Abstract: The invention provides a wear leveling method, a memory storage device, and a memory control circuit unit. The method includes: recording wear count values respectively corresponding to a plurality of physical units; obtaining a total of a plurality of first physical units, wherein a first wear count value corresponding to each of the first physical units meets a first condition; triggering a wear leveling operation in response to the total meeting a second condition; and in the wear leveling operation, moving valid data in at least one second physical unit to at least one of the plurality of first physical units. As a result, the wear leveling operation performed on the rewritable non-volatile memory module may be optimized.

Abstract: A package structure is provided. The package structure includes a substrate, a package component bonded to the substrate, a lid disposed over the package component and the substrate, and an interface structure sandwiched between the package component. The package component includes a first die, a second die laterally spaced apart from the first die by an underfill, and a molding compound adjacent the first die and the second die. The interface structure includes an adhesive layer disposed over the underfill and the molding compound, and a thermal interface material (TIM) layer over the adhesive layer, the first die and the second die.

Abstract: The present invention is a cholesterol liquid crystal display and driving method thereof. The cholesterol liquid crystal display includes a display panel and a liquid crystal driving unit. The display panel is used to display images composed of a row of imaging drive pixels and multiple rows of non-imaging drive pixels. The liquid crystal driving unit simultaneously drives the display panel to show images by applying a first driving voltage to multiple non-imaging drive pixels and a second driving voltage to imaging drive pixels. The first driving voltage has a quantity of the first pulse waves within a unit time, and the second driving voltage has a quantity of the second pulse waves within the unit time. The quantity of the first pulse waves is at least 5 times greater than the quantity of the second pulse waves, and the higher the multiple, the better the display effect.

Abstract: Augmented and/or virtual reality (AR/VR) near-eye display devices implementing large field of view (FOV) waveguide (WG) eye tracking combined with switchable/tunable optical elements to enable both eye and face tracking are disclosed. In particular, an eye tracking system for an augmented reality/virtual reality (AR/VR) display device may comprise a waveguide, a first deflector element to reflect captured light to propagate in the waveguide, a second deflector element to reflect the propagated light out of the waveguide, an optical element to guide out-coupled light into an eye tracking camera, and a controller to manage the optical element such that a small FOV image of an eye is captured in a first time frame and a large FOV image of a region around the eye is captured in a second time frame.

Abstract: A package structure is provided. The package structure includes a substrate, a die bonded to the substrate, a lid disposed over the die and the substrate, and an interface structure sandwiched between the die and the lid and including a first thermal interface material disposed at corners of a top surface of the die, and a second thermal interface material disposed a rest of the top surface of the die. A Young's modulus of the first thermal interface material is smaller than a Young's modulus of the second thermal interface material.

Abstract: A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip structure over the wiring substrate. The chip package structure includes a first ring structure over the wiring substrate and surrounding the chip structure, wherein a first coefficient of thermal expansion of the first ring structure is less than a second coefficient of thermal expansion of the wiring substrate. The chip package structure includes an anti-warpage structure over the first ring structure. A third coefficient of thermal expansion of the anti-warpage structure is greater than the first coefficient of thermal expansion of the first ring structure.

Abstract: A reflective polarization volume hologram (rPVH) layer in combination with a quarter wave plate (QWP) is used to provide optical power and to correct chromatic aberration in an optical assembly of an augmented and/or virtual reality (AR/VR) near-eye display device. The rPVH layer introduces more degrees of freedom to further improve contrast of the optical system and reduces a thickness/weight of the optical assembly. The rPVH layer is flexible, thus, allowing curved lamination on an optical lens. Moreover, the rPVH layer is sensitive to circular polarization. Thus, it can filter right-handed circular polarization (RHCP) or left-handed circular polarization (LHCP), without a need for the QWP.

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.

Abstract: A semiconductor structure includes a first semiconductor package, a second semiconductor package, a heat spreader and an dielectric layer. The first semiconductor package includes a plurality of first semiconductor chips and a first dielectric encapsulation layer disposed around the plurality of the first semiconductor chips. The second semiconductor package is disposed over and corresponds to one of the plurality of first semiconductor chips, wherein the second semiconductor package includes a plurality of second semiconductor chips and a second dielectric encapsulation layer disposed around the plurality of second semiconductor chips. The heat spreader is disposed over and corresponds to another of the plurality of first semiconductor chips. The dielectric layer is disposed over the first semiconductor package and around the second semiconductor package and the heat spreader.

Abstract: The present disclosure provides a method for driving a cholesteric liquid crystal display device. The method includes the following steps: utilizing a driving circuit section to sequentially activate each scanning electrode within a display panel; utilizing the driving circuit section to apply first alternating-current (AC) voltage pulses to pixel circuits on an activated scanning electrode during a first stage within a pulse-width modulation (PWM) scanning procedure of an activated scanning electrode; and utilizing the driving circuit section to apply second AC voltage pulses to the pixel circuits on the activated scanning electrode during a second stage of the PWM scanning procedure. A first voltage amplitude and a first period of the first AC voltage pulses are different from a second voltage amplitude and a second period of the second AC voltage pulses, respectively.

