Patents by Inventor Hui Yu
Hui Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250146700Abstract: An air-conditioning device, a control method and device, and a computer-readable storage medium are provided. The air-conditioning device includes a compressor, a four-way valve, an indoor heat exchanger, an outdoor heat exchanger and a flash evaporator. The four-way valve is connected to the compressor through a first refrigerant branch, and a first control valve is arranged on the first refrigerant branch. A second refrigerant branch is connected in parallel to the first refrigerant branch; and a second control valve, and a hot-gas bypass pipe positioned at the bottom of the outdoor heat exchanger are arranged on the second refrigerant branch. A first refrigerant port of the flash evaporator is connected to the outdoor heat exchanger, a second refrigerant port of the flash evaporator is connected to the indoor heat exchanger, and an air outlet of the flash evaporator is connected to the compressor.Type: ApplicationFiled: January 13, 2025Publication date: May 8, 2025Applicant: GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD.Inventors: Hui YU, Yangyang YUAN
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Publication number: 20250135036Abstract: Among other things, the present disclosure provides oligonucleotides, compositions and methods thereof that can bring about specific editing of a target adenosine in a target RNA molecule. Such oligonucleotides, compositions and methods are useful to treat, prevent, or ameliorate MECP2 associated disorders, diseases and syndromes that can benefit from adenosine modification.Type: ApplicationFiled: September 26, 2022Publication date: May 1, 2025Inventors: Christopher Michael Acker, Onanong Chivatakarn, Prashant Monian, Chikdu Shakti Shivalila, Subramanian Marappan, Chandra Vargeese, Pachamuthu Kandasamy, Genliang Lu, Hui Yu, David Charles Donnell Butler, Luciano Henrique Apponi, Mamoru Shimizu, Stephany Michelle Standley, David John Boulay, Andrew Guzior Hoss, Jigar Desai, Jack David Godfrey, Hailin Yang, Naoki Iwamoto, Jayakanthan Kumarasamy, Anthony Lamattina, Ian Chandler Harding, Jesse Turner
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Publication number: 20250130379Abstract: Disclosed are apparatus and methods for a silicon photonic (SiPh) structure comprising the integration of an electrical integrated circuit (EIC); a photonic integrated circuit (PIC) disposed on top of the EIC; two or more polymer waveguides (PWGs) disposed on top of the PIC and formed by layers of cladding polymer and core polymer; and an integration fan-out redistribution (InFO RDL) layer disposed on top of the two or more PWGs. The operation of PWGs is based on the refractive indexes of the cladding and core polymers. Inter-layer optical signals coupling is provided by edge-coupling, reflective prisms and grating coupling. A wafer-level system implements a SiPh structure die and provides inter-die signal optical interconnections among the PWGs.Type: ApplicationFiled: November 26, 2024Publication date: April 24, 2025Inventors: Yu-Hao CHEN, Hui-Yu LEE, Chung-Ming WENG, Jui-Feng KUAN, Chien-Te WU
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Patent number: 12283876Abstract: Circuits and methods for sensing output current of a power converter, controlling output current in multiple parallel power converters, and enabling reconfigurability of output control for multiple parallel power converters. One embodiment includes a current sensing circuit configured to be coupled to a power converter, the current sensing circuit configured to receive a first voltage representative of an output current of the power converter and output a low-frequency filtered second voltage based on the first voltage and a high-frequency filtered third voltage based on the first voltage. In some embodiments, the first voltage is generated by sensing an output current of the power converter and converting the sensed output current to the first voltage. Other embodiments include a plurality of power stages and corresponding current sensing circuits, wherein the outputs of the low-frequency filters of the current sensing circuits are coupled in common.Type: GrantFiled: February 24, 2022Date of Patent: April 22, 2025Assignee: pSemi CorporationInventors: Tim Wen Hui Yu, Gregory Szczeszynski
