Patents by Inventor Hua Huang
Hua Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240369620Abstract: A method includes: positioning a wafer in a first probe chamber of a first probe apparatus by a robot arm, the first probe apparatus being adjacent a transfer rail, the robot arm, in operation, moving along the transfer rail; testing the wafer by the first probe apparatus; following the testing, transferring the wafer to an environmental buffer attached to the first probe chamber; cooling the wafer in the environmental buffer; and following the cooling, transferring the wafer from the environmental buffer to a second probe chamber of a second probe apparatus by the robot arm, the second probe apparatus being adjacent the transfer rail and offset from the first probe apparatus.Type: ApplicationFiled: November 9, 2023Publication date: November 7, 2024Inventors: Jyu-Hua HSIAO, Chin-Yu LIN, Chien Fang HUANG, Kam Heng LEE, Jiun-Rong PAI
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Publication number: 20240370109Abstract: An electrode structure includes a substrate and a silver nanowire electrode disposed on the substrate. The electrode structure can be changed from an expanded state to a bent state with a bending radius of about 2-4 mm. The electrode structure includes a bending region and a first non-bending region and a second non-bending region respectively adjacent to the bending region in the bent state. The silver nanowire electrode has a change rate of a resistance value between the bent state and the expanded state of less than 10% in an electrode section of the bending region.Type: ApplicationFiled: July 12, 2024Publication date: November 7, 2024Inventors: Jian Zhang, Si Qiang Xu, Mei Fen Bai, Wei Chuan Chao, Jun Hua Huang, Song Xin Wang, Feng Ming Xue, Long Yun Zhan, Jin Shou Huang
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Publication number: 20240367965Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure overlying a first substrate. A second substrate overlies the dielectric structure and comprises a movable element. A first bond structure is arranged between the dielectric structure and the second substrate. A second bond structure is arranged between the dielectric structure and the second substrate. At least a portion of the movable element is spaced laterally between sidewalls of the second bond structure. The first bond structure comprises a first material and the second bond structure comprises a second material different form the first material. A thickness of the first bond structure is less than a thickness of the second bond structure.Type: ApplicationFiled: July 19, 2024Publication date: November 7, 2024Inventors: Hung-Hua Lin, Chia-Ming Hung, Xin-Hua Huang, Yuan-Chih Hsieh
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Publication number: 20240370803Abstract: Systems for dynamically updating a priority queue for scheduling data operations associated with data records. A method includes: detecting event data meeting a threshold value for identifying a shift in data operation relevance and traversing a cascading data structure to identify an auditable entity corresponding to one or more data records associated with the event data, the one or more data records corresponding to at least one branch of the cascading data structure. The method includes generating an updated priority queue for scheduling data operations based on priority weights associated with branches of the cascading data structure, the updated priority queue based on event data corresponding to the identified auditable entity relative to event data associated with one or more records corresponding to other auditable entities and transmitting a signal for dynamically communicating the updated priority queue for scheduling data operations associated with data records of respective auditable entities.Type: ApplicationFiled: July 12, 2024Publication date: November 7, 2024Inventors: Kanika VIJ, Vincent Chiu-Hua HUANG, Preet Kanwal SINGH
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Publication number: 20240371858Abstract: The ability of a grounded gate NMOS (ggNMOS) device to withstand and protect against human body model (HBM) electrostatic discharge (ESD) events is greatly increased by resistance balancing straps. The resistance balancing straps are areas of high resistance formed in the substrate between an active area that includes a MOSFET of the ggNMOS device and a bulk ring that surrounds the active area. A Vss rail is coupled to the substrate beneath the MOSFET through the bulk ring. The substrate beneath the MOSFET provides base regions for parasitic transistors that switch on for the ggNMOS device to operate. The straps inhibit low resistance pathways between the base regions and the bulk ring and prevent a large portion of the ggNMOS device from being switched off while a remaining portion of the ggNMOS device remains switched on. The strap may be divided into segments inserted at strategic locations.Type: ApplicationFiled: July 19, 2024Publication date: November 7, 2024Inventors: Hsiao-Ching Huang, Sheng-Fu Hsu, Hao-Hua Hsu, Pin-Chen Chen, Lin-Yu Huang, Yu-Chang Jong
