Patents by Inventor Hui Lin

Hui Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11778922
    Abstract: A method for fabricating semiconductor device includes first forming a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate, performing an atomic layer deposition (ALD) process or a high-density plasma (HDP) process to form a passivation layer on the first MTJ and the second MTJ, performing an etching process to remove the passivation layer adjacent to the first MTJ and the second MTJ, and then forming an ultra low-k (ULK) dielectric layer on the passivation layer.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: October 3, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Tai-Cheng Hou, Wei-Xin Gao, Fu-Yu Tsai, Chin-Yang Hsieh, Chen-Yi Weng, Jing-Yin Jhang, Bin-Siang Tsai, Kun-Ju Li, Chih-Yueh Li, Chia-Lin Lu, Chun-Lung Chen, Kun-Yuan Liao, Yu-Tsung Lai, Wei-Hao Huang
  • Publication number: 20230309414
    Abstract: A semiconductor device includes: a substrate comprising a magnetic tunneling junction (MTJ) region and a logic region; a first MTJ on the MTJ region; a first metal interconnection on the logic region; and a cap layer extending from a sidewall of the first MTJ to a sidewall of the first metal interconnection. Preferably, the cap layer on the MTJ region and the cap layer on the logic region comprise different thicknesses.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 28, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Yu-Ping Wang, Chen-Yi Weng, Chin-Yang Hsieh, Si-Han Tsai, Che-Wei Chang, Jing-Yin Jhang
  • Publication number: 20230302494
    Abstract: The present disclosure relates to an integrated chip structure. The integrated chip structure includes a dielectric stack disposed on a substrate. The integrated chip structure further includes one or more piezoelectric ultrasonic transducers (PMUTs) and one or more capacitive ultrasonic transducers (CMUTs). The one or more PMUTs include a piezoelectric stack disposed within the dielectric stack over one or more PMUT cavities. The one or more CMUTs include electrodes disposed within the dielectric stack and separated by one or more CMUT cavities. An isolation chamber is arranged within the dielectric stack laterally between the one or more PMUTs and the one or more CMUTs. The isolation chamber vertically extends past at least a part of both the one or more PMUTs and the one or more CMUTs.
    Type: Application
    Filed: June 6, 2022
    Publication date: September 28, 2023
    Inventors: Ching-Hui Lin, Yi-Hsien Chang, Chun-Ren Cheng, Fu-Chun Huang, Yi Heng Tsai, Shih-Fen Huang, Chao-Hung Chu, Po-Chen Yeh
  • Publication number: 20230293412
    Abstract: It relates to shampoos and kits or packages comprising the same. It also relates to methods of preparing and using the shampoos.
    Type: Application
    Filed: July 27, 2020
    Publication date: September 21, 2023
    Applicant: SHANDONG BENZHEN COSMETICS CO., LTD
    Inventors: Zhengmei HUANG, Jinping DING, Hui LIN
  • Patent number: 11759984
    Abstract: Provided is a damping pad with low compression set, which is prepared by a method comprising the following steps: (1) providing a polymer comprising a thermoplastic ether ester elastomer, in which the polymer material has specific melt flow index, Shore D hardness, tensile modulus, density, and elongation at break; (2) melting the polymer material to obtain a molten polymer material; (3) adding nitrogen gas or carbon dioxide into the molten polymer to obtain a mixture; (4) turning the mixture into a supercritical state and compounding the mixture, to obtain a supercritical fluid blend; and (5) injecting and molding the supercritical fluid blend to obtain the damping pad with low compression set which has compression set of 40% or less, deceleration value of 20 or less, and rebound resilience of 50% or more.
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: September 19, 2023
    Assignee: HERTIDE MATERIAL CO.
    Inventors: Ming-Hui Lin, Sung-Yen Kung
  • Publication number: 20230290907
    Abstract: A light-emitting device includes a light-emitting element including an epitaxial structure and a DBR. The DBR includes first and second reflective units. The first reflective unit includes first reflective structures. The second reflective unit includes second reflective structures. Each of the first and second reflective structures has first and second material layers. The first material layer of each of the first reflective structures has an optical thickness different from that of the first material layer of each of the second reflective structures. The second material layer of each of the first reflective structures has an optical thickness different from that of the second material layer of each of the second reflective structures. In each of the first and second reflective structures, the first material layer has a refractive index different from that of the second material layer.
    Type: Application
    Filed: May 18, 2023
    Publication date: September 14, 2023
    Inventors: Qing WANG, Wei LI, Minyou HE, Shiwei LIU, Ling-yuan HONG, Su-hui LIN, Chung-ying CHANG
  • Publication number: 20230284842
    Abstract: A wet or dry paper towel dispenser includes a paper towel roll in a housing; drive rollers operably driven by an electric motor; driven rollers disposed oppositely of the drive rollers; a controller including a first sensor for detecting dispensation of dry paper towel sheet and a second sensor for detecting dispensation of wet paper towel sheet; a paper dispensing opening under the controller; a cutter disposed between the paper dispensing opening and the driven rollers, the cutter being configured to cut a portion of sheet product of the paper towel roll; a reservoir disposed rearward of the paper dispensing opening; a pump electrically connected to the controller; and nozzles. A leading edge of the paper towel roll is pinched by the drive rollers and the driven rollers to dispose in front of the nozzles.