Abstract: A package structure includes a lower package including a first semiconductor die including a backside metal film on a backside of the first semiconductor die, an upper package attached to the lower package and electrically coupled to the lower package, and a thermally conductive underfill layer between the lower package and the upper package and contacting the backside metal film.

Abstract: A display assembly is provided. The display assembly includes a polarizing optical component configured to reflect a light having a first polarization and transmit a light having a second polarization orthogonal to the first polarization. The display assembly also includes a ferroelectric liquid crystal (“FLC”) display panel configured with a display frame that includes a normal sub-frame and a compensation sub-frame. The display assembly also includes a polarization switch disposed between the FLC display panel and the polarizing optical component. The display assembly further includes a controller configured to control the polarization switch to operate at a non-switching state during the normal sub-frame and operate at a switching state during the compensation sub-frame.

Abstract: A package structure and a formation method are provided. The method includes disposing a chip-containing structure over a substrate. The method also includes attaching a heat dissipation structure to the substrate through an adhesive structure. The heat dissipation structure, the substrate, and the adhesive structure together surround a first space containing the chip-containing structure. The adhesive structure has a through-hole connecting the first space to a second space outside of the first space.

Abstract: An optical element includes a waveguide body that is configured to guide light by total internal reflection from an input end to an output end, an input coupling element located at the input end for coupling light into the waveguide body, and an output coupling element located at the output end for coupling light out of the waveguide body, where the waveguide body includes an organic solid crystal. The organic solid crystal may be a single crystal having principal axes rotated with respect to the dimensions of the waveguide body. Such an optical element may have low weight and exhibit good color uniformity while providing polarization scrambling of the guided light.

Abstract: Provided are a package structure and a method of forming the same. The package structure includes a first die, a second die group, an interposer, an underfill layer, a thermal interface material (TIM), and an adhesive pattern. The first die and the second die group are disposed side by side on the interposer. The underfill layer is disposed between the first die and the second die group. The adhesive pattern at least overlay the underfill layer between the first die and the second die group. The TIM has a bottom surface being in direct contact with the first die, the second die group, and the adhesive pattern. The adhesive pattern separates the underfill layer from the TIM.

Abstract: A manufacturing method of a package structure includes: forming a first package component, where the first package component includes a first insulating encapsulation laterally covering semiconductor dies and a redistribution structure formed on the first insulating encapsulation and the semiconductor dies; coupling the first package component to a second package component; forming an underfill layer between the first and second package component, where the underfill layer extends to cover a sidewall of the first package component; forming a metallic layer on opposing surfaces of the semiconductor dies and the first insulating encapsulation by using a jig, where a window of the jig accessibly exposes the opposing surfaces of the semiconductor dies and the first insulating encapsulation, and a peripheral region of the opposing surface of the first insulating encapsulation is shielded by the jig.

Abstract: A package structure and methods of forming a package structure are provided. The package structure includes a first die, a second die, a wall structure and an encapsulant. The second die is electrically bonded to the first die. The wall structure is located aside the second die and on the first die. The wall structure is in contact with the first die and a hole is defined within the wall structure for accommodating an optical element. The encapsulant laterally encapsulates the second die and the wall structure.

Abstract: A ribbon speaker includes a housing, first and second magnet assemblies, a ribbon diaphragm, a coil, and a flexible substrate. The first and second magnet assemblies is arranged in the housing. The same poles of the first magnet assembly and the second magnet assembly are arranged opposite to each other. The diaphragm is positioned between these magnet assemblies. The coil, placed on this diaphragm, includes two first connection portions. The flexible substrate includes a body, two connection portions, and two soldering portions. The body's first part is inside the housing, while the second part arranged outside. The second connections on the body's first part electrically connected to the coil's first connections. The externally positioned soldering portions facilitate easier assembly, significantly reducing soldering complexity. The soldering portions are respectively and electrically connected to the second connection portions.

Abstract: A method for scanning multiple barcodes is provided. A tag template, recording a predetermined number of barcode forms and relative configuration orientations of the predetermined number of barcode forms, is read. The tag is photographed to obtain a tag image of the tag, wherein a surface of the tag includes a plurality of barcodes. The tag image is analyzed to obtain barcode patterns of the barcodes in the tag image, and barcode types and relative coordinates of the barcode patterns. The barcode types of the barcode patterns and the relative coordinates of the barcode patterns are detected according to the tag template to identify from the barcode patterns a predetermined number of barcode patterns to be outputted matching the tag template. The barcode patterns to be outputted are decoded to obtain information respectively represented by the barcode patterns to be outputted, and the information obtained is outputted.