Patents by Inventor Hui Lin

Hui Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240102955
    Abstract: A non-invasive time domain reflection probe calibration method includes: using different volume ratio of ethanol and deionized water mixed solution to calculate a test target's medium weight coefficient and waveguide length of the non-invasive time domain reflection probes; using different concentrations of NaCl solutions to calibrate a waveguide geometric dimensioning of the non-invasive time domain reflection probes; preparing compacted soil samples with known different moisture contents and densities, and calibrating a correlation parameter of compacted soil samples' dielectric constant and conductivity with moisture content and density. The method not only determines the sensitivity of the test target medium of the non-invasive time domain reflection probes, but also obtains the waveguide length and geometric dimensioning of the probe, and realizes an accurate test of moisture content and density of the soil.
    Type: Application
    Filed: July 28, 2023
    Publication date: March 28, 2024
    Applicants: China Jikan Research Institute Of Engineering Investigations And Design, Co.,Ltd, Xi'an Jiaotong University
    Inventors: Jie CAO, Yonglin YANG, Zaixin WAN, Peng GAO, Qingyi MU, Dongjing WANG, Yuanqiang ZHOU, Zhi LIU, Long ZHANG, Hui LI, Jian CHEN, Teng YANG, Lei RAN, Jiao LIN, Xiao DONG, Shuai LIU, Weiwei ZHAO
  • Publication number: 20240107731
    Abstract: The present disclosure provides a matte-type electromagnetic interference shielding film including bio-based components, which includes a bio-based insulating layer, a bio-based adhesive layer, a metal layer, and a bio-based electrically conductive adhesive layer. The matte-type electromagnetic interference shielding film including the bio-based component of the present disclosure has a matte appearance and high bio-based content and has the advantages of good surface insulation, high surface hardness, good chemical resistance, high shielding performance, good adhesion strength, low transmission loss, high transmission quality, good operability, high heat resistance, and the inner electrically conductive adhesive layer with long shelf life and storage life. The present disclosure further provides a preparation method thereof.
    Type: Application
    Filed: July 14, 2023
    Publication date: March 28, 2024
    Inventors: Bo-Sian DU, Wei-Chih LEE, Chia-Hua HO, Chih-Ming LIN, Chien-Hui LEE
  • Publication number: 20240107890
    Abstract: A method for fabricating semiconductor device includes the steps of forming an inter-metal dielectric (IMD) layer on a substrate, forming a metal interconnection in the IMD layer, forming a magnetic tunneling junction (MTJ) on the metal interconnection, and performing a trimming process to shape the MTJ. Preferably, the MTJ includes a first slope and a second slope and the first slope is less than the second slope.
    Type: Application
    Filed: October 24, 2022
    Publication date: March 28, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Ching-Hua Hsu, Jing-Yin Jhang
  • Patent number: 11942375
    Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a first semiconductor fin and a second semiconductor fin over a semiconductor substrate. The second semiconductor fin is wider than the first semiconductor fin. The method also includes forming a gate stack over the semiconductor substrate, and the gate stack extends across the first semiconductor fin and the second semiconductor fin. The method further includes forming a first source/drain structure on the first semiconductor fin, and the first source/drain structure is p-type doped. In addition, the method includes forming a second source/drain structure on the second semiconductor fin, and the second source/drain structure is n-type doped.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsing-Hui Hsu, Po-Nien Chen, Yi-Hsuan Chung, Bo-Shiuan Shie, Chih-Yung Lin
  • Patent number: 11942532
    Abstract: A method includes fabricating a semiconductor device, wherein the method includes depositing a coating layer on a first region and a second region under a loading condition such that a height of the coating layer in the first region is greater than a height of the coating layer in the second region. The method also includes applying processing gas to the coating layer to remove an upper portion of the coating layer such that a height of the coating layer in the first region is a same as a height of the coating layer in the second region.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chao-Hsuan Chen, Ming-Chia Tai, Yu-Hsien Lin, Shun-Hui Yang, Ryan Chia-Jen Chen
  • Publication number: 20240093267
    Abstract: A high-throughput automated preprocessing method and a system are applied to a nucleic acid preprocessing apparatus including a control system, a sample transfer area, a nucleic acid extraction area, and a reagent setup area. The control system includes a user interface and guides a user to set up on the user interface. In the sample transfer area, the method includes steps of: a user selecting a sampling tube type, a test protocol and an extraction protocol on the user interface, and the control system performing a sample transfer task. In the nucleic acid extraction area, the method includes steps of: the control system performing a nucleic acid extraction task based on the selected extraction protocol. In the reagent setup area, the method includes steps of: the control system performing a reagent deployment task based on the selected test protocol, and the control system performing a nucleic acid transfer task.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 21, 2024
    Inventors: Wei-Te Hsieh, Chia-Yen Lin, Kuang-An Wang, Keng-Ting Liu, Shu-Hui Huang
  • Publication number: 20240097330
    Abstract: An antenna system includes a first antenna element and a second antenna element. The first antenna element includes a first ground element, a first radiation element, a second radiation element, and a third radiation element. The first radiation element has a first feeding point. The second radiation element is coupled to the first ground element. The third radiation element is coupled to the first ground element. The third radiation element is adjacent to the first radiation element and the second radiation element. The second antenna element includes a second ground element, a fourth radiation element, a fifth radiation element, and a sixth radiation element. The fourth radiation element has a second feeding point. The fifth radiation element is adjacent to the fourth radiation element. The fifth radiation element is coupled through the sixth radiation element to the second ground element.
    Type: Application
    Filed: October 31, 2022
    Publication date: March 21, 2024
    Inventors: Wen Yuan LO, Hui LIN
  • Publication number: 20240096917
    Abstract: An image sensor structure includes a semiconductor substrate, a plurality of image sensing elements, a reflective element, and a high-k dielectric structure. The image sensing elements are in the semiconductor substrate. The reflective element is in the semiconductor substrate and between the image sensing elements. The high-k dielectric structure is between the reflective element and the image sensing elements.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 21, 2024
    Inventors: PO CHUN CHANG, PING-HAO LIN, WEI-LIN CHEN, KUN-HUI LIN, KUO-CHENG LEE
  • Publication number: 20240096722
    Abstract: In an embodiment, a package includes a first device and a second device attached to a first redistribution structure, wherein the second device includes a second redistribution structure, a first die disposed over the second redistribution structure, a first encapsulant extending along sidewalls of the first die, a first via extending through the first encapsulant, a third redistribution structure disposed over the first encapsulant and including a first metallization pattern connecting to the first via, a second die disposed over the third redistribution structure, and a second encapsulant extending along sidewalls of the second die, the first die and the second die being free of through substrate vias. The package also includes a third encapsulant disposed over the first redistribution structure and surrounding sidewalls of the first device and the second device, wherein top surfaces of the second encapsulant and the third encapsulant are level with each other.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 21, 2024
    Inventors: Kuo-Chung Yee, Chia-Hui Lin, Shih-Peng Tai
  • Publication number: 20240099154
    Abstract: A magnetoresistive random access memory (MRAM) device includes a first array region and a second array region on a substrate, a first magnetic tunneling junction (MTJ) on the first array region, a first top electrode on the first MTJ, a second MTJ on the second array region, and a second top electrode on the second MTJ. Preferably, the first top electrode and the second top electrode include different nitrogen to titanium (N/Ti) ratios.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: UNITED MICROELECTRONICS CORP
    Inventors: Hui-Lin Wang, Si-Han Tsai, Dong-Ming Wu, Chen-Yi Weng, Ching-Hua Hsu, Ju-Chun Fan, Yi-Yu Lin, Che-Wei Chang, Po-Kai Hsu, Jing-Yin Jhang
  • Patent number: 11936198
    Abstract: A wireless device is provided and includes a substrate, a first coil and a second coil. The first coil is configured to be wound around a first axis, and the first coil is disposed on the substrate and is configured to operate in a wireless charging mode. The second coil is disposed on the substrate and configured to operate in a wireless communication mode. The wires of the second coil partially overlap the wires of the first coil.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Feng-Lung Chien, Hsiang-Hui Hsu, Chien-Hung Lin
  • Publication number: 20240088650
    Abstract: In some aspects of the present disclosure, an electrostatic discharge (ESD) protection circuit is disclosed. In some aspects, the ESD protection circuit includes a first transistor coupled to a pad, a second transistor coupled between the first transistor and ground, a stack of transistors coupled to the first transistor, and an ESD clamp coupled between the stack of transistors and the ground.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company Ltd.
