Patents by Inventor Hua Huang

Hua Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10816801
    Abstract: The present invention is directed to wearable display technologies. More specifically, various embodiments of the present invention provide wearable augmented reality glasses incorporating projection display systems where one or more laser diodes are used as light source for illustrating images with optical delivery to the eye using transparent waveguides. In one set of embodiments, the present invention provides wearable augmented reality glasses incorporating projector systems that utilize transparent waveguides and blue and/or green laser fabricated using gallium nitride containing material. In another set of embodiments, the present invention provides wearable augmented reality glasses incorporating projection systems having digital lighting processing engines illuminated by blue and/or green laser devices with optical delivery to the eye using transparent waveguides.
    Type: Grant
    Filed: March 6, 2018
    Date of Patent: October 27, 2020
    Assignee: Soraa Laser Diode, Inc.
    Inventors: Paul Rudy, James W. Raring, Eric Goutain, Hua Huang
  • Patent number: 10818248
    Abstract: A display panel is disclosed, which includes: a first substrate; a second substrate opposite to the first substrate; a liquid crystal layer disposed between the first and second substrate; a shielding pattern disposed on the second substrate and defining a first region and a second region, wherein a transmittance of the first region is larger than a transmittance of the second region; a first polymer layer disposed on a side of the first substrate facing to the second substrate; and a second polymer layer disposed on a side of the second substrate facing to the first substrate, wherein a roughness of a first area of the first polymer layer is different from a roughness of a second area of the second polymer layer, the second area overlaps with the first region, and the first area overlaps with a projection of the first region on the first polymer layer.
    Type: Grant
    Filed: July 5, 2018
    Date of Patent: October 27, 2020
    Assignee: INNOLUX CORPORATION
    Inventors: I-Hua Huang, Wan-Shan Yang, Chun-Teng Chen, Yu-Ju Chen, Kuei-Ling Liu
  • Publication number: 20200335452
    Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.
    Type: Application
    Filed: April 18, 2019
    Publication date: October 22, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Li-Hua TAI, Pai-Chou LIU, Yun-Chih FEI, Wen-Pin HUANG, Sheng-Hong ZHENG
  • Publication number: 20200333605
    Abstract: The present invention is directed to wearable display technologies. More specifically, various embodiments of the present invention provide wearable augmented reality glasses incorporating projection display systems where one or more laser diodes are used as light source for illustrating images with optical delivery to the eye using transparent waveguides. In one set of embodiments, the present invention provides wearable augmented reality glasses incorporating projector systems that utilize transparent waveguides and blue and/or green laser fabricated using gallium nitride containing material. In another set of embodiments, the present invention provides wearable augmented reality glasses incorporating projection systems having digital lighting processing engines illuminated by blue and/or green laser devices with optical delivery to the eye using transparent waveguides.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Inventors: Paul Rudy, James W. Raring, Eric Goutain, Hua Huang
  • Publication number: 20200334799
    Abstract: A recognition method of pattern feature is provided, where a recognition result thereof is applied to optical proximity correction, the method includes: providing a plurality of reference images with a reference pattern feature; recognizing and classifying the reference images by an image recognition device, and storing the recognition result; comparing the image with the actual pattern feature with the stored recognition result by the image recognition device to recognize and classify the image with the actual pattern feature; and calculating an angle feature value and/or a distance feature value of the actual pattern feature by the image recognition device according to a classification result to obtain the recognition result of the pattern feature.
    Type: Application
    Filed: April 16, 2019
    Publication date: October 22, 2020
    Applicant: Winbond Electronics Corp.
