Patents by Inventor Hui Yu

Hui Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12184875
    Abstract: A non-transitory computer-readable medium of a device that stores computer-executable instructions is provided. When the instructions are executed by the device, the instructions cause the device to: determine a line index of a block unit determined from an image frame in the bitstream for selecting one of reference lines; compare the line index with a first predefined value to determine whether a mode flag is included in the bitstream; determine a mode index in the bitstream for directly selecting a prediction mode from a most probable mode (MPM) list when the mode flag is not included in the bitstream; compare the mode flag to a second predefined value when the mode flag is included in the bitstream to determine whether the prediction mode is selected from the MPM list based on the mode index; and reconstruct the block unit based on the selected reference line and the prediction mode.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: December 31, 2024
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Hui-Yu Jiang, Yao-Jen Chang
  • Patent number: 12181178
    Abstract: A mounting bracket assembly includes a support plate and an outdoor support. The support plate includes an outer support member. A mounting slide groove is formed at the outer support member and extending in a length direction of the support plate. One end of the outdoor support is slidably provided in the mounting slide groove. A limit structure is provided between the one end of the outdoor support and the mounting slide groove and configured to limit the one end of the outdoor support from separating from the mounting slide groove.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: December 31, 2024
    Assignees: GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Zhisheng Lei, Zhigang Xing, Hui Yu, Wenjun Shen, Yuhang Tang, Kangwen Zhang, Ali Zhao
  • Publication number: 20240425853
    Abstract: A modified small interfering RNA (siRNA) molecule comprising phosphorothioate (PS) intemucleotide linkages in the antisense strand for reducing off-target effects and methods and uses thereof. The siRNAs targeting Hypoxia Inducible Factor 1 Subunit Alpha (HIF1a) with high specificity and silencing efficiency.
    Type: Application
    Filed: July 21, 2022
    Publication date: December 26, 2024
    Applicant: MICROBIO (SHANGHAI) CO. LTD.
    Inventors: Yi-Chung Chang, Chi-Fan Yang, Hui-Yu Chen, Chia-Chun Yang
  • Publication number: 20240413052
    Abstract: The present disclosure describes heat dissipating structures that can be formed either in functional or non-functional areas of three-dimensional system on integrated chip structures. In some embodiments, the heat dissipating structures maintain an average operating temperature of memory dies or chips below about 90° C. For example, a structure includes a stack with chip layers, where each chip layer includes one or more chips and an edge portion. The structure further includes a thermal interface material disposed on the edge portion of each chip layer, a thermal interface material layer disposed over a top chip layer of the stack, and a heat sink over the thermal interface material layer.
    Type: Application
    Filed: July 31, 2024
    Publication date: December 12, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hsiang HUANG, Chin-Chou LIU, Chin-Her CHIEN, Fong-yuan CHANG, Hui Yu LEE
  • Patent number: 12163144
    Abstract: The GmLMM1 gene, which is involved in the regulation of PTI immune responses, Phytophthora resistance, bacterial blight of soybean disease, soybean halo disease, etc., is cloned in soybeans. The PTI immune response and pathogen resistance of plants can be negatively regulated via the GmLMM1 gene. By reducing the expression of GmLMM1, the PTI immune response of plants can be effectively enhanced, and the pathogen resistance of plants can be increased. Cloning and functional discovery of the GmLMM1 gene provide important foundations and theoretical support for research on the related mechanisms of soybean disease resistance and provide valuable genetic resources for advancing the research and application of plant defense systems. Additionally, cloning and functional delivery of the GmLMM1 gene allows for breeding new soybean varieties with high disease resistance.
    Type: Grant
    Filed: July 30, 2020
    Date of Patent: December 10, 2024
    Assignee: Northeast Institute of Geography and Agroecology, Chinese Academy of Sciences
    Inventors: Xianzhong Feng, Suxin Yang, Dongmei Wang, Hui Yu
  • Patent number: 12166091
    Abstract: An LDMOS transistor can include: a field oxide layer structure adjacent to a drain region; and at least one drain oxide layer structure adjacent to the field oxide layer structure along a lateral direction, where a thickness of the drain oxide layer structure is less than a thickness of the field oxide layer, and at least one of a length of the field oxide layer structure and a length of the drain oxide layer structure is adjusted to improve a breakdown voltage performance of the LDMOS transistor.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: December 10, 2024
    Assignee: Silergy Semiconductor Technology (Hangzhou) LTD
    Inventors: Meng Wang, Hui Yu
  • Patent number: 12167509
    Abstract: A photonic heater is provided. The photonic heater includes a current source and a transfer circuit. The transfer circuit connected to the current source. The photonic heater further includes a heating element. The heating element is connected to the transfer circuit. The transfer circuit is operable to regulate an amount of current being transferred from the current court to the heating element.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: December 10, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Hui Yu Lee
  • Publication number: 20240403065
    Abstract: The disclosed device includes multiple special purpose processors that are configured to perform, in parallel, a power on transition sequence for the device, which can involve restoring a data state of components of the device using data stored in local storages of the special purpose processors. Various other methods, systems, and computer-readable media are also disclosed.