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Patent number: 12283556Abstract: A package structure is provided. The package structure includes a die, an encapsulant and a RDL structure. The RDL structure is disposed on the die and the encapsulant. The RDL structure includes a first dielectric structure and a first redistribution layer. The first dielectric structure includes a first dielectric material layer and a second dielectric material layer on the first dielectric material layer. The first redistribution layer is embedded in the first dielectric structure and electrically connected to the die. The redistribution layer includes a first seed layer and a first conductive layer surrounded by the first seed layer. A topmost surface of the first seed layer and a topmost surface of the first conductive layer are substantially level with a top surface of the second dielectric material layer.Type: GrantFiled: January 23, 2024Date of Patent: April 22, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee
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Publication number: 20250114318Abstract: A composition is provided, wherein the composition includes 70.00-99.00 weight percentage (wt %) of phytopeptide, 0.10-20.00 wt % of branched-chain amino acid, 0.10-20.00 wt % of whey protein concentrate, 0.10-20.00 wt % of creatine, and 0.10-20.00 wt % of chromium yeast. A use of composition as described above is further provided.Type: ApplicationFiled: October 6, 2023Publication date: April 10, 2025Inventor: HUI-YU HUNG
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Patent number: 12271029Abstract: An optical circuit includes one or more input waveguides, a plurality of output waveguides, and a reflector structure. At least a portion of the reflector structure forms an interface with the one or more input waveguides. The portion of the reflector structure has a smaller refractive index than the one or more input waveguides. An electrical circuit is electrically coupled to the optical circuit. The electrical circuit generates and sends different electrical signals to the reflector structure. In response to the reflector structure receiving the different electrical signals, a carrier concentration level at or near the interface or a temperature at or near the interface changes, such that incident radiation received from the one or more input waveguides is tunably reflected by the reflector structure into a targeted output waveguide of the plurality of output waveguides.Type: GrantFiled: May 24, 2024Date of Patent: April 8, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Hao Chen, Hui Yu Lee, Jui-Feng Kuan, Chien-Te Wu
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Publication number: 20250101428Abstract: Small interfering RNAs (siRNA) having specific modification patterns to improve interference efficiencies thereof. The modification patterns each comprises a combination of 2?-O methyl modification, 2?-O-fluoro-modification, and phosphorothioate (PS) bonds at defined positions in the sense strand and anti-sense strand of each siRNA, and optionally 5? phosphate modifications.Type: ApplicationFiled: December 2, 2022Publication date: March 27, 2025Inventors: Yi-Chung CHANG, Chi-Fan YANG, Hui-Yu CHEN, Yi-Fen CHEN
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Publication number: 20250099517Abstract: The probiotics, Lactobacillus reuteri Y7, are used in eye protection for preventing and treating ocular inflammatory reactions, apoptosis and retinal injuries after exposure to blue light. The exposure to blue light does harms to a retina such as blue light-induced retinal atrophy, retinal thickness thinned, macular choroidal neovascularization (CNV) and photosensitivity of a retina dysfunctional; the exposure to blue light causes retinal injuries such as the macular disease, particularly the late dry macular disease. Lactobacillus reuteri Y7 has the therapeutic effect on mammals like canines and felines in addition to human beings.Type: ApplicationFiled: July 16, 2024Publication date: March 27, 2025Inventor: Hui-Yu Huang
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Patent number: 12261142Abstract: A structure including a first semiconductor die and a second semiconductor die is provided. The first semiconductor die includes a first bonding structure. The first bonding structure includes a first dielectric layer and first conductors embedded in the first dielectric layer. The second semiconductor die includes a second bonding structure. The second bonding structure includes a second dielectric layer and second conductors embedded in the second dielectric layer. The first dielectric layer is in contact with the second dielectric layer, and the first conductors are in contact with the second conductors. Thermal conductivity of the first dielectric layer and the second dielectric layer is greater than thermal conductivity of silicon dioxide.Type: GrantFiled: October 18, 2023Date of Patent: March 25, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin
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Publication number: 20250093765Abstract: A method for making a IC is provided, including: identifying, in a schematic, first and second edge elements, which edge elements including devices whose layout patterns are configured to conform to a first layout grid; identifying all the elements between the first and second edge elements, at least one of the identified elements including a device whose layout pattern is configured to conform to a second layout grid that is finer than the first layout grid; and calculating a spatial quantity of a combined layout pattern of the identified elements between the first and second edge elements to determine whether the combined layout pattern conforms to the first layout grid.Type: ApplicationFiled: December 5, 2024Publication date: March 20, 2025Inventors: YU-HAO CHEN, HUI-YU LEE, JUI-FENG KUAN, CHIEN-TE WU
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Publication number: 20250085954Abstract: Embodiments receive a plurality of incoming requests, determine that the plurality of incoming requests comprise a plurality of instant requests, create a software image based on the instant requests, and pull the software image based on a deployed configuration.Type: ApplicationFiled: September 11, 2023Publication date: March 13, 2025Inventors: Gang Pu, Jin Chi He, Hui Yu, Yi Yang HH Huang, Jin Tang Cheng
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Patent number: 12250527Abstract: Disclosed in embodiments of the present disclosure are a communication terminal, a communication system and an audio information processing method, the communication terminal includes a sound reception assembly and a basic communication module, wherein the basic communication module of the communication terminal receives second pickup audio information in a wireless manner, such that the communication terminal acquires returned audio information according to first pickup audio information generated by the communication terminal and the received second pickup audio information, and transmits outwards the returned audio information. Therefore, the technical solution in the embodiments of the present disclosure may realize synchronous sound reception of a plurality of wireless sound reception apparatuses or wireless sound reception components, and may satisfy a requirement for multiple people to use, thereby achieving a good sound reception effect.Type: GrantFiled: July 25, 2022Date of Patent: March 11, 2025Assignee: LUXSHARE-ICT CO., LTD.Inventors: Hui-Yu Wang, Chi-Liang Chen, You-Yu Lin, Min-Hsuan Lee
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Publication number: 20250076694Abstract: A displaying module includes a back plate, a light guide plate fixed to the back plate, a plastic frame covering the back plate and a display panel located on the plastic frame, the plastic frame is of a shape of an annular frame, and the plastic frame includes a bearing face. A first position of the bearing face of the plastic frame is a curved surface, and the curved surface curves in a direction further away from the display panel, whereby a warping degree of the curved surface is a first warping degree, wherein the first position is a position of the bearing face that faces a second position of the display panel, the second position is a position of a region of the display panel where light leakage happens, and the first warping degree is equal to a warping degree of the display panel when the display panel curves.Type: ApplicationFiled: April 29, 2022Publication date: March 6, 2025Applicants: FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE Technology Group Co., Ltd.Inventors: Han Zhang, Kai Diao, Ming Chen, Hongyu Zhao, Dingjie Zheng, Hui Yu, Shuwen Lai
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Publication number: 20250079976Abstract: Disclosed embodiments may include a power converter system with fault handling. Embodiments may include first and second power converters each including an output terminal and a control terminal, the first and second power converters to regulate voltage or current at their respective output terminals based on a voltage at their respective control terminals, the output terminals coupled to each other, and the control terminals coupled to each other; wherein the first power converter comprises: a circuit to detect a fault condition associated with the first power converter and to generate a first fault signal at the control terminal of the first power converter after the detecting the fault condition associated with the first power converter; wherein the second power converter comprises: a circuit to change an operating mode of the second power converter after generating the first fault signal at the control terminal of the first power converter.Type: ApplicationFiled: November 15, 2024Publication date: March 6, 2025Inventors: Tim Wen Hui Yu, Gregory Szczeszynski
