Abstract: Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for cell identification (ID) and beam ID detections in new radio (NR). The detections comprise NR primary synchronization signal (PSS)/secondary synchronization signal (SSS) detection, PBCH DMRS detection, SS reference signal received power (RSRP) measurement, and slot/SS burst boundary timing acquiring. Various embodiments describe how to detect a cell ID and a beam ID in millimeter wave (mmWave) operation. Other embodiments describe further details regarding how to detect NR cell and beam ID during intra-frequency measurements.

Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.

Abstract: A semiconductor device includes a first transistor and a protection structure. The first transistor includes a gate electrode, a gate dielectric disposed on the gate electrode, and a channel layer disposed on the gate dielectric. The protection structure is laterally surrounding the gate electrode, the gate dielectric and the channel layer of the first transistor. The protection structure includes a first capping layer and a dielectric portion. The first capping layer is laterally surrounding and contacting the gate electrode, the gate dielectric and the channel layer of the first transistor. The dielectric portion is disposed on the first capping layer and laterally surrounding the first transistor.

Abstract: A handheld controller is adapted to control an electronic device. The handheld controller includes a first body, a second body, and a connecting portion. The first body is adapted to be held by a user's hand. The second body is connected to the first body through the connecting portion. The connecting portion is adapted to be clamped between user's fingers. A distance between the first body and at least a portion of the second body is variable.

Abstract: An electrical connection assembly includes two electrical connectors and a bridge connector. Each of the two electrical connectors includes plural terminals and an insulation housing that accommodates the terminals. The bridge connector is located between the two electrical connectors. The bridge connector includes an insulation body, a conductive plastic, plural signal terminals, and plural ground terminals. The conductive plastic is covered by the insulation body. The ground terminals and the signal terminals of the bridge connector are arranged at intervals. The ground terminals of the bridge connector are in electrical contact with the conductive plastic. When two opposite sides of the insulation body are respectively coupled to the two electrical connectors so as to be surrounded by the two electrical connectors, the ground terminals of the bridge connector are respectively in electrical contact with the ground terminals of the two electrical connectors.

Abstract: An electronic device is provided, including a main body and a camera module. The camera module has a frame, a lens unit disposed in the frame, a guiding member, and a hinge. The guiding member is affixed to the main body and has a rail and a spring sheet. The hinge pivotally connects to the frame and the guiding member. When the camera module is in the retracted position, the camera module is hidden in a recess of the main body. When the camera module slides out of the recess from the retracted position along the rail into the operational position, the spring sheet is pressed by the hinge to increase the friction between the hinge and the guiding member.

Abstract: Disclosed are pyrazole compounds represented by formula (I), pharmaceutical compositions containing such compounds, a method for preparing such compounds, and use of the pyrazole compounds and the pharmaceutical compositions. Such compounds are useful for inhibiting IRAK family kinases, and also useful for treating diseases caused by IRAK family kinases, such as autoimmune diseases, inflammatory diseases and cancers.

Abstract: Disclosed are a polyethylene glycol conjugate drug, and a preparation method therefor and the use thereof. Specifically, the present invention relates to a polyethylene glycol conjugate drug represented by formula A or a pharmaceutically acceptable salt thereof, a method for preparing the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, an intermediate for preparing the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, a pharmaceutical composition comprising the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof, and the use of the polyethylene glycol conjugate drug or the pharmaceutically acceptable salt thereof in the preparation of a drug.

Abstract: The present disclosure provides a method for testing an internal force increment of an arch bridge suspender by inertial measurement, including the following steps: (1) selecting a suspender to be tested with internal force increment, and mounting an acceleration sensing device or a speed sensing device at a lower edge of the suspender to be tested; (2) setting an appropriate sampling frequency and collecting signals; (3) processing information data collected in step (2) by using Formulas; and (4) recording a result of the information data processing and obtaining the internal force increment of the suspender. The method can obtain the internal force increment of the suspender by collecting acceleration or speed signals of the lower edge of the suspender and performing calculation from the signals. This method has the advantages of simple and convenient testing, high replicability and low test cost.

