Patents by Inventor Huiling Shang

Huiling Shang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6603181
    Abstract: A MOS structure processed to have a semiconductor-dielectric interface that is passivated to reduce the interface state density. An example is a MOSFET having a gate dielectric on which an electrode is present that is substantially impervious to molecular hydrogen, but sufficiently thin to be pervious to atomic hydrogen, enabling atomic hydrogen to be diffused therethrough into an underlying semiconductor-dielectric interface. Atomic hydrogen diffusion can be achieved by subjecting such an electrode to hydrogen plasma, forming the electrode of an aluminum-tungsten alloy in the presence of hydrogen, and implanting atomic hydrogen into the electrode. The latter two techniques are each followed by an anneal to cause the atomic hydrogen to diffuse through the electrode and into the semiconductor-dielectric interface.
    Type: Grant
    Filed: January 16, 2001
    Date of Patent: August 5, 2003
    Assignee: International Business Machines Corporation
    Inventors: Paul M. Solomon, Douglas A. Buchanan, Eduard A. Cartier, Kathryn W. Guarini, Fenton R. McFeely, Huiling Shang, John J. Yourkas
  • Publication number: 20030132492
    Abstract: A process for passivating the semiconductor-dielectric interface of a MOS structure to reduce the interface state density to a very low level. A particular example is a MOSFET having a tungsten electrode that in the past has prevented passivation of the underlying semiconductor-dielectric interface to an extent sufficient to reduce the interface state density to less than 5x1010/cm2-eV. Though substantially impervious to molecular hydrogen, thin tungsten layers are shown to be pervious to atomic hydrogen, enabling atomic hydrogen to be diffused through a tungsten electrode into an underlying semiconductor-dielectric interface.
    Type: Application
    Filed: March 20, 2003
    Publication date: July 17, 2003
    Applicant: International Business Machines Corporation
    Inventors: Paul M. Solomon , Douglas A. Buchanan , Eduard A. Cartier , Kathryn W. Guarini , Fenton R. McFeely , Huiling Shang , John J. Yourkas
  • Publication number: 20020094643
    Abstract: A process for passivating the semiconductor-dielectric interface of a MOS structure to reduce the interface state density to a very low level. A particular example is a MOSFET having a tungsten electrode that in the past has prevented passivation of the underlying semiconductor-dielectric interface to an extent sufficient to reduce the interface state density to less than 5×1010/cm2-eV. Though substantially impervious to molecular hydrogen, thin tungsten layers are shown to be pervious to atomic hydrogen, enabling atomic hydrogen to be diffused through a tungsten electrode into an underlying semiconductor-dielectric interface.
    Type: Application
    Filed: January 16, 2001
    Publication date: July 18, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Paul M. Solomon, Douglas A. Buchanan, Eduard A. Cartier, Kathryn W. Guarini, Fenton R. McFeely, Huiling Shang, John J. Yourkas