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Publication number: 20250064345Abstract: A gait evaluating system including a processor is provided. The processor identifies whether a gait type of the user belongs to a normal gait, a non-neuropathic gait or a neuropathic gait based on step feature values of a user and walking limb feature values of the user. In response to that the gait type of the user belongs to the non-neuropathic gait, the processor controls the display panel to display a first auxiliary information, a second auxiliary information, and a third auxiliary information. The first auxiliary information indicates a potential sarcopenia of the user. The second auxiliary information indicates a dietary guideline for muscle building and muscle strengthening. The third auxiliary information shows a motion instruction video for regaining or maintaining muscle strength of the user.Type: ApplicationFiled: October 18, 2024Publication date: February 27, 2025Applicant: Industrial Technology Research InstituteInventors: Je-Ping Hu, Keng-Hsun Lin, Shih-Fang Yang Mao, Pin-Chou Li, Jian-Hong Wu, Szu-Ju Li, Hui-Yu Cho, Yu-Chang Chen, Yen-Nien Lu, Jyun-Siang Hsu, Nien-Ya Lee, Kuan-Ting Ho, Ming-Chieh Tsai, Ching-Yu Huang
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Publication number: 20250069265Abstract: Tag-guided image positioning method includes: defining a three-dimensional space coordinate system based on tag spatial position information obtained by identifying reference image(s) of a patient's body part disposed with reference tag(s), and position/direction data related to a medical device reference point (MDC)/direction (MDD); estimating a target coordinate in system representing a position of a target point based on three-dimensional medical image of patient's body part marked with target point and reference marker(s) corresponding to position(s) of reference tag(s) and reference coordinate(s) in system representing position(s) of reference tag(s); and outputting a positioning result as a basis for whether patient's body part should be adjusted based on a judgment result indicating whether or not in system a distance between target coordinate and a device coordinate representing a position of MDC and a pointing representing MDD are respectively consistent with a predetermined distance/medical device iType: ApplicationFiled: November 17, 2023Publication date: February 27, 2025Inventors: Wei-Lun HUANG, Yung-Shin TSENG, Wei-Lin CHEN, Hui-Yu TSAI
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Publication number: 20250050272Abstract: The present invention provides a gas processing module, a gas processing method and a gas-phase organic compound processing method. A gas processing module comprises a cavity, a gas input unit, a light source, a photocatalyst, a liquid input unit, a gas discharge unit and a liquid discharge unit. The gas input unit is communicated with the inside of the cavity and used for supplying a to-be-processed gas comprising a gas-phase organic compound into the cavity. The light source is arranged in the cavity and used for providing a first light. The photocatalyst is arranged in the cavity, and at least a portion of the gas-phase organic compound of the to-be-processed gas which comes into contact with the photocatalyst generates an organic compound product under the action of the photocatalyst when irradiated by the first light.Type: ApplicationFiled: August 9, 2024Publication date: February 13, 2025Applicant: GREENFILTEC LTD.Inventors: Yi-Hui YU, Kuo-Min PENG, Yu-De LIEN, Ju-Ting LEE
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Patent number: 12221555Abstract: The present invention relates to a cross-linkable composition comprising an epoxy oligomer comprising at least six hydroxy groups, to a coating obtained by curing the cross-linkable composition and to an optical lens comprising said coating on a surface thereof, in particular on the edge surface thereof. The invention also relates to a method of preparing a coating for an optical lens and to a method of coating a surface of an optical lens, in particular the edge surface of an optical lens.Type: GrantFiled: November 13, 2019Date of Patent: February 11, 2025Assignee: Essilor InternationalInventors: Hui Yu, Sunil Madhukar Bhangale, Prakhar Kasture, Pierre Fromentin
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Patent number: 12224276Abstract: A semiconductor package includes a first die, a first heat conduction block and a first encapsulant. The first die has a bottom surface, a top surface and a sidewall between the bottom surface and the top surface. The first heat conduction block has a bottom surface, a top surface and a sidewall between the bottom surface and the top surface. The first encapsulant is disposed between the sidewall of the first die and the sidewall of the first heat conduction block.Type: GrantFiled: June 10, 2022Date of Patent: February 11, 2025Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Liang-Ju Yen