Abstract: An optical circuit includes one or more input waveguides, a plurality of output waveguides, and a reflector structure. At least a portion of the reflector structure forms an interface with the one or more input waveguides. The portion of the reflector structure has a smaller refractive index than the one or more input waveguides. An electrical circuit is electrically coupled to the optical circuit. The electrical circuit generates and sends different electrical signals to the reflector structure. In response to the reflector structure receiving the different electrical signals, a carrier concentration level at or near the interface or a temperature at or near the interface changes, such that incident radiation received from the one or more input waveguides is tunably reflected by the reflector structure into a targeted output waveguide of the plurality of output waveguides.

Abstract: Small interfering RNAs (siRNA) having specific modification patterns to improve interference efficiencies thereof. The modification patterns each comprises a combination of 2?-O methyl modification, 2?-O-fluoro-modification, and phosphorothioate (PS) bonds at defined positions in the sense strand and anti-sense strand of each siRNA, and optionally 5? phosphate modifications.

Abstract: The probiotics, Lactobacillus reuteri Y7, are used in eye protection for preventing and treating ocular inflammatory reactions, apoptosis and retinal injuries after exposure to blue light. The exposure to blue light does harms to a retina such as blue light-induced retinal atrophy, retinal thickness thinned, macular choroidal neovascularization (CNV) and photosensitivity of a retina dysfunctional; the exposure to blue light causes retinal injuries such as the macular disease, particularly the late dry macular disease. Lactobacillus reuteri Y7 has the therapeutic effect on mammals like canines and felines in addition to human beings.

Abstract: A structure including a first semiconductor die and a second semiconductor die is provided. The first semiconductor die includes a first bonding structure. The first bonding structure includes a first dielectric layer and first conductors embedded in the first dielectric layer. The second semiconductor die includes a second bonding structure. The second bonding structure includes a second dielectric layer and second conductors embedded in the second dielectric layer. The first dielectric layer is in contact with the second dielectric layer, and the first conductors are in contact with the second conductors. Thermal conductivity of the first dielectric layer and the second dielectric layer is greater than thermal conductivity of silicon dioxide.

Abstract: A method for making a IC is provided, including: identifying, in a schematic, first and second edge elements, which edge elements including devices whose layout patterns are configured to conform to a first layout grid; identifying all the elements between the first and second edge elements, at least one of the identified elements including a device whose layout pattern is configured to conform to a second layout grid that is finer than the first layout grid; and calculating a spatial quantity of a combined layout pattern of the identified elements between the first and second edge elements to determine whether the combined layout pattern conforms to the first layout grid.

Abstract: Embodiments receive a plurality of incoming requests, determine that the plurality of incoming requests comprise a plurality of instant requests, create a software image based on the instant requests, and pull the software image based on a deployed configuration.

Abstract: Disclosed in embodiments of the present disclosure are a communication terminal, a communication system and an audio information processing method, the communication terminal includes a sound reception assembly and a basic communication module, wherein the basic communication module of the communication terminal receives second pickup audio information in a wireless manner, such that the communication terminal acquires returned audio information according to first pickup audio information generated by the communication terminal and the received second pickup audio information, and transmits outwards the returned audio information. Therefore, the technical solution in the embodiments of the present disclosure may realize synchronous sound reception of a plurality of wireless sound reception apparatuses or wireless sound reception components, and may satisfy a requirement for multiple people to use, thereby achieving a good sound reception effect.

Abstract: Disclosed embodiments may include a power converter system with fault handling. Embodiments may include first and second power converters each including an output terminal and a control terminal, the first and second power converters to regulate voltage or current at their respective output terminals based on a voltage at their respective control terminals, the output terminals coupled to each other, and the control terminals coupled to each other; wherein the first power converter comprises: a circuit to detect a fault condition associated with the first power converter and to generate a first fault signal at the control terminal of the first power converter after the detecting the fault condition associated with the first power converter; wherein the second power converter comprises: a circuit to change an operating mode of the second power converter after generating the first fault signal at the control terminal of the first power converter.

Abstract: A displaying module includes a back plate, a light guide plate fixed to the back plate, a plastic frame covering the back plate and a display panel located on the plastic frame, the plastic frame is of a shape of an annular frame, and the plastic frame includes a bearing face. A first position of the bearing face of the plastic frame is a curved surface, and the curved surface curves in a direction further away from the display panel, whereby a warping degree of the curved surface is a first warping degree, wherein the first position is a position of the bearing face that faces a second position of the display panel, the second position is a position of a region of the display panel where light leakage happens, and the first warping degree is equal to a warping degree of the display panel when the display panel curves.

Abstract: A gait evaluating system including a processor is provided. The processor identifies whether a gait type of the user belongs to a normal gait, a non-neuropathic gait or a neuropathic gait based on step feature values of a user and walking limb feature values of the user. In response to that the gait type of the user belongs to the non-neuropathic gait, the processor controls the display panel to display a first auxiliary information, a second auxiliary information, and a third auxiliary information. The first auxiliary information indicates a potential sarcopenia of the user. The second auxiliary information indicates a dietary guideline for muscle building and muscle strengthening. The third auxiliary information shows a motion instruction video for regaining or maintaining muscle strength of the user.

