Patents by Inventor Hua Huang

Hua Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240012499
    Abstract: A touch sensor includes a substrate, sensing channels, and a protective layer. The sensing channels are disposed at intervals on a surface of the substrate, and any one of the sensing channels includes an electrode portion and a silver trace portion electrically connected to the electrode portion. The protective layer is disposed on the substrate and covers and encapsulates the sensing channels. After the touch sensor is subjected to a salt spray test with sodium chloride solution of a mass percentage concentration of 5% at a rate of 1 mL/H to 2 mL/H under an ambient temperature of 35° C. for 48 hours, a resistance change rate of any one of the sensing channels is less than or equal to 10%, and a resistance distribution difference between the sensing channels is less than or equal to 10%.
    Type: Application
    Filed: September 26, 2023
    Publication date: January 11, 2024
    Inventors: Shao Jie LIU, Si Qiang XU, Chien Hsien YU, Chia Jui LIN, Jian ZHANG, Wei Na CAO, Mei Fang LAN, Jun Hua HUANG, Mei Fen BAI, Song Xin WANG
  • Patent number: 11865588
    Abstract: A probe pin cleaning pad including a release layer or composite plate, an adhesive layer, a substrate layer, a cleaning layer, and a polishing layer is provided. The adhesive layer is disposed on the release layer or composite plate. The substrate layer is disposed on the adhesive layer. The cleaning layer is disposed on the substrate layer. The polishing layer is disposed on the cleaning layer. A cleaning method for a probe pin is also provided.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: January 9, 2024
    Assignee: Alliance Material Co., Ltd.
    Inventors: Chun-Fa Chen, Chi-Hua Huang, Yu-Hsuen Lee, Ching-Wen Hsu, Chao-Hsuan Yang, Ting-Wei Lin, Chin-Kai Lin, Chen-Ju Lee
  • Patent number: 11870219
    Abstract: A laser diode includes a substrate, an epitaxial structure, an electrode contacting layer and an optical cladding layer. The epitaxial structure is disposed on the substrate, and is formed with a ridge structure opposite to the substrate. The electrode contacting layer is disposed on a top surface of the ridge structure. The optical cladding layer has a refractive index smaller than that of the electrode contacting layer The optical cladding layer includes a first cladding portion which covers side walls of the ridge structure, and a second cladding portion which is disposed on a portion of the top surface of the ridge structure. A method for manufacturing the abovementioned laser diode is also disclosed.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: January 9, 2024
    Assignee: Quanzhou San'An Semiconductor Technology Co., Ltd.
    Inventors: Zhibai Zhong, Tao Ye, Min Zhang, Shao-Hua Huang, Shuiqing Li
  • Patent number: 11862612
    Abstract: Various embodiments of the present disclosure are directed towards a three-dimensional (3D) trench capacitor, as well as methods for forming the same. In some embodiments, a first substrate overlies a second substrate so a front side of the first substrate faces a front side of the second substrate. A first trench capacitor and a second trench capacitor extend respectively into the front sides of the first and second substrates. A plurality of wires and a plurality of vias are stacked between and electrically coupled to the first and second trench capacitors. A first through substrate via (TSV) extends through the first substrate from a back side of the first substrate, and the wires and the vias electrically couple the first TSV to the first and second trench capacitors. The first and second trench capacitors and the electrical coupling therebetween collectively define the 3D trench capacitor.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: January 2, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xin-Hua Huang, Chung-Yi Yu, Yeong-Jyh Lin, Rei-Lin Chu
  • Patent number: 11860494
    Abstract: Disclosed are a liquid crystal display panel and a liquid crystal display device. The liquid crystal display panel includes: a liquid crystal display structure, the liquid crystal display structure including: a plurality of first gate lines extending in a row direction, a plurality of first data lines extending in a column direction, and a plurality of sub-pixel units defined by the plurality of first gate lines and the plurality of first data lines; and a liquid crystal light control structure located on a light incident side of the liquid crystal display structure, the liquid crystal light control structure including: a plurality of second data lines, an orthographic projection of at least one second data line on the liquid crystal display structure overlapping the plurality of sub-pixel units.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: January 2, 2024
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Xuefei Sun, Xue Dong, Shunhang Zhang, Xinxing Wang, Hua Huang
  • Publication number: 20230414683
    Abstract: The present invention relates to an antioxidant, anti-inflammatory and whitening composition containing skin-derived lactic acid bacteria. In particular, the present invention relates to: an antioxidant, anti-inflammatory or whitening functional cosmetic composition, a food composition, a pharmaceutical composition for preventing or treating inflammation-related skin disease, and a pharmaceutical composition for preventing or treating melanin hyperpigmentation disease, which contain, as an active ingredient, a Lactobacillus plantarum subsp. shebah-202 (accession number: KCTC14087BP) strain, a Lactobacillus fermentum subsp. shebah-101 (accession number: KCTC14086BP) strain or a Lactobacillus paraplantarum subsp. shebah-401 (accession number: KCTC14088BP) strain, which is a novel lactic acid bacteria strain isolated and identified from human skin, a culture thereof, a lysate thereof, or an extract thereof.