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Publication number: 20240373545Abstract: An electronic package and a manufacturing method thereof are provided, in which support members are disposed on a carrier structure having a plurality of electrical contact pads, and a conductive element is bonded on each of the electrical contact pads, and an electronic module is disposed on the carrier structure via the conductive elements, so that the support members contact and support the electronic module to prevent the electronic module from warping.Type: ApplicationFiled: April 18, 2024Publication date: November 7, 2024Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.Inventors: Hsiang-Hua HUANG, I-Tang LIU, Mu-Hsuan CHAN
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Patent number: 12136570Abstract: The present disclosure provides low resistance contacts and damascene interconnects with one or more graphene layers in fin structures of FETs. An example semiconductor device can include a substrate with a fin structure that includes an epitaxial region. The semiconductor device can also include an etch stop layer on the epitaxial region, and an interlayer dielectric layer on the etch stop layer. The semiconductor device can further include a metal contact, above the epitaxial region, formed through the etch stop layer and the interlayer dielectric layer, and a graphene film at interfaces between the metal contact and each of the epitaxial region, the etch stop layer, and the interlayer dielectric layer.Type: GrantFiled: December 14, 2021Date of Patent: November 5, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mrunal Abhijith Khaderbad, Wei-Yen Woon, Cheng-Ming Lin, Han-Yu Lin, Szu-Hua Chen, Jhih-Rong Huang, Tzer-Min Shen
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Publication number: 20240364224Abstract: An auxiliary power circuit of a conversion module is used to supply power to a control unit, and an input end of the conversion module includes an even number of energy storage units coupled in series. The auxiliary power circuit includes an even number of primary-side circuits and a secondary-side circuit. Each primary-side circuit includes a first switch unit, a second switch unit, and a resonance tank. The first switch unit is connected to the second switch unit in series, and is correspondingly connected to one of the energy storage units in parallel. The resonance tank is connected to the second switch unit in parallel. The secondary-side circuit is coupled to the resonance tanks of two of the primary-side circuits to acquire power and supply power to the control unit.Type: ApplicationFiled: July 8, 2024Publication date: October 31, 2024Inventors: Che-Wei CHANG, Wen-Lung HUANG, Sheng-Hua LI
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Publication number: 20240361999Abstract: A method of compiling a deep learning model includes reading metadata from a compiled result, the metadata indicating a structure of the deep learning model corresponding to a low-level IR, receiving shape information of an input tensor of the deep learning model, determining a shape of an output tensor of a first computation operation of the computation operations based on the shape information of the input tensor of the deep learning model and the structure of the deep learning model, tiling the output tensor of the first computation operation into one or more tiles according to the shape of the output tensor of the first computation operation and hardware limitations of a processor executing the deep learning model, and patching one or more copies of a templated hardware command into executable hardware commands.Type: ApplicationFiled: April 28, 2023Publication date: October 31, 2024Applicant: MEDIATEK INC.Inventors: Meng-Hsuan YANG, Po-hua HUANG, Hsing-Chang CHOU, Ting Chen TSAN, Yu-Lung LU
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Publication number: 20240363464Abstract: A package structure is provided. The package structure includes a die, an encapsulant, a first redistribution line (RDL) structure, a second RDL structure, and a through via. The encapsulant laterally encapsulates the die. The first redistribution line (RDL) structure on a first side of the die and the encapsulant, wherein the first RDL structure comprises a dielectric layer and a redistribution layer in the dielectric layer. The second RDL structure is located on a second side of the die and the encapsulant. The through via extends through the encapsulant and the first redistribution line structure and connecting the second RDL structure. The through via is laterally separated from the redistribution layer by the dielectric layer therebetween.Type: ApplicationFiled: July 9, 2024Publication date: October 31, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo
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Patent number: 12133101Abstract: An approach is described for a user equipment (UE), wherein the UE includes radio front end circuitry and processor circuitry coupled to the radio front end circuitry. The processor circuitry receives a reference signal from a source device via a radio link, wherein the reference signal is one of the synchronization signal block (SSB) signal or channel state information reference signal (CSI-RS). The processor circuitry measures a quality of the reference signal, and measures an evaluation time of the reference signal. The processor circuitry determines a first indicator of the radio link based on the quality of the reference signal, and determine a second indicator of the radio link based on the evaluation time of the reference signal. The processor circuitry then determines a status of a connection of the radio link based on the first indicator and the second indicator of the radio link, and generate a message based the status of the connection.Type: GrantFiled: March 30, 2020Date of Patent: October 29, 2024Assignee: APPLE INC.Inventors: Rui Huang, Qiming Li, Jie Cui, Zhibin Yu, Yang Tang, Hua Li
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Patent number: 12132042Abstract: The ability of a grounded gate NMOS (ggNMOS) device to withstand and protect against human body model (HBM) electrostatic discharge (ESD) events is greatly increased by resistance balancing straps. The resistance balancing straps are areas of high resistance formed in the substrate between an active area that includes a MOSFET of the ggNMOS device and a bulk ring that surrounds the active area. A Vss rail is coupled to the substrate beneath the MOSFET through the bulk ring. The substrate beneath the MOSFET provides base regions for parasitic transistors that switch on for the ggNMOS device to operate. The straps inhibit low resistance pathways between the base regions and the bulk ring and prevent a large portion of the ggNMOS device from being switched off while a remaining portion of the ggNMOS device remains switched on. The strap may be divided into segments inserted at strategic locations.Type: GrantFiled: July 25, 2022Date of Patent: October 29, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Hsiao-Ching Huang, Sheng-Fu Hsu, Hao-Hua Hsu, Pin-Chen Chen, Lin-Yu Huang, Yu-Chang Jong
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Patent number: 12132980Abstract: A dynamic image processing method is executed by an electronic device communicating with a photographing device and reading an executable code to identify a preset object by using artificial intelligence, and perform dynamic image processing for the preset object. The method includes the steps of identifying the preset object, image filtering and forming a concatenated video. In the step of image filtering, a filter condition is set, the filter condition includes detecting a movement variable of the preset object in the initial image, and when the filter condition meets a threshold, a catch moment in the initial image is selected. In the step of forming a concatenated video, at least one video clip in the initial image is selected according to the catch moment, and the video clip is assembled to form the concatenated video. The present disclosure also provides an electronic device and a terminal device.Type: GrantFiled: October 26, 2022Date of Patent: October 29, 2024Assignee: COMPAL ELECTRONICS, INC.Inventors: Pin-Yu Chou, Yueh-Hua Lee, Yu-Ning Chang, Ming-Hsien Wu, Yu-Syuan Huang
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Publication number: 20240353241Abstract: A platform through-beam sensor device includes a transmitter module and a receiver module. A light emitted by a light-emitting element of the transmitter module is shaped into a light pattern range by a transmitter mask. A range of the light received by a light-receiving element of the receiver module is changed to a receiving range by a receiver mask. When the present invention is used, the transmitter module and the receiver module are respectively installed on two ends of a mechanical apparatus that move relative to each other. After determining a safety range of the relative movement of the two ends, a state that the light-receiving element falls into the light pattern range and the light-emitting element falls into the receiving range is set to be within the safety range. Upon exceeding the safety range, a flying platform is controlled to stop, thereby improving the safety of the flying platform.Type: ApplicationFiled: August 25, 2023Publication date: October 24, 2024Applicant: Brogent Technologies Inc.Inventors: GUO-SEN LIAN, SHAO-HUA TSAI, CHENG-LIN HUANG, CHIH-HUANG WANG