Abstract: A method of determining the reliability of a high-voltage PMOS (HVPMOS) device includes determining a bulk resistance of the HVPMOS device, and evaluating the reliability of the HVPMOS device based on the bulk resistance.

Abstract: The disclosure discloses a method for generating a conversation, an electronic device, and a storage medium. The detailed implementation includes: obtaining a current conversation and historical conversations of the current conversation; selecting multiple reference historical conversations from the historical conversations and adding the multiple reference historical conversations to a temporary conversation set; and generating reply information of the current conversation based on the current conversation and the temporary conversation set.

Abstract: An electrical connector is configured to couple to a butt plug. The electrical connector includes an insulation body, plural signal terminals, plural ground terminals, and at least one conductive plastic. The insulation body has a tongue portion. The signal terminals are located in the insulation body. The ground terminals are located in the insulation body, and the ground terminals and the signal terminals are arranged at intervals. The conductive plastic is located on the tongue portion of the insulation body and is disposed along the tongue portion. When the tongue portion of the insulation body is coupled to the butt plug so as to be surrounded by the butt plug, plural ground terminals of the butt plug are in electrical contact with the conductive plastic.

Abstract: An electrical connector is configured to couple to a butt plug. The electrical connector includes an insulation body, plural signal terminals, plural ground terminals, and at least one conductive plastic. The insulation body has an accommodating recess. The signal terminals are located in the accommodating recess. The ground terminals are located in the accommodating recess, and the ground terminals and the signal terminals are arranged at intervals. The conductive plastic is located on a top surface of the insulation body facing the butt plug. When the butt plug is inserted into the accommodating recess of the insulation body, plural ground terminals of the butt plug are in electrical contact with the conductive plastic.

Abstract: A package structure is provided. The package structure includes a conductive structure having a first portion and a second portion, and the second portion is wider than the first portion. The package structure also includes a semiconductor chip laterally separated from the conductive structure. The package structure further includes a protective layer laterally surrounding the conductive structure and the semiconductor chip. The first portion of the conductive structure has a sidewall extending from the second portion to a surface of the protective layer. The protective layer laterally surrounds an entirety of the sidewall of the first portion.

Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.

Abstract: A laser diode includes a substrate, an epitaxial structure, an electrode contacting layer and an optical cladding layer. The epitaxial structure is disposed on the substrate, and is formed with a ridge structure opposite to the substrate. The electrode contacting layer is disposed on a top surface of the ridge structure. The optical cladding layer has a refractive index smaller than that of the electrode contacting layer. The optical cladding layer includes a first cladding portion which covers side walls of the ridge structure, and a second cladding portion which is disposed on a portion of the top surface of the ridge structure. A method for manufacturing the abovementioned laser diode is also disclosed.

Abstract: An electronic device is provided and includes a circuit substrate and a light emitting chip. The light emitting chip is disposed on the circuit substrate, and the light emitting chip includes a first light emitting diode and a second light emitting diode electrically connected to each other. The first light emitting diode has a first light distribution curve, the second light emitting diode has a second light distribution curve, and the first light distribution curve is different from the second light distribution curve.

Abstract: A device includes an integrated circuit die attached to a substrate; a lid attached to the integrated circuit die; a sealant on the lid; a spacer structure attached to the substrate adjacent the integrated circuit die; and a cooling cover attached to the spacer structure, wherein the cooling cover extends over the lid, wherein the cooling cover attached to the lid by the sealant. In an embodiment, the device includes a ring structure on the substrate, wherein the ring structure is between the spacer structure and the integrated circuit die.

Abstract: In an embodiment, a method includes: aligning a first package component with a second package component, the first package component having a first region and a second region, the first region including a first conductive connector, the second region including a second conductive connector; performing a first laser shot on a first portion of a top surface of the first package component, the first laser shot reflowing the first conductive connector of the first region, the first portion of the top surface of the first package component completely overlapping the first region; and after performing the first laser shot, performing a second laser shot on a second portion of the top surface of the first package component, the second laser shot reflowing the second conductive connector of the second region, the second portion of the top surface of the first package component completely overlapping the second region.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.