    Type: Application
    Filed: October 12, 2021
    Publication date: December 28, 2023
    Inventors: Yoon-Soo CHO, Hye-won LIM, Chang-jin LIM, Yu-hua HUANG, Yong-wan CHO
  • Publication number: 20230418843
    Abstract: Methods and systems are described herein for improving data processing efficiency of classifying user files in a database. More particularly, methods and systems are described herein for improving data processing efficiency of classifying user files in a database in which the user files have a temporal element. The methods and system described herein accomplish these improvements by introducing time dependency into time-homogeneous probability models. Once time dependency has been introduced into the time-homogeneous probability models, these models may be used to improve the data processing efficiency of classifying the user files that feature a temporal element.
    Type: Application
    Filed: September 7, 2023
    Publication date: December 28, 2023
    Applicant: Capital One Services, LLC
    Inventors: Hao Hua HUANG, Bjorn KWOK
  • Patent number: 11854795
    Abstract: A method includes performing a plasma activation on a surface of a first package component, removing oxide regions from surfaces of metal pads of the first package component, and performing a pre-bonding to bond the first package component to a second package component.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Xin-Hua Huang, Ping-Yin Liu, Hung-Hua Lin, Hsun-Chung Kuang, Yuan-Chih Hsieh, Lan-Lin Chao, Chia-Shiung Tsai, Xiaomeng Chen
  • Patent number: 11851318
    Abstract: A microelectromechanical system device includes a substrate, a dielectric layer, an electrode, a surface modification layer and a membrane. The dielectric layer is formed on the substrate, and is formed with a cavity that is defined by a cavity-defining wall. The electrode is formed in the dielectric layer. The surface modification layer covers the cavity-defining wall, and has a plurality of hydrophobic end groups. The membrane is connected to the dielectric layer, and seals the cavity. The membrane is movable toward or away from the electrode. A method for making a microelectromechanical system device is also provided.
    Type: Grant
    Filed: April 22, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Chuan Teng, Ching-Kai Shen, Jung-Kuo Tu, Wei-Cheng Shen, Xin-Hua Huang, Wei-Chu Lin
  • Patent number: 11854999
    Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes bonding structure arranged directly between a first substrate and a second substrate. The first substrate includes a first transparent material and a first alignment mark. The first alignment mark is arranged on an outer region of the first substrate and also includes the first transparent material. The first alignment mark is defined by surfaces of the first substrate that are arranged between an uppermost surface of the first substrate and a lowermost surface of the first substrate. The second substrate includes a second alignment mark on an outer region of the second substrate. The second alignment mark directly underlies the first alignment mark, and the bonding structure is arranged directly between the first alignment mark and the second alignment mark.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: December 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Xin-Hua Huang, Ping-Yin Liu
  • Patent number: 11856854
    Abstract: Semiconductor structure and methods of forming the same are provided. An exemplary method includes receiving a workpiece including a magnetic tunneling junction (MTJ) and a conductive capping layer disposed on the MTJ, depositing a first dielectric layer over the workpiece, performing a first planarization process to the first dielectric layer, and after the performing of the first planarization process, patterning the first dielectric layer to form an opening exposing a top surface of the conductive capping layer, selectively removing the conductive capping layer. The method also includes depositing an electrode layer to fill the opening and performing a second planarization process to the workpiece such that a top surface of the electrode layer and a top surface of the first dielectric layer are coplanar.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Feng Yin, Min-Kun Dai, Chien-Hua Huang, Chung-Te Lin
  • Publication number: 20230407180
    Abstract: A polymerizable compound having absorption in the long UV wavelength range, a liquid-crystal (LC) medium comprising the polymerizable compound, and the use of the compound or LC medium for optical, electro-optical and electronic purposes, in particular in LC displays, especially in LC displays of the PSA (polymer sustained alignment) or SA (self-aligning) mode, an LC display of the PSA or SA mode comprising the compound or LC medium, and a process of manufacturing the LC display.
    Type: Application
    Filed: November 3, 2021
    Publication date: December 21, 2023
    Applicant: Merck Patent GmbH
    Inventors: Timo Uebel, Rocco Fortte, Qiong Tong, Chia-Sheng Hsieh, I-Hua Huang, Leo Weegels
  • Patent number: 11849644
    Abstract: A method for fabricating magnetoresistive random-access memory cells (MRAM) on a substrate is provided. The substrate is formed with a magnetic tunneling junction (MTJ) layer thereon. When the MTJ layer is etched to form the MRAM cells, there may be metal components deposited on a surface of the MRAM cells and between the MRAM cells. The metal components are then removed by chemical reaction. However, the removal of the metal components may form extra substances on the substrate. A further etching process is then performed to remove the extra substances by physical etching.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: December 19, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chang-Lin Yang, Chung-Te Lin, Sheng-Yuan Chang, Han-Ting Lin, Chien-Hua Huang
  • Publication number: 20230401420
    Abstract: A system receives a neural network model that includes asymmetric operations. Each asymmetric operation includes one or more fixed-point operands that are asymmetrically-quantized from corresponding floating-point operands. The system compiles a given asymmetric operation of the neural network model into a symmetric operation that includes a combined bias value. A compiler computes the combined bias value is a constant by merging at least zero points of input and output of the given asymmetric operation. The system then generates a symmetric neural network model including the symmetric operation for inference hardware to execute in fixed-point arithmetic.