    Inventors: Ching-Ya Huang, Tso-Hua Hung
  • Patent number: 10809561
    Abstract: A display panel includes a substrate, an opposite substrate opposite to the substrate, a liquid crystal layer disposed between the substrate and the opposite substrate, a pixel array disposed between the substrate and the liquid crystal layer, and first polarized patterns. The pixel array includes a plurality of scan lines, a plurality of data lines, a plurality of active devices, and a plurality of first electrodes. The active devices are electrically connected to the scan lines and the data lines. The first electrodes are disposed on the substrate. Each of the first electrodes includes a plurality of slits. The first polarized patterns overlap with the first electrodes in a direction perpendicular to the substrate. The first polarized patterns are disposed between the substrate and the opposite substrate. An extending direction of the first polarized patterns is different from an extending direction of the slits.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: October 20, 2020
    Assignee: Au Optronics Corporation
    Inventors: Yen-Hua Lo, Hsin-Chun Huang, Wen-Rei Guo, Hsing-Yi Hsieh
  • Patent number: 10811404
    Abstract: Provided are a package structure and a method of manufacturing the same. The package structure includes a die, a passive device, and a package. The die has a front side and a backside opposite to each other. The package is disposed on the backside of the die. The passive device is disposed between the backside of the die and the package.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: October 20, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Ya Huang, Chung-Hao Tsai, Chen-Hua Yu, Chuei-Tang Wang
  • Patent number: 10812017
    Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: October 20, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi Sheng Tseng, Lu-Ming Lai, Ching-Han Huang, Hui-Chung Liu, Kuo-Hua Lai, Cheng-Ling Huang
  • Patent number: 10811394
    Abstract: A method includes attaching a first-level device die to a dummy die, encapsulating the first-level device die in a first encapsulating material, forming through-vias over and electrically coupled to the first-level device die, attaching a second-level device die over the first-level device die, and encapsulating the through-vias and the second-level device die in a second encapsulating material. Redistribution lines are formed over and electrically coupled to the through-vias and the second-level device die. The dummy die, the first-level device die, the first encapsulating material, the second-level device die, and the second encapsulating material form parts of a composite wafer.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: October 20, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin, Chin-Chuan Chang, Hsien-Wei Chen, Wei-Cheng Wu, Li-Hsien Huang, Chi-Hsi Wu, Der-Chyang Yeh
  • Publication number: 20200327214
    Abstract: A device package includes a sensor die, one or more additional dies adjacent the sensor die, and a molding compound encircling the sensor die and the one or more additional dies. The device package further includes redistribution layers over the sensor die, the one or more additional dies, and the molding compound. The redistribution layers include first conductive features in a first dielectric layer. The first conductive features electrically connect the sensor die to the one or more additional dies. The redistribution layers further include an array of electrodes in a second dielectric layer over the first dielectric layer and electrically connected to the sensor die.
    Type: Application
    Filed: June 29, 2020
    Publication date: October 15, 2020
    Inventors: Yu-Chih Huang, Chih-Hsuan Tai, Yu-Jen Cheng, Chih-Hua Chen, Yu-Feng Chen, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20200326583
    Abstract: A display device includes a display module, a lens module and a transparent cover. The display module is provided with a lens area and a display area disposed outside the lens area. The display module is provided with a prism layer surrounding the lens area. The lens module is disposed in the lens area. The transparent cover covers the display module.
    Type: Application
    Filed: October 8, 2019
    Publication date: October 15, 2020
    Applicant: Au Optronics Corporation
    Inventors: Cheng-Hsing Lin, Yen-Hua Lo, Hsin-Chun Huang
  • Patent number: 10801324
    Abstract: Single expander device working with two working media in a two-stage organic Rankine cycle, which has a cylinder body, a rotor disposed inside the cylinder body and provided with a number of slip sheets in a radial direction of the cylinder body, and a rotary shaft fixedly connected to the center of the rotor, with the outer profile of the cylinder body defined by two mathematical equations.
    Type: Grant
    Filed: July 24, 2015
    Date of Patent: October 13, 2020
    Assignee: Tianjin University
    Inventors: Gequn Shu, Lingfeng Shi, Hua Tian, Guangdai Huang, Xiaoya Li
  • Publication number: 20200321288
    Abstract: A method includes embedding a die in a molding material; forming a first dielectric layer over the molding material and the die; forming a conductive line over an upper surface of the first dielectric layer facing away from the die; and forming a second dielectric layer over the first dielectric layer and the conductive line. The method further includes forming a first trench opening extending through the first dielectric layer or the second dielectric layer, where a longitudinal axis of the first trench is parallel with a longitudinal axis of the conductive line, and where no electrically conductive feature is exposed at a bottom of the first trench opening; and filling the first trench opening with an electrically conductive material to form a first ground trench.
    Type: Application
    Filed: June 22, 2020
    Publication date: October 8, 2020
    Inventors: Shih-Ya Huang, Chung-Hao Tsai, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang
  • Publication number: 20200306870
    Abstract: A heat transmitting device is provided, including a main body and an integrating portion. The main body has at least one opening. The integrating portion is used to seal the opening, and has a first surface and a second surface opposite the first surface. A first welding pattern is formed on the first surface, a second welding pattern is formed on the second surface, and the position of the first welding pattern corresponds to that of the second welding pattern. The type of the first welding pattern and the type of the second welding pattern are asymmetric.
