Abstract: Provided herein are antibodies that bind to the alpha subunit of an IL-7 receptor (IL-7R?). Also provided are uses of these antibodies in therapeutic applications, such as treatment of inflammatory diseases. Further provided are cells that produce the antibodies, polynucleotides encoding the heavy and/or light chain regions of the antibodies, and vectors comprising the polynucleotides.

Abstract: A package structure includes a package substrate, a first semiconductor package and a second semiconductor package, an underfill material, a gap filling structure and a heat dissipation structure. The first semiconductor package and the second semiconductor package are electrically bonded to the package substrate. The underfill material is disposed to fill a first space between the first semiconductor package and the package substrate and a second space between the second semiconductor package and the package substrate. The gap filling structure is disposed over the package substrate and in a first gap laterally between the first semiconductor package and the second semiconductor package. The heat dissipation structure is disposed on the package substrate and attached to the first semiconductor package and the second semiconductor package through a thermal conductive layer.

Abstract: A method of manufacturing a semiconductor device, including: forming a plurality of gate strips, each gate strip is a gate terminal of a transistor; forming a plurality of first contact vias connected to a part of the gate strips; forming a plurality of first metal strips above the plurality of gate strips; connecting one of the first metal strips to one of the first contact vias; forming a plurality of second metal strips above the plurality of first metal strips, wherein the plurality of second metal strips are co-planar, each second metal strip and one of the first metal strips are crisscrossed from top view; a length between two adjacent gate strips is twice as a length between two adjacent second metal strips, and a length of said one of the first metal strips is smaller than two and a half times as the length between two adjacent gate strips.

Abstract: A semiconductor device is provided. The semiconductor device comprises a first semiconductor die comprising a first capacitor, and a second semiconductor die in contact with the first semiconductor die and comprises a diode. The first semiconductor die and the second semiconductor die are arranged along a first direction, and a diode is configured to direct electrons accumulated at the first capacitor to a ground.

Abstract: A method of manufacturing a bump structure includes forming a passivation layer over a substrate. A metal pad structure is formed over the substrate, wherein the passivation layer surrounds the metal pad structure. A polyimide layer including a polyimide is formed over the passivation layer and the metal pad structure. A metal bump is formed over the metal pad structure and the polyimide layer. The polyimide is a reaction product of a dianhydride and a diamine, wherein at least one of the dianhydride and the diamine comprises one selected from the group consisting of a cycloalkane, a fused ring, a bicycloalkane, a tricycloalkane, a bicycloalkene, a tricycloalkene, a spiroalkane, and a heterocyclic ring.

Abstract: A method for sharing a console variable setting of an application and the electronic device and system is provided. The sharing method includes: capturing a display frame of a first electronic device to obtain a set coding image by a second electronic device; transforming the set coding image into a meta file by the second electronic device, wherein the meta file comprises a set of setting parameters for a plurality of first setting options of a first application of the first electronic device; and setting a plurality of second setting options of a second application of the second electronic device as the set of setting parameters for the plurality of first setting options according to the meta file, wherein the second application is the same as the first application.

Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

Abstract: A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: Exemplary embodiments for an exemplary dual transmission gate and various exemplary integrated circuit layouts for the exemplary dual transmission gate are disclosed. These exemplary integrated circuit layouts represent double-height, also referred to as double rule, integrated circuit layouts. These double rule integrated circuit layouts include a first group of rows from among multiple rows of an electronic device design real estate and a second group of rows from among the multiple rows of the electronic device design real estate to accommodate a first metal layer of a semiconductor stack. The first group of rows can include a first pair of complementary metal-oxide-semiconductor field-effect (CMOS) transistors, such as a first p-type metal-oxide-semiconductor field-effect (PMOS) transistor and a first n-type metal-oxide-semiconductor field-effect (NMOS) transistor, and the second group of rows can include a second pair of CMOS transistors, such as a second PMOS transistor and a second NMOS transistor.