    Type: Application
    Filed: May 17, 2023
    Publication date: September 14, 2023
    Inventor: Po-Hui Lin
  • Publication number: 20230292627
    Abstract: A semiconductor device includes a substrate, a first dielectric layer, a second dielectric layer, and a third dielectric layer. The first dielectric layer is disposed on the substrate, around a first metal interconnection. The second dielectric layer is disposed on the first dielectric layer, around a via and a second metal interconnection. The second metal interconnection directly contacts the first metal interconnection. The third dielectric layer is disposed on the second dielectric layer, around a first magnetic tunneling junction (MTJ) structure and a third metal interconnection. The third metal interconnection directly contacts top surfaces of the first MTJ structure and the second metal interconnection, and the first MTJ structure directly contacts the via.
    Type: Application
    Filed: May 23, 2023
    Publication date: September 14, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Yi-Yu Lin, Ching-Hua Hsu, Hung-Yueh Chen
  • Publication number: 20230288369
    Abstract: A sensor array includes a semiconductor substrate, a first plurality of FET sensors and a second plurality of FET sensors. Each of the FET sensors includes a channel region between a source and a drain region in the semiconductor substrate and underlying a gate structure disposed on a first side of the channel region, and a dielectric layer disposed on a second side of the channel region opposite from the first side of the channel region. A first plurality of capture reagents is coupled to the dielectric layer over the channel region of the first plurality of FET sensors, and a second plurality of capture reagents is coupled to the dielectric layer over the channel region of the second plurality of FET sensors. The second plurality of capture reagents is different from the first plurality of capture reagents.
    Type: Application
    Filed: April 10, 2023
    Publication date: September 14, 2023
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ching-Hui LIN, Chun-Ren CHENG, Shih-Fen HUANG, Fu-Chun HUANG
  • Publication number: 20230286195
    Abstract: Provided is a damping pad with low compression set, which is prepared by a method comprising the following steps: (1) providing a polymer comprising a thermoplastic ether ester elastomer, in which the polymer material has specific melt flow index, Shore D hardness, tensile modulus, density, and elongation at break; (2) melting the polymer material to obtain a molten polymer material; (3) adding nitrogen gas or carbon dioxide into the molten polymer to obtain a mixture; (4) turning the mixture into a supercritical state and compounding the mixture, to obtain a supercritical fluid blend; and (5) injecting and molding the supercritical fluid blend to obtain the damping pad with low compression set which has compression set of 40% or less, deceleration value of 20 or less, and rebound resilience of 50% or more.
    Type: Application
    Filed: March 18, 2022
    Publication date: September 14, 2023
    Inventors: Ming-Hui LIN, Sung-Yen KUNG
  • Patent number: 11753205
    Abstract: A folding container mainly includes a lower base, a front plate, two opposite side plates, an upper cover, and a back plate. The folding container can be extended in use for mounting objects therein or folded for storage while not in use. During extension or folding, touch fasteners are used for fastening and fixing firmly. Thereby the folding container is not only lighter in total weight and able to be folded into a compact form while not in use, but also providing accurate positioning to keep itself from extending freely during folding process. Therefore, the folding container is more convenient to use and more practical in use.
    Type: Grant
    Filed: April 6, 2022
    Date of Patent: September 12, 2023
    Assignees: SortNova LLC
    Inventor: Tsai-Hui Lin
  • Patent number: 11757542
    Abstract: Embodiments of the present disclosure provide probe antenna determination methods and apparatuses. An exemplary method includes: determining N probe antenna models from preset M probe antenna models based on signal characteristic parameters of a first signal, where the first signal is a signal obtained after a transmit signal of an analog system is processed by a wireless channel model, the signal characteristic parameters include at least one of the following: a radiation energy value of the first signal in each direction and an angle power spectrum density of the first signal, the N probe antenna models are used to determine a probe antenna for testing a device under test, and both M and N are positive integers.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: September 12, 2023
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventor: Hui Lin
  • Patent number: 11758350
    Abstract: Embodiments are disclosed for user posture transition detection and classification using a linked biomechanical model. In an embodiment, a method comprises: obtaining motion data from a headset worn by a user; selecting features of a linked biomechanical model based on a current posture state; determining at least one probability that a posture transition occurred based on an output of a classifier, where the output of the classifier is based on the selected features and the motion data; determining a posture transition based on the at least one probability; and performing at least one action based on detection of the posture transition.
    Type: Grant
    Filed: September 24, 2021
    Date of Patent: September 12, 2023
    Assignee: Apple Inc.
    Inventors: Aditya Sarathy, Xiaoyuan Tu, Suresh B. Malakar, Hui Lin
  • Patent number: 11748011
    Abstract: The present invention provides a control method of the flash memory controller. In the control method, after receiving a deallocate command from a host device, the flash memory controller will update a valid page count table, a detailed valid page count table and/or a zone valid page count table according to deallocate command, for the flash memory controller to efficiently and quickly determine if any one of the zones does not have any valid data, so that the flash memory controller can recommend the host device to send a reset command to reset the zone.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: September 5, 2023
    Assignee: Silicon Motion, Inc.