    Type: Application
    Filed: May 31, 2024
    Publication date: December 5, 2024
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Sriram Sambamurthy, Indrani Paul, Kevin M. Brandl, James R. Magro, Zhao Hui Yu, Oswin E. Housty
  • Publication number: 20240405654
    Abstract: An integrated circuit (IC) for controlling a power converter. The IC includes a controller that, in a first sensing period, enables a sensing circuit of the power converter and electrically connects an output node of an op amp of the sensing circuit and a first node of a capacitor of the sensing circuit, creating a first voltage across the capacitor; in a period between the first sensing period and a second sensing period, disables the sensing circuit and disconnects the output node of the op amp and the first node of the capacitor to maintain the first voltage across the capacitor; and in the second sensing period, enables the sensing circuit and connects the output node of the op amp and the first node of the capacitor, the maintained first voltage across the capacitor reducing a settling time for the enabled sensing circuit.
    Type: Application
    Filed: August 9, 2024
    Publication date: December 5, 2024
    Inventors: Tim Wen Hui Yu, Gregory Szczeszynski
  • Publication number: 20240404046
    Abstract: The present invention proposed a super-resolution reconstruction device for Micro CT images of rat ankle fractures, comprising a rat ankle image preprocessing module, an HR LR image pair configuration module, a deep model module, and an image super-resolution reconstruction module. The aforementioned four modules were sequentially connected; the present invention also proposed an improved R2 RCAN model based on RCAN, which was a super-resolution reconstruction model grounded on self-attention mechanisms that enhanced the model's ability to extract features in multiple scales by incorporating Res2Net. Compared with other classic super-resolution models, the proposed R2 RCAN model achieved the best results.
    Type: Application
    Filed: June 1, 2023
    Publication date: December 5, 2024
    Inventors: Hui Yu, Jinglai Sun, Liyuan Zhang, Jing Zhao, Chong Liu
  • Patent number: 12154842
    Abstract: The present disclosure describes heat dissipating structures that can be formed either in functional or non-functional areas of three-dimensional system on integrated chip structures. In some embodiments, the heat dissipating structures maintain an average operating temperature of memory dies or chips below about 90° C. For example, a structure includes a stack with chip layers, where each chip layer includes one or more chips and an edge portion. The structure further includes a thermal interface material disposed on the edge portion of each chip layer, a thermal interface material layer disposed over a top chip layer of the stack, and a heat sink over the thermal interface material layer.
    Type: Grant
    Filed: July 5, 2023
    Date of Patent: November 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Hsiang Huang, Chin-Chou Liu, Chin-Her Chien, Fong-yuan Chang, Hui Yu Lee
  • Patent number: 12146669
    Abstract: An indoor heat exchanger includes a heat exchanger shell, a side plate structure including shell side plates arranged at both ends of the heat exchanger shell, heat exchange fins installed at the shell side plates provided in the heat exchanger shell, refrigerant pipes passing through the heat exchange fins, and connection pipes protruding from an end of the heat exchanger shell and each connected to ends of two refrigerant pipes on same side.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: November 19, 2024
    Assignees: GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Hui Yu, Zhigang Xing
  • Patent number: 12149167
    Abstract: Disclosed embodiments may include a power converter system with fault handling. Embodiments may include first and second power converters each including an output terminal and a control terminal, the first and second power converters to regulate voltage or current at their respective output terminals based on a voltage at their respective control terminals, the output terminals coupled to each other, and the control terminals coupled to each other; wherein the first power converter comprises: a circuit to detect a fault condition associated with the first power converter and to generate a first fault signal at the control terminal of the first power converter after the detecting the fault condition associated with the first power converter; wherein the second power converter comprises: a circuit to change an operating mode of the second power converter after generating the first fault signal at the control terminal of the first power converter.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: November 19, 2024
    Assignee: pSemi Corporation
    Inventors: Tim Wen Hui Yu, Gregory Szczeszynski
  • Publication number: 20240379305
    Abstract: A key structure includes a keycap, a connecting member, a fixing member, a light emitter and a light receiver. The connecting member is connected to an inner top surface of the keycap and extends downwards, and the connecting member has a first opening through the connecting member. The fixing member has a second opening through the fixing member, in which when the keycap is initially pressed and then continues to be pressed, the keycap moves in a direction, and the connecting member moves with the keycap, and an overlapping region defined by the first opening and the second opening gradually becomes larger or smaller. The light emitter is laterally adjacent to the second opening of the fixing member. The light receiver is laterally adjacent to the first opening of the connecting member.
