Huang, Katherine H. CHIANG, Yu-Ming Lin, Chung-Te Lin