    Inventor: Ching-Hui Lin
  • Patent number: 11751482
    Abstract: A manufacturing method of a semiconductor device includes the following steps. A first inter-metal dielectric (IMD) layer is formed on a substrate. A cap layer is formed on the first IMD layer. A connection structure is formed on the substrate and penetrates the cap layer and the first IMD layer. A magnetic tunnel junction (MTJ) stack is formed on the connection structure and the cap layer. A patterning process is performed to the MTJ stack for forming a MTJ structure on the connection structure and removing the cap layer. A spacer is formed on a sidewall of the MTJ structure and a sidewall of the connection structure. A second IMD layer is formed on the first IMD layer and surrounds the MTJ structure. The dielectric constant of the first IMD layer is lower than the dielectric constant of the second IMD layer.
    Type: Grant
    Filed: November 3, 2022
    Date of Patent: September 5, 2023
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chen-Yi Weng, Jing-Yin Jhang, Hui-Lin Wang, Chin-Yang Hsieh
  • Publication number: 20230270729
    Abstract: The use of P2X4 antagonists for the treatment of dry eye syndrome, more in particular substituted N-phenylacetamide compounds of general formula (I), pharmaceutical compositions and combinations comprising said compounds for use in the treatment or prophylaxis of dry eye syndrome and in particular dry eye, ocular neuropathic pain, ocular trauma and post-operative ocular pain.
    Type: Application
    Filed: June 28, 2021
    Publication date: August 31, 2023
    Applicants: Bayer Aktiengesellschaft, The Johns Hopkins University
    Inventors: Stefan BĂ„URLE, William SCHUBERT, Jens NAGEL, Carsten TERJUNG, David FINIS, Samuel YIU, Hui LIN, Minjie CHEN, Stefanie SEO
  • Publication number: 20230275123
    Abstract: In an embodiment, a device includes: a semiconductor fin extending from a semiconductor substrate; a nanostructure above the semiconductor fin; a source/drain region adjacent a channel region of the nanostructure; a bottom spacer between the source/drain region and the semiconductor fin; and a gap between the bottom spacer and the source/drain region.
    Type: Application
    Filed: June 8, 2022
    Publication date: August 31, 2023
    Inventors: Wei-Min Liu, Tsz-Mei Kwok, Hui-Lin Huang, Cheng-Yen Wen, Li-Li Su, Chii-Horng Li, Yee-Chia Yeo
  • Publication number: 20230272896
    Abstract: A lens module with a diameter less than 200 millimeters is disclosed, including a first lens, a second lens and a third lens. The first lens has a refractive index ranging from 1.4 to 1.6 and an average curvature ranging from 1/36 (mm)?1 to 1/43 (mm)?1. The first lens has a light-emitting angle within 70 degrees in the horizontal direction and within 5 degrees in the vertical direction. The first lens in the short axis direction is less than 50 mm and its protruding height on the light-emitting surface is less than 20 mm. The second lens has a light-emitting angle within 40 degrees in the horizontal direction and within 5 degrees in the vertical direction. The third lens has a light-emitting angle within 26 degrees in the horizontal direction and within 2 degrees in the vertical direction.
    Type: Application
    Filed: February 24, 2023
    Publication date: August 31, 2023
    Inventor: MING-HUI LIN
  • Patent number: 11741189
    Abstract: A computing in memory (CIM) cell includes a memory cell circuit, a first semiconductor element, a second semiconductor element, a third semiconductor element, and a fourth semiconductor element. A first terminal of the first semiconductor element receives a bias voltage. A control terminal of the first semiconductor element is coupled to a computing word-line. A control terminal of the second semiconductor element is coupled to a first data node in the memory cell circuit. A second terminal of the third semiconductor element is adapted to receive a reference voltage. A control terminal of the third semiconductor element receives an inverted signal of the computing word-line. A first terminal of the fourth semiconductor element is coupled to a first computing bit-line. A second terminal of the fourth semiconductor element is coupled to a second computing bit-line.
    Type: Grant
    Filed: January 18, 2023
    Date of Patent: August 29, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Chih-Sheng Lin, Jian-Wei Su, Tuo-Hung Hou, Sih-Han Li, Fu-Cheng Tsai, Yu-Hui Lin
  • Publication number: 20230268466
    Abstract: An LED device includes an epitaxial layered structure, a current spreading layer, a first insulating layer and a reflective structure. The current spreading layer is formed on a surface of the epitaxial layered structure. The first insulating layer is formed over the current spreading layer, and is formed with at least one first through hole to expose the current spreading layer. The reflective structure is formed on the first insulating layer, extends into the first through hole, and contacts the current spreading layer. The current spreading layer is formed with at least one opening structure to expose the surface of the epitaxial layered structure.
    Type: Application
    Filed: April 24, 2023
    Publication date: August 24, 2023
    Inventors: Xiaoliang LIU, Anhe HE, Kang-wei PENG, Su-hui LIN, Ling-yuan HONG, Chia-hung CHANG