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Publication number: 20240355906Abstract: Embodiments include a method and device resulting from the method, including using a radical oxidation process to oxidize a spacer layer which lines the opening after removing a dummy gate electrode. The oxidized layer is removed by an etching process. An STI region disposed below the dummy gate electrode may be partially etched.Type: ApplicationFiled: April 20, 2023Publication date: October 24, 2024Inventors: Shao-Hua Hsu, Chia-I Lin, Hsiu-Hao Tsao, Kai-Min Chien, Chen-Huang Huang, An Chyi Wei, Ryan Chia-Jen Chen
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Publication number: 20240354658Abstract: A method and apparatus for training a question solving model, a question solving method and apparatus, an electronic device and a readable storage medium are disclosed. The method for training a question solving model includes: acquiring a first sample question; inputting the first sample question and a solving step grabbing template into a large language model to obtain a first sample solving step; inputting the first sample question, the first sample solving step and an answer grabbing template into the large language model to obtain a first sample answer; pre-training a step planning model according to the first sample question and the first sample solving step; pre-training the large language model according to the first sample question, the first sample solving step and the first sample answer; and acquiring the question solving model according to the step planning model and the large language model obtained by pre-training.Type: ApplicationFiled: June 17, 2024Publication date: October 24, 2024Applicant: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.Inventors: Feng HE, Jianhua WANG, Junjie OU, Pingxuan HUANG, Zhifan FENG, Xiaopeng CUI, Qiaoqiao SHE, Hua WU
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Patent number: 12121988Abstract: A heat transmitting device is provided, including a main body and an integrating portion. The main body has at least one opening. The integrating portion is used to seal the opening, and has a first surface and a second surface opposite the first surface. A first welding pattern is formed on the first surface, a second welding pattern is formed on the second surface, and the position of the first welding pattern corresponds to that of the second welding pattern. The type of the first welding pattern and the type of the second welding pattern are asymmetric.Type: GrantFiled: July 17, 2023Date of Patent: October 22, 2024Assignee: DELTA ELECTRONICS, INC.Inventors: Shih-Lin Huang, Tai-De Qi, Zhen-Hua Li
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Patent number: 12126393Abstract: This disclosure describes methods, systems, and devices for measuring a reference signal received power (RSRP) in a user equipment (UE) that operates in machine type communication (MTC). In one example, a method involves receiving, from a radio access network (RAN) serving the UE, a resynchronization signal (RSS). The method also involves calculating a reference signal received power (RSRP) of the RSS.Type: GrantFiled: March 27, 2020Date of Patent: October 22, 2024Assignee: Apple Inc.Inventors: Hua Li, Yang Tang, Jie Cui, Qiming Li, Rui Huang
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Patent number: 12126995Abstract: In one embodiment, a method for secured communication between a medical sensor and a computing device includes receiving, by the medical sensor, an authentication request from the computing device. The method includes generating, based on values provided in the authentication request, a challenge-response message for the computing device. The method includes receiving, from the computing device, a responsive challenge-response message. The method includes verifying that the responsive challenge-response message includes an expected value and corresponds to an expected format. The method includes, in response to verifying the responsive challenge-response message, sending a sensor secret value to the computing device.Type: GrantFiled: September 1, 2021Date of Patent: October 22, 2024Assignee: ABBOTT DIABETES CARE INC.Inventors: Xuandong Hua, Kurt E. Leno, Tony S. Lee, Kevin M. Ow-Wing, Danny Chan, Victor Paishi Huang
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Patent number: 12122834Abstract: The present invention relates to anti-PD-1 antibodies and antigen-binding fragments, and use of these antibodies and antigen-binding fragments in the treatment of cancer or infectious disease.Type: GrantFiled: January 31, 2019Date of Patent: October 22, 2024Assignee: Merck Sharp & Dohme LLCInventors: Laurence Fayadat-Dilman, Veronica Juan, Shireen Khan, Shaopeng Huang, Hua Ying