Patents by Inventor Hui Yu

Hui Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240152246
    Abstract: A joystick includes a stick head, an actuating component, a substrate, a bearing base, a resilient recovering component, a first rotation component and a second rotation component. The actuating component has a first end and a second end opposite to each other. The first end is connected to the stick head, and an identification feature is disposed on the second end. The substrate has a detector used to detect the identification feature and determine motion of the stick head. The bearing base is disposed on the substrate. The resilient recovering component is disposed between the substrate and the bearing base. The first rotation component is movably disposed on the bearing base and rotatable in a first direction. The second rotation component is movably connected to the first rotation component and rotatable in a second direction different from the first direction, and connected to the actuating component in a rotatable manner.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Applicant: PixArt Imaging Inc.
    Inventors: Hung-Yu Lai, Yong-Nong Huang, Hui-Hsuan Chen, Jia-Hong Huang
  • Patent number: 11979158
    Abstract: An integrated circuit (IC) device includes a master latch circuit having a first clock input and a data output, a slave latch circuit having a second clock input and a data input electrically coupled to the data output of the master latch circuit, and a clock circuit. The clock circuit is electrically coupled to the first clock input by a first electrical connection configured to have a first time delay between the clock circuit and the first clock input. The clock circuit is electrically coupled to the second clock input by a second electrical connection configured to have a second time delay between the clock circuit and the second clock input. The first time delay is longer than the second time delay.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Yu Lin, Yung-Chen Chien, Jia-Hong Gao, Jerry Chang Jui Kao, Hui-Zhong Zhuang
  • Publication number: 20240146100
    Abstract: The present application relates to a battery box, the battery box comprising: a charging and energy storage unit for charging and storing electrical energy using an input voltage supplied to the battery box; a power failure detection unit for detecting a power failure of the input voltage; and a power output switching unit for switching an output based on a detection result of the power failure detection unit, wherein the power output switching unit is configured to output a voltage from the charging and energy storage unit when the power failure detection unit detects a power failure, and is configured not to output the voltage when the power failure detection unit does not detect the power failure. The present application also relates to an air conditioning system and a control method for the air conditioning system.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 2, 2024
    Inventors: Xiaojun Guo, Zehang Yu, Hui Zhai, Jian Ni
  • Publication number: 20240145559
    Abstract: A transistor structure includes a substrate, a source electrode, a drain electrode, a protective layer and a gate electrode. The source electrode and the drain electrode are provided on the substrate. The protective layer is provided on the substrate. The protective layer is provided between the source electrode and the drain electrode. The protective layer includes a SiNx layer and a SiOx layer. The SiOx layer is provided on the substrate, the SiNx layer is provided on the SiOx layer, and a through hole of the protective layer is formed to extend through the SiNx layer and the SiOx layer. The gate electrode is provided in the through hole, and the gate electrode is separated from at least part of the SiOx layer so as to form an air gap therebetween.
    Type: Application
    Filed: December 21, 2022
    Publication date: May 2, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chang-Yan HSIEH, Po-Tsung TU, Jui-Chin CHEN, Hui-Yu CHEN, Po-Chun YEH
  • Publication number: 20240141123
    Abstract: A manufacturing method of a modified polymer layer modified by hydroxyapatite is provided in the present disclosure, including following steps: (a) providing a polymer layer; (b) plasma-activating acrylic acid using an atmospheric cold plasma device to modify a surface of the polymer layer to obtain an acrylic-modified polymer layer; (c) immersing the acrylic-modified polymer layer in a first solution containing a calcium ion to obtain a calcium-containing modified layer; and (d) immersing the calcium-containing modified layer in a second solution containing phosphate salt to obtain a modified polymer layer modified by hydroxyapatite.
    Type: Application
    Filed: June 9, 2023
    Publication date: May 2, 2024
    Inventors: Wei-Yu CHEN, Jui-Sheng LEE, Hui-Ju HSU
  • Publication number: 20240137484
    Abstract: Provided in the embodiments of the present disclosure are a display panel, a display apparatus and a driving method therefor, and an image rendering method.
