Abstract: Disclosed is an electronic device having a display region and a peripheral region adjacent to the display region. The electronic device includes a first electrode disposed in the display region, a second electrode disposed in the display region, a circuit module disposed in the peripheral region, a first electrical trace, and a second electrical trace electrically insulated from the first electrical trace. The circuit module is electrically connected to the first electrode through the first electrical trace and provides a first driving voltage to the first electrical trace. The circuit module is electrically connected to the second electrode through the second electrical trace and provides a second driving voltage to the second electrical trace, and the first driving voltage is different from the second driving voltage. In a top view, the first electrical trace at least partially overlaps the second electrical trace.

Abstract: Disclosed is a debris flow anti-collision device with a high-speed water curtain for a mountain bridge. A pressurizer is fixedly installed in a groove of a base; the pressurizer is communicated with high-speed water curtain spray pipe components, and each high-speed water curtain spray pipe component penetrates through a side wall of the base and communicates with an outside; the base rotates with several groups of spoilers, an outer side of the base is fixedly provided with several groups of energy dissipation components, and a connecting bar is detachably connected between each group of energy dissipation components and the base; rear ends of the base are detachably connected with baffles; and the pressurizer is communicated with a water storage tank.

Abstract: Provided is an elliptical multi-mesa laser structure, including a substrate layer, an N-DBR, a functional layer and a P-DBR sequentially arranged from bottom to top. The substrate layer is fixedly connected with an N contact layer. The N-DBR is fixedly connected to a top of the substrate layer, and the N contact layer is arranged around the N-DBR. A space layer is inserted in the N-DBR. The functional layer is fixedly connected to a top of the N-DBR. The P-DBR is fixedly connected to a top of the functional layer, and a top of the P-DBR is fixedly connected with a P contact layer. Another space layer is inserted into the P-DBR.

Abstract: The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad. The pad surface cleaning system may be used to spray the polishing surface with a high-pressure fluid spray to loosen debris from the polishing surface. The pad surface cleaning system may also be used to remove the loosened debris. Further, the pad surface cleaning system may isolate a conditioning disk from a polishing fluid to protect the conditioning disk from reacting with the polishing fluid.

Abstract: The present disclosure relates to a batch sintering method for a high-property silicon nitride ceramic substrate. The batch sintering method includes: (1) silicon nitride ceramic substrate green bodies are stacked and put into a boron nitride crucible, and a layer of boron nitride powder is applied between adjacent silicon nitride ceramic substrate green bodies; (2) after step-by-step vacuumization, debinding is performed in a nitrogen atmosphere or a reducing atmosphere at 500° C. to 900° C.; (3) gas pressure sintering is then performed in a nitrogen atmosphere at 1800° C. to 2000° C., completing the batch preparation of the high-property silicon nitride ceramic substrate.

Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

Abstract: A serverless computing-based, continuous gateway watch of a data store for data change process is provided. The process includes the gateway interface of the computing environment receiving a watch request from a user system to monitor the data store for data change. Based on receiving the watch request, the gateway interface invokes a serverless setup service to establish a connection between the gateway interface and the data store of the computing environment to be monitored for data change. Based on receiving, at the gateway interface, a data change indication from the data store, the gateway interface invokes a serverless message process service to mutate the data change indication from the data store into a mutated data change message indicative of a data change at the data store for return to the user system pursuant to the watch request, with the serverless message process service terminating thereafter.

Abstract: A stacked integrated circuit (IC) device and a method are disclosed. The stacked IC device includes a first semiconductor element. The first substrate includes a dielectric block in the first substrate; and a plurality of first conductive features formed in first inter-metal dielectric layers over the first substrate. The stacked IC device also includes a second semiconductor element bonded on the first semiconductor element. The second semiconductor element includes a second substrate and a plurality of second conductive features formed in second inter-metal dielectric layers over the second substrate. The stacked IC device also includes a conductive deep-interconnection-plug coupled between the first conductive features and the second conductive features. The conductive deep-interconnection-plug is isolated by dielectric block, the first inter-metal-dielectric layers and the second inter-metal-dielectric layers.

Abstract: Disclosed in the present application are a locating method for an uplink time difference of arrival, and an apparatus thereof.

Abstract: A system for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the system comprising: a wafer holder for temporary restraining a semiconductor wafer during a cleaning process; an inlet for delivering a cleaning liquid over a surface of the semiconductor wafer; a sonic generator configured to alternately operate at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, to impart sonic energy to the cleaning liquid, the first predetermined period of time and the second predetermined period of time consecutively following one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Abstract: The present invention relates to a groundwater circulation well system with pressure-adjustable hydrodynamic cavitation, including a circulation well body, a sucked and injected water circulation assembly and a hydrodynamic cavitator. The sucked and injected water circulation assembly is based on a water suction and injection pump. The hydrodynamic cavitator is provided, inside a vortex chamber, with a vortex water inlet column capable of changing a water passing aperture. The hydrodynamic cavitator is capable of changing a bubbling pressure and a breaking pressure of hydrodynamic cavitation bubbles in the vortex water inlet column. The hydrodynamic cavitator generates vortices in the circulation well body to accelerate uniform mixing of a remediation agent and the groundwater. Energy from collapsing and bursting of the hydrodynamic cavitation bubbles activates the remediation agent such that contaminants in the groundwater are efficiently degraded.

Abstract: The present invention provides a method for cleaning substrates comprising the steps of: placing a substrate on a substrate holder; implementing a bubble less or bubble-free pre-wetting process for the substrate; and implementing an ultra/mega sonic cleaning process for cleaning the substrate.

Abstract: The present disclosure relates to an integrated chip including a dielectric structure over a substrate. A first capacitor is disposed between sidewalls of the dielectric structure. The first capacitor includes a first electrode between the sidewalls of the dielectric structure and a second electrode between the sidewalls and over the first electrode. A second capacitor is disposed between the sidewalls. The second capacitor includes the second electrode and a third electrode between the sidewalls and over the second electrode. A third capacitor is disposed between the sidewalls. The third capacitor includes the third electrode and a fourth electrode between the sidewalls and over the third electrode. The first capacitor, the second capacitor, and the third capacitor are coupled in parallel by a first contact on a first side of the first capacitor and a second contact on a second side of the first capacitor.

Abstract: A button structure and an electronic device are provided. The electronic device includes a housing and a button structure disposed at the housing. The button structure includes a button body and an elastic body. The button body includes a keycap and a pillar portion. The keycap is connected to one end of the pillar portion. The elastic body is sleeved on the pillar portion, and one end of the elastic body includes a first engaging portion. The first engaging portion is capable of being engaged with a part of the housing.

Abstract: The present disclosure relates to a three-dimensional (3D) printing ink for Pleurotus eryngii and a preparation method for and use of the 3D printing ink and a preparation method for 3D printed food of Pleurotus eryngii. The present disclosure adopts Pleurotus eryngii freeze-dried powder which reduces a moisture content of Pleurotus eryngii. In addition, the problem that the Pleurotus eryngii with high fiber content blocks a nozzle for 3D printing can be solved by making the Pleurotus eryngii into small particle powder, and bioactive substances in the Pleurotus eryngii can be retained as much as possible. The addition of hydrocolloid can improve rheological properties of the Pleurotus eryngii freeze-dried powder, which increases viscosity of the 3D printing ink for Pleurotus eryngii, and enhances mechanical strength of the 3D printing ink, such that the ink can maintain the print shape and is not easy to collapse.

Abstract: A semiconductor device includes a semiconductor substrate, a conductive pad over the semiconductor substrate, a conductive bump, a conductive cap over the conductive bump, and a passivation layer. The conductive pad is over the semiconductor substrate. The conductive bump is over the conductive pad, wherein the conductive bump has a stepped sidewall structure including a lower sidewall, an upper sidewall laterally offset from the lower sidewall, and an intermediary surface laterally extending from a bottom edge of the upper sidewall to a top edge of the lower sidewall. The conductive cap is over the conductive bump. The passivation layer is over the semiconductor substrate and laterally surrounds the conductive bump, wherein the passivation layer has a top surface higher than the intermediary surface of the stepped sidewall structure of the conductive bump and lower than a top surface of conductive cap.

Abstract: A backlight module includes three light emitting elements, an inverse prism sheet and a light guide assembly. The light guide assembly is disposed opposite to the inverse prism sheet and includes three light guide plates. A first surface of the first light guide plate opposite to the inverse prism sheet has a first sunken eye structure having a first long axis extending along a reference direction. A second surface of the second light guide plate opposite to the inverse prism sheet has a second sunken eye structure having a second long axis. A third surface of the third light guide plate opposite to the inverse prism sheet has a third sunken eye structure having a third long axis. Orthographic projections of the second long axis and the third long axis on the first surface are inclined towards two opposite sides of the reference direction.

Abstract: A light source system and a light-emitting device are provided. The light source system includes an array of light-emitting diodes, the light-emitting diodes including light-emitting diode chips; a collimating lens group located on a light path of light emitted by the array of the light-emitting diodes, the collimating lens group being configured to collimate light beams emitted by the light-emitting diode chips; and a fly-eye lens arranged on a light path of light outputted from the collimating lens group. The fly-eye lens includes micro lens units corresponding to the light-emitting diode chips, and for at least one light-emitting diode chip of the light-emitting diode chips, an image formed by each of at least one light-emitting diode chip on surfaces of the micro lens units is completely within a surface of one of the micro lens units. A ratio of side lobes is reduced, thereby improving the energy utilization rate.

Abstract: An image processing method includes: (a) receiving a to-be-processed image; (b) obtaining a target brightness of the to-be-processed image; (c) creating a histogram curve of the to-be-processed image; (d) clipping the histogram curve according to a clipping value; (e) obtaining a mapping function of the clipped histogram curve; (f) obtaining a mapped image mapped according to the mapping function; (g) obtaining an average brightness of the mapped image; (h) obtaining a difference between the target brightness and the average brightness; and (i) if the difference is greater than a threshold, adjusting the clipping value and repeating steps (d) to (i) until the difference is less than the threshold. Thus, if the to-be-processed image does not reach the target brightness, the image processing device automatically repeats steps (c) to (i) until the to-be-processed image reaches the target brightness.

Abstract: A method is provided. The method includes: reading video information of a 3D video to be rendered; determining an image format of the 3D video according to the video information; generating a first spherical model and a second spherical model according to the image format; reading a frame image of the 3D video, where the frame image includes a first sub-image and a second sub-image; obtaining angle-of-view rotation data and image sealing data; rendering the frame image according to the angle-of-view rotation data and the image scaling data, where the first sub-image is rendered to the first spherical model to obtain a first spherical image, and the second sub-image is rendered to the second spherical model to obtain a second spherical image; and outputting images in a viewport area of the first spherical image and the second spherical image to a display device.