    Inventors: Li-Wei Chu, Tao Yi Hung, Chia-Hui Chen, Wun-Jie Lin, Jam-Wem Lee
  • Publication number: 20240085866
    Abstract: The present disclosure provides a method and device for intelligent control of heating furnace combustion based on a big data cloud platform, which relates to the technical field of artificial intelligence control. The method includes: construction of big data cloud platform based on production and operation parameters of the heating furnace; identification of key factors in the production process of the heating furnace by using big data mining technology; independent deployment of traditional heating furnace combustion control systems based on the mechanism model; and integration of cloud platform big data expert knowledge base and the heating furnace combustion intelligent control system.
    Type: Application
    Filed: September 7, 2023
    Publication date: March 14, 2024
    Applicant: University of Science and Technology Beijing
    Inventors: Qing LI, Fengqin LIN, Hui LI, Li WANG, Chengyong XIAO, Xu YANG, Jiarui CUI, Chunqiu WAN, Qun YAN, Yan LIU, Lei MIAO, Jin GUO, Boyu ZHANG, Chen HUANG, Yaming XI, Yuxuan LIN
  • Publication number: 20240083951
    Abstract: The present disclosure provides ?2?-1 C-terminal domain mimetics for the treatment of pain, epilepsy or other disorders in a subject. Further provided is an ?2?-1 C-terminal domain peptide which blocks binding of ?2?-1 to the glutamate receptors NMDAR and AMPAR.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 14, 2024
    Applicant: Board of Regents, The University of Texas System
    Inventor: Hui-lin PAN
  • Publication number: 20240090053
    Abstract: In one example in accordance with the present disclosure, an electronic device is described. The electronic device includes a wireless controller. The wireless controller is to establish a first wireless connection between the electronic device and a peripheral device to receive a unique identifier for a second electronic device. The wireless controller is also to establish, based on the unique identifier for the second electronic device, a second wireless connection between the electronic device and the second electronic device. The electronic device includes a wireless transceiver to wirelessly transfer data to the second electronic device through the second wireless connection.
    Type: Application
    Filed: February 2, 2021
    Publication date: March 14, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chung-Chun Chen, Chen-Hui Lin, Chih-Ming Huang, Ming-Shien Tsai
  • Publication number: 20240087986
    Abstract: A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.
    Type: Application
    Filed: November 15, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin
  • Patent number: 11927940
    Abstract: A management method for a cutting tool of a machine tool is provided. A user host imports a graphical data of a workpiece and a cutting tool database into CAM, and a user may select cutting tools to establish a complete machining process. T codes are replaced with electronic tags. Before executing a machine code comprising the electronic tags, the machine tool re-scans the cutting tools assembled at a tool turret and updates cutting tool arrangement information to ensure that the tool turret is equipped with the cutting tools used in the machining process. When the machine tool stores the electronic tags, a ready message is displayed for reminding an operator. When the electronic tags are not stored, the current storage location of a cutting tool lacked in the machining process or a warning message is displayed at the operation interface for reminding the operator.
    Type: Grant
    Filed: March 31, 2023
    Date of Patent: March 12, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chao-Chuang Mai, Chin-Hui Chen, Chi-Hsiang Lin, Zi-Chiao Lin
  • Patent number: 11926643
    Abstract: This disclosure relates to GLP-1 agonists of Formula (I): including pharmaceutically acceptable salts and solvates thereof, and pharmaceutical compositions including the same.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: March 12, 2024
    Assignee: Gasherbrum Bio, Inc.
    Inventors: Qinghua Meng, Xichen Lin, Haizhen Zhang, Weiqiang Xing, Hui Lei, Andrew Jennings
  • Patent number: 11926626
    Abstract: This disclosure relates to GLP-1 agonists of Formula (I), including pharmaceutically acceptable salts and solvates thereof, and pharmaceutical compositions including the same.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: March 12, 2024
    Assignee: Gasherbrum Bio, Inc.
    Inventors: Qinghua Meng, Weiqiang Xing, Haizhen Zhang, Xichen Lin, Hui Lei, Andrew Jennings
  • Patent number: D1018891
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: March 19, 2024
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chih-Hsien Wang, Shih-Chieh Chang, Peng-Hui Wang, Ming-Chieh Cheng, Xiu-Yi Lin