    Type: Application
    Filed: June 12, 2022
    Publication date: December 14, 2023
    Inventors: Chih-Wen Goo, Pei-Kuei Tsung, Chih-Wei Chen, Mingen Shih, Shu-Hsin Chang, Po-Hua Huang, Ping-Yuan Tsai, Shih-Wei Hsieh, You Yu Nian
  • Patent number: 11832754
    Abstract: A lid structure, which is used for covering an opening of a container, includes a mainbody, an elastic annular element, and a covering assembly. The mainbody includes a through hole. The elastic annular element is integrally disposed on a peripheral region of the mainbody, wherein the elastic annular element is used for positioning the lid structure on the opening. The covering assembly is disposed on the mainbody and includes a spacer element and a covering element. The spacer element is disposed on and covers the through hole. The spacer element includes a plurality of drain holes and a central connecting portion. The covering element is deformably disposed on the central connecting portion.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: December 5, 2023
    Assignee: CHANG YANG MATERIAL CO., LTD.
    Inventors: Ming Hua Huang, Lung Hsun Song, Yun Ju Wu, Hung Yu Hsieh, Lin Chun Sun
  • Publication number: 20230389170
    Abstract: A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.
    Type: Application
    Filed: June 20, 2022
    Publication date: November 30, 2023
    Inventors: HUAN-YU HE, MEI-HUA HUANG, BIAO LI, JIN-CHENG WU
  • Patent number: 11829539
    Abstract: A touch sensor having a visible area and a peripheral area includes a substrate, a metal nanowire layer, and a silver layer. The metal nanowire layer is disposed on a main surface of the substrate and defines an electrode portion and first and second wirings, in which the first wiring includes a lead-out portion connected to the electrode portion and a lead portion connected to the lead-out portion, and the second wiring is disposed on a side of the first wiring relatively away from the visible area and adjacent to an edge of the main surface. The silver layer is stacked on the first and second wirings and has a first side facing toward the visible area and a second side facing away from the visible area, and an edge roughness on the first side is greater than an edge roughness on the second side.
    Type: Grant
    Filed: May 16, 2022
    Date of Patent: November 28, 2023
    Assignee: TPK ADVANCED SOLUTIONS INC.
    Inventors: Shao Jie Liu, Chia Jui Lin, Chien Hsien Yu, Jian Zhang, Si Qiang Xu, Jun Hua Huang, Mei Fen Bai, Song Xin Wang, Long Yun Zhan, Bo Huang
  • Publication number: 20230380072
    Abstract: A manufacturing method of tape includes the steps of providing a tape including substrate units, providing a die device and a cutting and/or pressing process. Each of the substrate units includes a carrier, a circuit layer, an adhesive and a heat spreader, the heat spreader is attached onto the carrier by the adhesive. In the cutting and/or pressing process, the die device is provided to press the tape to generate separation protrusions on the heat spreader and allow the separation protrusions to protrude from a heat dissipation surface of the heat spreader. When rolling the tape, the separation protrusions can separate the stacked substrate units to prevent the adhesive from being squeezed out to contaminate the tape.
    Type: Application
    Filed: February 14, 2023
    Publication date: November 23, 2023
    Inventors: Yi-Hui Chen, Yi-Hua Huang, Yen-Ping Huang, Shih-Chieh Chang
  • Publication number: 20230378411
    Abstract: A driving backplate, a display panel, and a display device. The driving backplate comprises: a base substrate, comprising a display area and a fan-out area located on at least one side of the display area. The display comprises a plurality of pixel units arranged in an array, and a plurality of signal lines connected to the pixel units, and the plurality of signal lines extend in a first direction; the fan-out area comprises fan-out lines, the fan-out lines are connected to the signal lines, the fan-out line comprises a first end proximate to the display area and a second end distant from the display area, and the width of the first end is greater than the width of the second end; at least one signal line is connected to at least one fan-out line by means of a connecting line, and the connecting line extends in a second direction.
    Type: Application
    Filed: January 28, 2021
    Publication date: November 23, 2023
    Inventors: Xiaoyan ZHU, Xinhong LU, Ling LI, Hua HUANG
  • Publication number: 20230379583
    Abstract: A camera module having OIS function and its preparation method are provided. The camera module includes a housing and an optical assembly in the housing, and further includes a circuit board in the housing. The circuit board includes a first board and a second board on the first board. The first board is flexible. The first board includes a first portion, a second portion, and a third portion successively connected in an extending direction of the first board. The second portion defines a slot. The second board is on the third portion. The optical assembly is on the second board. The first portion includes a fixed end connecting the second portion and an opposite free end. The housing defines a through hole. The first portion extends through the slot to form a bent portion and extends out of the through hole, such that the free end is outside the housing.
    Type: Application
    Filed: June 29, 2021
    Publication date: November 23, 2023
    Inventors: XUE-FENG SHE, QIANG SONG, MEI-HUA HUANG, NING HOU