Abstract: Tag-guided image positioning method includes: defining a three-dimensional space coordinate system based on tag spatial position information obtained by identifying reference image(s) of a patient's body part disposed with reference tag(s), and position/direction data related to a medical device reference point (MDC)/direction (MDD); estimating a target coordinate in system representing a position of a target point based on three-dimensional medical image of patient's body part marked with target point and reference marker(s) corresponding to position(s) of reference tag(s) and reference coordinate(s) in system representing position(s) of reference tag(s); and outputting a positioning result as a basis for whether patient's body part should be adjusted based on a judgment result indicating whether or not in system a distance between target coordinate and a device coordinate representing a position of MDC and a pointing representing MDD are respectively consistent with a predetermined distance/medical device i

Abstract: The present invention provides a gas processing module, a gas processing method and a gas-phase organic compound processing method. A gas processing module comprises a cavity, a gas input unit, a light source, a photocatalyst, a liquid input unit, a gas discharge unit and a liquid discharge unit. The gas input unit is communicated with the inside of the cavity and used for supplying a to-be-processed gas comprising a gas-phase organic compound into the cavity. The light source is arranged in the cavity and used for providing a first light. The photocatalyst is arranged in the cavity, and at least a portion of the gas-phase organic compound of the to-be-processed gas which comes into contact with the photocatalyst generates an organic compound product under the action of the photocatalyst when irradiated by the first light.

Abstract: A semiconductor package includes a first die, a first heat conduction block and a first encapsulant. The first die has a bottom surface, a top surface and a sidewall between the bottom surface and the top surface. The first heat conduction block has a bottom surface, a top surface and a sidewall between the bottom surface and the top surface. The first encapsulant is disposed between the sidewall of the first die and the sidewall of the first heat conduction block.

Abstract: The present invention relates to a cross-linkable composition comprising an epoxy oligomer comprising at least six hydroxy groups, to a coating obtained by curing the cross-linkable composition and to an optical lens comprising said coating on a surface thereof, in particular on the edge surface thereof. The invention also relates to a method of preparing a coating for an optical lens and to a method of coating a surface of an optical lens, in particular the edge surface of an optical lens.

Abstract: A sawdust discharge guiding device of a carpenter circular saw machine is provided, including a dust shielding cover including a fixed cover body including first and second end walls and first and second lateral walls having bottoms to which a dust discharge portion having a dust discharge opening is connected; a movable shield plate including a pivot through-hole; a pivot assembly pivotally connected between a pivot aperture formed in the fixed cover body and the pivot through-hole of the movable shield plate to allow the movable shield plate to rotate about the pivot assembly; and a torsion spring having a middle through which the pivot assembly penetrate and having one end supported on the first lateral wall of the fixed cover body and an opposite end supported on the movable shield plate to provide a biasing force for upward rotation to the movable shield plate.

Abstract: A semiconductor device can include: a substrate; a well region located in the substrate and having a first doping type; a body region located in the substrate and having a second doping type that is opposite to the first doping type; a source region located in the body region and having the first doping type; a drain region located in the well region and having the first doping type; an isolation structure located on the substrate and between the drain region and the source region; and a gate structure located on the isolation structure and including a first gate region and a second gate region, where the first gate region is of the first doping type, and the second gate region is of the second doping type.

Abstract: A secure localization method for multi-mobile robots system based on network communication includes: Step 1, establishing a nonlinear dynamic model of a multi-mobile robots system based on network communication; Step 2, designing a secure estimator for the nonlinear dynamic model; Step 3, calculating an upper bound on a one-step prediction error covariance matrix ?i,k+1|k for each mobile robot in the network communication; Step 4, based on ?i,k+1|k, calculating an estimator gain matrix Ki,k+1 for each mobile robot in the network communication; Step 5, substituting the estimator gain matrix Ki,k+1 calculated in Step 4 into Step 2 to obtain a state estimation {circumflex over (x)}i,k+1|k+1 at time k+1; determining whether k+1 reaches a total duration M, that is, if k+1<M, performing Step 6, and if k+1=M, ending; and Step 6, based on Ki,k+1, calculating an upper bound on an estimation error covariance matrix ?i,k+1|k+1 of each mobile robot; let k=k+1, and performing Step 2 until k+1=M is satisfied.

Abstract: A method for making a IC is provided, including: identifying, in a schematic, first and second edge elements, which edge elements including devices whose layout patterns are configured to conform to a first layout grid; identifying all the elements between the first and second edge elements, at least one of the identified elements including a device whose layout pattern is configured to conform to a second layout grid that is finer than the first layout grid; and calculating a spatial quantity of a combined layout pattern of the identified elements between the first and second edge elements to determine whether the combined layout pattern conforms to the first layout grid.

Abstract: An apparatus may include a printed circuit board including an integrated circuit including buck converter circuitry and an inductor coupled to the integrated circuit.

Abstract: Disclosed are apparatus and methods for a silicon photonic (SiPh) structure comprising the integration of an electrical integrated circuit (EIC); a photonic integrated circuit (PIC) disposed on top of the EIC; two or more polymer waveguides (PWGs) disposed on top of the PIC and formed by layers of cladding polymer and core polymer; and an integration fan-out redistribution (InFO RDL) layer disposed on top of the two or more PWGs. The operation of PWGs is based on the refractive indexes of the cladding and core polymers. Inter-layer optical signals coupling is provided by edge-coupling, reflective prisms and grating coupling. A wafer-level system implements a SiPh structure die and provides inter-die signal optical interconnections among the PWGs.