    Type: Application
    Filed: June 30, 2023
    Publication date: November 14, 2024
    Inventors: Chien-Pang Chien, Tsu-Hui Yu, Tao-Ying Chen, Chun-Nan Su, Chun-Che Wu
  • Publication number: 20240361546
    Abstract: In a method, a stacked structure including an electronic integrated circuit (IC) and a photonic IC is bonded to a heat spreader releasably attached to a carrier. A first multilayer structure is sequentially deposited and patterned over the stacked structure to form, in the first multilayer structure, a first waveguide optically coupled to the photonic IC. A redistribution structure is sequentially deposited and patterned over the first multilayer structure, the redistribution structure electrically coupled to the photonic IC. The carrier is detached from the heat spreader.
    Type: Application
    Filed: July 12, 2024
    Publication date: October 31, 2024
    Inventors: Yu-Hao CHEN, Hui Yu LEE
  • Patent number: 12130030
    Abstract: A window air conditioner includes a chassis, a housing including an indoor-side housing and an outdoor-side housing respectively arranged at two sides of the chassis, an electric control box installed at the chassis and located in the outdoor-side housing, a junction box arranged in the indoor-side housing, and a wiring plate arranged at the chassis and including a power supply wire slot, a strong electric wire slot, and a weak electric wire slot isolated from each other. A power wire electrically connected to the electric control box is arranged in the power supply wire slot. A strong electric wire electrically connected to at least one of the electric control box or the junction box is arranged in the strong electric wire slot. A weak electric wire electrically connected to the electric control box is arranged in the weak electric wire slot.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: October 29, 2024
    Assignees: GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD., MIDEA GROUP CO., LTD.
    Inventors: Fashen Liu, Hui Yu, Yu Liu, Kangwen Zhang
  • Publication number: 20240355769
    Abstract: A method and a system for verifying an integrated circuit stack having at least one silicon photonic device is introduced. A dummy layer and a dummy layer text are added to a terminal of at least one silicon photonic device of the integrated circuit. The method may perform a layout versus schematic check of the integrated circuit including the dummy layer and the dummy layer text.
    Type: Application
    Filed: July 2, 2024
    Publication date: October 24, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Feng-Wei Kuo, Hui-Yu Lee
  • Publication number: 20240355756
    Abstract: Provided is a method of fabricating a package including: providing a die with a contact thereon; forming a redistribution layer (RDL) structure on the die, the forming the RDL structure on the die comprising: forming a first dielectric material on the die; forming a conductive feature in and partially on the first dielectric material; after the forming the conductive feature, forming a protective layer on the conductive feature, wherein the protective layer covers a top surface of the conductive feature and extends to cover a top surface of the first dielectric material; forming a second dielectric material on the protective layer; and performing a planarization process to expose the conductive feature; and forming a plurality of conductive connectors to electrically connect the die through the RDL structure.
    Type: Application
    Filed: July 3, 2024
    Publication date: October 24, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Hua Yu, Kuo-Chung Yee, Chun-Hui Yu
  • Publication number: 20240355299
    Abstract: A stacked-screen display device and a method for controlling a display device are provided. The stacked-screen display device includes a backlight module, a light control panel and a display panel which are stacked in sequence, where the backlight module includes a backplane, a reflector and a diffuser which are stacked in sequence, and the reflector is provided with a plurality of light-emitting units, the backlight module is provided with temperature sensors, the temperature sensors are configured to detect the temperature of the backlight module to compensate the display panel according to the temperature.
    Type: Application
    Filed: July 3, 2024
    Publication date: October 24, 2024
    Inventors: Xin CHEN, Kai DIAO, Qingna HOU, Meizhen CHEN, Hongzhou XIE, Renhui YU, Ying TIAN, Xiaoyang LIU, Hui YU, Chengkun LIU
  • Publication number: 20240345425
    Abstract: A method includes forming, over a substrate, an optical component and first, second and third thermal control mechanisms. The optical component includes first and second main paths, and first and second side paths each having opposite ends correspondingly coupled to the first and second main paths. The second side path is spaced from the first side path. Each of the first, second and third thermal control mechanisms includes a first thermoelectric member having a first conductivity type, a second thermoelectric member having a second conductivity type opposite to the first conductivity type, and a conductive structure that electrically connects the first thermoelectric member to the second thermoelectric member. The first side path is between the first and third thermal control mechanisms. The second side path is between the second and third thermal control mechanisms. The third thermal control mechanism is between the first and second side paths.
    Type: Application
    Filed: June 27, 2024
    Publication date: October 17, 2024
    Inventors: Yu-Hao CHEN, Hui Yu LEE, Jui-Feng KUAN, Chien-Te WU