Abstract: A cantilever probe card device and a focusing probe thereof are provided. The focusing probe includes a soldering segment, a testing segment, two outer elastic arms spaced apart from each other, and a focusing portion. The testing segment is spaced apart from the soldering segment along an arrangement direction, and has a needle tip, an outer edge, and an inner edge that is opposite to the outer edge. Each of the two outer elastic arms has two end portions respectively connected to the soldering segment and the inner edge of the testing segment. The focusing portion is connected to the inner edge and is located between the needle tip and the two outer elastic arms, and has a plurality of focusing points arranged on one side thereof away from the two outer elastic arms.

Abstract: A method of forming a semiconductor device includes attaching a first semiconductor device to a first surface of a substrate; forming a sacrificial structure on the first surface of the substrate around the first semiconductor device, the sacrificial structure encircling a first region of the first surface of the substrate; and forming an underfill material in the first region.

Abstract: Provided are a package structure and a method of forming the same. The package structure includes a first die, a second die group, an interposer, an underfill layer, a thermal interface material (TIM), and an adhesive pattern. The first die and the second die group are disposed side by side on the interposer. The underfill layer is disposed between the first die and the second die group. The adhesive pattern at least overlay the underfill layer between the first die and the second die group. The TIM has a bottom surface being in direct contact with the first die, the second die group, and the adhesive pattern. The adhesive pattern separates the underfill layer from the TIM.

Abstract: In an embodiment, a device includes a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component. The device also includes a back-side metal layer on a back-side of the package component. The device also includes an indium thermal interface material on a back-side of the back-side metal layer. The device also includes a lid on a back-side of the indium thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.

Abstract: The invention provides a pneumatic nail gun, comprising a gun body, a nail box, a fork and a nail forming device. The gun body comprises a sliding groove, a nail outlet adjacent to the sliding groove and a push block. The nail box and the fork are fixed on the gun body. The nail box is configured to place a plurality of strip nails to be sequentially exposed from the nail outlet. The formed fork comprises two forming surfaces with unequal heights, and the two forming surfaces are adjacent to the nail outlet. The nail forming device comprises two jaw arms, two control arms and a push seat, and the push block drives the two control arms to drive the two jaw arms to rotate and close the two forming jaws, and to drive the push seat to slide on the sliding groove.

Abstract: The invention provides a pneumatic nail gun, comprising a gun body, a nail box, a fork and a nail forming device. The gun body comprises a sliding groove, a nail outlet adjacent to the sliding groove and a push block. The nail box and the fork are fixed on the gun body. The nail box is configured to place a plurality of strip nails to be sequentially exposed from the nail outlet. The formed fork comprises two forming surfaces with unequal heights, and the two forming surfaces are adjacent to the nail outlet. The nail forming device comprises two jaw arms, two control arms and a push seat, and the push block drives the two control arms to drive the two jaw arms to rotate and close the two forming jaws, and to drive the push seat to slide on the sliding groove.

Abstract: A separation device with two-stage gas-liquid mixture and conical spiral fields is provided. A first-stage uniform mixer performs first-stage gas-liquid crushing and uniform mixing process by an outer micropore ceramic pipe, a middle micropore ceramic pipe and an inner micropore ceramic pipe and crushes large bubbles in the gas-liquid two-phase flow into small bubbles. A second-stage uniform mixer performs second-stage gas-liquid crushing and uniform mixing process. A whirlpool-making gas collector adjusts the gas-liquid uniform mixing flow obtained after two-stage gas-liquid uniform mixing into hollow-core type high-speed two-phase spiral flow. A conical degasser performs gas-liquid efficient separation operation in a high-speed conical spiral field.

Abstract: A method includes bonding a first package and a second package over a package component, adhering a first Thermal Interface Material (TIM) and a second TIM over the first package and the second package, respectively, dispensing an adhesive feature on the package component, and placing a heat sink over and contacting the adhesive feature. The heat sink includes a portion over the first TIM and the second TIM. The adhesive feature is then cured.