    Type: Application
    Filed: March 3, 2020
    Publication date: October 1, 2020
    Inventors: Shih-Lin HUANG, Tai-De QI, Zhen-Hua LI
  • Patent number: 10790244
    Abstract: In an embodiment, a device includes: a conductive shield on a first dielectric layer; a second dielectric layer on the first dielectric layer and the conductive shield, the first and second dielectric layers surrounding the conductive shield, the second dielectric layer including: a first portion disposed along an outer periphery of the conductive shield; a second portion extending through a center region of the conductive shield; and a third portion extending through a channel region of the conductive shield, the third portion connecting the first portion to the second portion; a coil on the second dielectric layer, the coil disposed over the conductive shield; an integrated circuit die on the second dielectric layer, the integrated circuit die disposed outside of the coil; and an encapsulant surrounding the coil and the integrated circuit die, top surfaces of the encapsulant, the integrated circuit die, and the coil being level.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: September 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Chen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng
  • Patent number: 10786551
    Abstract: The present invention relates to use of interleukin-22 (IL-22) for treating fatty liver disease by decreasing the levels of transaminases. The use of IL-22 in decreasing the levels of transaminases is also provided.
    Type: Grant
    Filed: September 1, 2017
    Date of Patent: September 29, 2020
    Assignee: Generon (Shanghai) Corporation Ltd.
    Inventors: Yu Liang Huang, Zhi Hua Huang, Qi Sun
  • Patent number: 10790261
    Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.
    Type: Grant
    Filed: September 5, 2018
    Date of Patent: September 29, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai, Hsiu-Jen Lin, Ching-Hua Hsieh, Chen-Hua Yu, Chung-Shi Liu
  • Publication number: 20200303352
    Abstract: A package structure comprising: a substrate, having at least one conductive units provided at a first surface of the substrate; at least one first die, provided on a second surface of the substrate; a connecting layer, provided on the first die; a second die, provided on the connecting layer, wherein the connecting layer comprises at least one bump for connecting the first die; and at least one bonding wire. The connecting layer has a first touch side and a second touch side, the first touch side contacts a first surface of the first die and the second touch side contacts a second surface of the second die, an area of the first touch side is smaller than which for the first surface of the first die, and a size of the first die equals to which of the second die.
    Type: Application
    Filed: June 11, 2020
    Publication date: September 24, 2020
    Applicant: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang, Ming-Tzong Yang
  • Publication number: 20200303275
    Abstract: A package includes a device die, a through-via having a sand timer profile, and a molding material molding the device die and the through-via therein, wherein a top surface of the molding material is substantially level with a top surface of the device die. A dielectric layer overlaps the molding material and the device die. A plurality of redistribution lines (RDLs) extends into the dielectric layer to electrically couple to the device die and the through-via.
    Type: Application
    Filed: June 8, 2020
    Publication date: September 24, 2020
    Inventors: Cheng-Lin Huang, Jung-Hua Chang, Jy-Jie Gau, Jing-Cheng Lin
  • Publication number: 20200303919
    Abstract: Provided are a differential protection method and system, applied to a multi-terminal T-connection transmission line. The method includes: selecting two slaves without a connection and connecting the two slaves to construct a slave group; determining a target slave and an auxiliary slave in the slave group, where a first communication path is connected along a channel one, a channel two and a channel three, and a second communication path is connected along the channel three, the channel two and the channel one; transmitting, by the target slave, two frames of messages, and acquiring a delay difference between a transceiving delay of the first communication path and a transceiving delay of the second communication path, where a first frame of messages is transmitted to the target slave via the first communication path, a second frame of messages is transmitted to the target slave via the second communication path.
    Type: Application
    Filed: December 27, 2018
    Publication date: September 24, 2020
    Applicants: TAIZHOU POWER SUPPLY COMPANY OF STATE GRID ZHEJIANG ELECTRIC POWER, STATE GRID CORPORATION OF CHINA
    Inventors: Ping ZHAO, Yiping SHEN, Yutao QIU, Hua XU, Hao TAN, Rijun WANG, Yuande ZHENG, Hao LI, Zaibing ZHOU, Guode YING, Kang WANG, Jian WU, Tao ZHU, Ben LI, Xiaochun XU, Qingchun ZHAO, Xiaotong ZHU, Zhen HUANG