    Type: Application
    Filed: August 27, 2021
    Publication date: April 25, 2024
    Inventors: Tieshi WANG, Kuanjun PENG, Xue DONG, Chunmiao ZHOU, Tao HONG, Hui ZHANG, Xin DUAN, Minglei CHU, Xiaochuan CHEN, Guangcai YUAN, Jing YU
  • Patent number: 11967644
    Abstract: A semiconductor device can include: a substrate having a first doping type; a first well region located in the substrate and having a second doping type, where the first well region is located at opposite sides of a first region of the substrate; a source region and a drain region located in the first region, where the source region has the second doping type, and the drain region has the second doping type; and a buried layer having the second doping type located in the substrate and below the first region, where the buried layer is in contact with the first well region, where the first region is surrounded by the buried layer and the first well region, and the first doping type is opposite to the second doping type.
    Type: Grant
    Filed: January 11, 2023
    Date of Patent: April 23, 2024
    Assignee: Silergy Semiconductor Technology (Hangzhou) LTD
    Inventors: Meng Wang, Yicheng Du, Hui Yu
  • Patent number: 11964358
    Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shang-Yu Wang, Chun-Hao Kung, Ching-Hsiang Tsai, Kei-Wei Chen, Hui-Chi Huang
  • Patent number: 11963969
    Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: April 23, 2024
    Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATION
    Inventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
  • Publication number: 20240128219
    Abstract: A semiconductor die including mechanical-stress-resistant bump structures is provided. The semiconductor die includes dielectric material layers embedding metal interconnect structures, a connection pad-and-via structure, and a bump structure including a bump via portion and a bonding bump portion. The entirety of a bottom surface of the bump via portion is located within an area of a horizontal top surface of a pad portion of the connection pad-and-via structure.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 18, 2024
    Inventors: Hui-Min Huang, Wei-Hung Lin, Kai Jun Zhan, Chang-Jung Hsueh, Wan-Yu Chiang, Ming-Da Cheng
  • Publication number: 20240130246
    Abstract: A method for fabricating a semiconductor device includes the steps of first forming a first inter-metal dielectric (IMD) layer on a substrate and a metal interconnection in the first IMD layer, forming a magnetic tunneling junction (MTJ) and a top electrode on the metal interconnection, forming a spacer adjacent to the MTJ and the top electrode, forming a second IMD layer around the spacer, forming a cap layer on the top electrode, the spacer, and the second IMD layer, and then patterning the cap layer to form a protective cap on the top electrode and the spacer.
    Type: Application
    Filed: December 25, 2023
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Ching-Hua Hsu, Yi-Yu Lin, Hung-Yueh Chen
  • Patent number: 11961637
    Abstract: This disclosure relates to a stretchable composite electrode and a fabricating method thereof, and particularly relates to a stretchable composite electrode including a silver nanowire layer and a flexible polymer film and a fabricating method thereof.
    Type: Grant
    Filed: December 7, 2022
    Date of Patent: April 16, 2024
    Assignee: TPK ADVANCED SOLUTIONS INC.
    Inventors: Wei Sheng Chen, Ching Mao Huang, Jia Hui Zhou, Huan Ran Yu, Shu Xiong Wang, Chin Hui Lee
  • Patent number: 11961789
    Abstract: A semiconductor package includes a chip, a redistribution structure, and first under-ball metallurgies patterns. The chip includes conductive posts exposed at an active surface. The redistribution structure is disposed on the active surface. The redistribution structure includes a first dielectric layer, a topmost metallization layer, and a second dielectric layer. The first dielectric layer includes first openings exposing the conductive posts of the chip. The topmost metallization layer is disposed over the first dielectric layer and is electrically connected to the conductive posts. The topmost metallization layer comprises first contact pads and routing traces connected to the first contact pads. The second dielectric layer is disposed on the topmost metallization layer and includes second openings exposing the first contact pads. The first under-ball metallurgies patterns are disposed on the first contact pads, extending on and contacting sidewalls and top surfaces of the first contact pads.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee
  • Publication number: 20240117342
    Abstract: An construction method of an embryonic chromosome signal library is provided. The construction method comprises obtaining an embryo and performing whole-genome amplification and next-generation sequencing to obtain a first chromosome signal; mapping the first chromosome signal to a chromosome reference signal to obtain a second chromosome signal; dividing the second chromosome signal within a predetermined interval range to obtain a third chromosome signal; and performing a regression correction on the sequencing read count (RC) of the third chromosome signal to obtain an embryonic chromosome signal library. Furthermore, a detection method and system of embryonic chromosomes are also provided. Thereby, the information comparison of the embryo chromosome signal library is used to determine whether the pre-implantation embryo is abnormal or not to achieve pre-implantation chromosome screening of pre-implantation embryos.
    Type: Application
    Filed: October 2, 2023
    Publication date: April 11, 2024
    Inventors: LI-JEN SU, SHAO-PING WENG, YU-YU YEN, LI-CHING WU, HUI-YIN CHIU, JUI-HUNG KAO
  • Patent number: 11957061
    Abstract: A semiconductor device includes a substrate, a first dielectric layer, a second dielectric layer, and a third dielectric layer. The first dielectric layer is disposed on the substrate, around a first metal interconnection. The second dielectric layer is disposed on the first dielectric layer, around a via and a second metal interconnection. The second metal interconnection directly contacts the first metal interconnection. The third dielectric layer is disposed on the second dielectric layer, around a first magnetic tunneling junction (MTJ) structure and a third metal interconnection. The third metal interconnection directly contacts top surfaces of the first MTJ structure and the second metal interconnection, and the first MTJ structure directly contacts the via.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Po-Kai Hsu, Ju-Chun Fan, Yi-Yu Lin, Ching-Hua Hsu, Hung-Yueh Chen
  • Patent number: 11952450
    Abstract: A compound for an encapsulation film and a composition thereof, a film, an organic light-emitting device, and an encapsulation method are provided. The composition comprises the compound, one or more photocurable and thermocurable propenyl compounds, and one or more compounds that produce a free radical and produce an acid under light or heat. The encapsulation film includes the composition as a film of an organic layer. The organic light-emitting device includes the film. The encapsulation method involves encapsulating the organic light-emitting device using the encapsulation film. The composition containing the compound serves as an organic layer. An encapsulation film for the organic light-emitting device is manufactured by repetitively and alternately laminating an inorganic layer and the organic layer.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: April 9, 2024
    Assignee: Jilin OLED Optical and Electronic Materials Co., Ltd.
    Inventors: Enxin Yin, Xiaochen Jiang, Weiwei Duan, Zhe Yu, Hui Wang
  • Patent number: 11948340
    Abstract: An example apparatus for detecting objects in video frames includes a receiver to receive a plurality of video frames from a video camera. The apparatus also includes a first still image object detector to receive a first frame of the plurality of video frames and calculate localization information and confidence information for each potential object patch in the first frame. The apparatus further includes a second still image object detector to receive an adjacent frame of the plurality of video frames adjacent to the first frame and calculate localization information and confidence information for each potential object patch in the adjacent frame. The apparatus includes a similarity detector trained to detect paired patches between the first frame and the adjacent frame based on a comparison of the detected potential object patches.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: April 2, 2024
    Assignee: Intel Corporation
    Inventors: Kun Yu, Ciyong Chen, Xiaotian Guo, Yan Hao, Hui Li, Lu Li, Jianguo Pei, Zhi Yong Zhu
  • Patent number: 11946083
    Abstract: The present invention relates to the production of capsaicinoid compounds including Capsaicin and Nonivamide via microbial fermentation.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: April 2, 2024
    Assignee: Conagen Inc.
    Inventors: Hui Chen, Xiaodan Yu, LanLan Zhou, Hongxue Wang, Min Wang
  • Publication number: 20240100488
    Abstract: Provided are a high temperature-resistant composite nanofiltration membrane and a preparation method thereof. The high temperature-resistant composite nanofiltration membrane includes a base membrane and a polyamide membrane arranged on the base membrane; wherein the polyamide membrane is prepared from raw materials comprising: an amine, an inorganic salt, a silane additive, a polyacyl chloride, and an oil phase solvent; and the silane additive is at least one selected from the group consisting of 3-aminopropyltriethoxysilane, divinyltriaminopropyltrimethoxysilane, N-cyclohexyl-?-aminopropyltrimethoxysilane, and trimethoxy[3-(phenylamino)propyl]silane.
    Type: Application
    Filed: July 13, 2023
    Publication date: March 28, 2024
    Inventors: Hui YU, Hongwei LU, Bo PENG, Qunhui HU, Qian LIAO, Pan HE, Yanbo HE, Jun PENG
  • Publication number: 20240103220
    Abstract: A device includes a first package connected to an interconnect substrate, wherein the interconnect substrate includes conductive routing; and a second package connected to the interconnect substrate, wherein the second package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler and to a photodetector; a via extending through the substrate; an interconnect structure over the photonic layer, wherein the interconnect structure is connected to the photodetector and to the via; and an electronic die bonded to the interconnect structure, wherein the electronic die is connected to the interconnect structure.
    Type: Application
    Filed: December 1, 2023
    Publication date: March 28, 2024
    Inventors: Chen-Hua Yu, Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu