Abstract: The method for programming a non-volatile memory includes the following steps. Perform a program and program verify operation for a memory cell in the non-volatile memory, wherein the program and program verify operation includes applying a sequence of incremental step pulses to the memory cell. Perform a post-verifying operation for the memory cell after the memory cell passes the program and program verify operation. Apply a post-programming pulse to the memory cell if the memory cell fails the post-verifying operation, wherein the amplitude of the post-programming pulse is greater than the amplitude of the last pulse in the sequence of incremental step pulses. Perform a read operation to the non-volatile memory to obtain a failed bit count corresponding to the read operation. Adjust a read reference voltage of the read operation to minimize the failed bit count.

Abstract: An erase-verify method for a three-dimensional (3D) memory and a memory system are provided. The 3D memory includes at least one memory cell string including a plurality of memory cells, and the memory cells include a first group of memory cells and a second group of memory cells. Each of the memory cells is coupled to a word line. The method comprises the following steps. A first erase-verify operation is performed on the first group of memory cells. After performing the first erase-verify operation on the first group of memory cells, a second erase-verify operation is performed on the second group of memory cells in condition that the first group of memory cells are verified as erased successfully.

Abstract: An erase-verify method for a three-dimensional (3D) memory and a memory system are provided. The 3D memory includes at least one memory cell string including a plurality of memory cells, and the memory cells include a first group of memory cells and a second group of memory cells. Each of the memory cells is coupled to a word line. The method comprises the following steps. A first erase-verify operation is performed on the first group of memory cells. After performing the first erase-verify operation on the first group of memory cells, a second erase-verify operation is performed on the second group of memory cells in condition that the first group of memory cells are verified as erased successfully.

Abstract: A method for programming a non-volatile memory and a memory system are provided. Each of multiple cells of the non-volatile memory stores data having at least 2 bits. The method includes the following steps. At least one programming pulse is provided for programming a target cell of the cells. At least one program-verify pulse is provided for verifying whether the target cell is successfully programmed. It is determined that whether a threshold voltage of the target cell is greater than or equal to a program-verify voltage. When the threshold voltage is greater than or equal to the program-verify voltage, the target cell is set as successfully programmed. Next, a post-verifying operation is performed to the successfully programmed cell. The post-verifying operation includes determining whether the threshold voltage of the target cell is greater than or equal to a post-verifying voltage.

Abstract: A computer program product enables an advertisement audience dynamical detection circuit to conduct an advertisement audience quantity detecting operation. The advertisement audience quantity detecting operation includes: receiving a probe request frame transmitted from other wireless communication device; recording the arrival time of the probe request frame; inspecting the frame field configuration of the probe request frame; allocating the probe request to a corresponding data group according to the arrival time and frame field configuration of the probe request frame and a sequence control value in the header of the probe request frame while ensuring all probe request frames in the same data group have same frame field configuration; and calculating an estimated quantity of advertisement audiences passing through a specific location in a specific time period based on a total quantity of resulting data groups.

Abstract: A vertebral lamina supporting device is provided. The vertebral lamina supporting device includes a first supporting member, a second supporting member and at least one connecting member. The first supporting member includes a first supporting base, in which the first supporting base has a first abutting surface and a first surface opposite to the first abutting surface. The first abutting surface has at least two radially arranged first concave arc portions. The second supporting member is movable relative to the first supporting member. The second supporting member includes a second supporting base, in which the second supporting base has a second abutting surface and a second surface opposite to the second abutting surface. The second abutting surface has at least two radially arranged second concave arc portions. The connecting member is connected between the first supporting member and the second supporting member.

Abstract: A vertebral lamina supporting device is provided. The vertebral lamina supporting device includes a first supporting member, a second supporting member and at least one connecting member. The first supporting member includes a first supporting base, in which the first supporting base has a first abutting surface and a first surface opposite to the first abutting surface. The first abutting surface has at least two radially arranged first concave arc portions. The second supporting member is movable relative to the first supporting member. The second supporting member includes a second supporting base, in which the second supporting base has a second abutting surface and a second surface opposite to the second abutting surface. The second abutting surface has at least two radially arranged second concave arc portions. The connecting member is connected between the first supporting member and the second supporting member.

Abstract: Methods and apparatuses are contemplated herein for enhancing the program performance of nonvolatile memory devices. In an example embodiment, a nonvolatile memory device comprises a 3D array of nonvolatile memory cells including a plurality of layers, each layer comprising NAND strings of nonvolatile memory cells, the NAND strings coupled to a bit line, and a plurality SSLs and word lines, the SSLs and the word lines arranged orthogonally to the NAND strings, the word lines establishing the nonvolatile memory cells at cross-points between surfaces of the plurality of NAND strings and the word lines, each of the NAND strings further comprising a plurality of SSL transistors coupling the SSLs to the NAND strings, wherein at least a first SSL being configured to receive a first voltage and a second SSL configured to receive at second voltage, and wherein the second SSL being nearer to the word lines.

Abstract: Provided are improved semiconductor memory devices and methods for manufacturing such semiconductor memory devices. A method may incorporate the formation of a p-n junction in a conductive layer. The method may allow for the production of semiconductor memory devices of reduced size.

Abstract: A method, apparatus and computer program product are provided in order to test word line failure of a non-volatile memory device. An example of the method includes performing a failure screening of the non-volatile memory device, wherein the non-volatile memory device comprises one or more word lines; identifying a point of failure located between a first word line and a second word line; and marking the first word line and the second word line as a single word line in response to identifying the point of failure between the first word line and the second word line.

Abstract: Embodiments of the present invention provide improved three-dimensional memory cells, arrays, devices, and/or the like and associated methods. In one embodiment, a three-dimensional memory cell is provided. The three-dimensional memory cell comprises a first conductive layer; a third conductive layer spaced apart from the first conductive layer; a channel conductive layer connecting the first conductive layer and the third conductive layer to form an opening having internal surfaces; a dielectric layer disposed along the internal surfaces of the opening surrounded by the first conductive layer, the channel conductive layer and the third conductive layer; and a second conductive layer interposed and substantially filling a remaining open portion formed by the dielectric layer. The first conductive layer, the dielectric layer, and the second conductive layer are configured to form a staircase structure.

Abstract: Embodiments of the present invention provide improved three-dimensional memory cells, arrays, devices, and/or the like and associated methods. In one embodiment, a three-dimensional memory cell is provided. The three-dimensional memory cell comprises a first conductive layer; a third conductive layer spaced apart from the first conductive layer; a channel conductive layer connecting the first conductive layer and the third conductive layer to form an opening having internal surfaces; a dielectric layer disposed along the internal surfaces of the opening surrounded by the first conductive layer, the channel conductive layer and the third conductive layer; and a second conductive layer interposed and substantially filling a remaining open portion formed by the dielectric layer. The first conductive layer, the dielectric layer, and the second conductive layer are configured to form a staircase structure.

Abstract: Methods and apparatuses are contemplated herein for reducing bit-line recovery time of nonvolatile memory devices. In an example embodiment, a nonvolatile memory device comprises a 3D array of non-volatile memory cells, including a plurality of blocks, each block comprising a plurality of NAND strings, each of the NAND strings coupled to a bit line and word lines, the word lines arranged orthogonally to the NAND strings and establishing the memory cells at cross-points between surfaces of the NAND strings and the word lines, and a first set of discharge transistors positioned at an edge of the 3D array, coupled to a corresponding bit line, and configured for BL discharge, and a second set of discharge transistors positioned such that a first portion of BL potential is discharged through the first set of discharge transistors and a second portion through the second set.

Abstract: Methods and apparatuses are contemplated herein for enhancing the efficiency of nonvolatile memory devices. In an example embodiment, a nonvolatile memory device comprises a substrate and 3D array of nonvolatile memory cells, the 3D array including a plurality of conductive layers, separated from each other by insulating layers, the plurality of conductive layers comprising a top layer, the top layer comprising n string select lines (SSLs) and one or more bottom layers, the top layer further comprises n?1 cuts, each cut electrically separating two SSLs, wherein each cut is cut to a depth of the top layer and not extending into the bottom layers and a plurality of vertical channels arranged orthogonal to the plurality of layers, each of the plurality of channels comprising a string of memory cells, each of plurality of strings coupled to a bit line, an SSL and one or more word lines.

Abstract: Methods and apparatuses are contemplated herein for enhancing the efficiency of nonvolatile memory devices. In an example embodiment, a nonvolatile memory device comprises a substrate and 3D array of nonvolatile memory cells, the 3D array including a plurality of conductive layers, separated from each other by insulating layers, the plurality of conductive layers comprising a top layer, the top layer comprising n string select lines (SSLs) and one or more bottom layers, the top layer further comprises n?1 cuts, each cut electrically separating two SSLs, wherein each cut is cut to a depth of the top layer and not extending into the bottom layers and a plurality of vertical channels arranged orthogonal to the plurality of layers, each of the plurality of channels comprising a string of memory cells, each of plurality of strings coupled to a bit line, an SSL and one or more word lines.

Abstract: Methods and apparatuses are contemplated herein for enhancing the program performance of nonvolatile memory devices. In an example embodiment, a nonvolatile memory device comprises a 3D array of nonvolatile memory cells including a plurality of layers, each layer comprising NAND strings of nonvolatile memory cells, the NAND strings coupled to a bit line, and a plurality SSLs and word lines, the SSLs and the word lines arranged orthogonally to the NAND strings, the word lines establishing the nonvolatile memory cells at cross-points between surfaces of the plurality of NAND strings and the word lines, each of the NAND strings further comprising a plurality of SSL transistors coupling the SSLs to the NAND strings, wherein at least a first SSL being configured to receive a first voltage and a second SSL configured to receive at second voltage, and wherein the second SSL being nearer to the word lines.

Abstract: The present invention provides methods and associated devices for controlling the voltage threshold distribution corresponding to performing a function on cells of non-volatile memory device. In one embodiment, a method is provided. The method may comprise providing the non-volatile memory device. The device comprises one or more strings, each string comprising a plurality of cells, the plurality of cells comprising a first cell and a second cell. The method further comprises performing a function of the non-volatile memory device by applying a first function voltage to the first cell and a second function voltage to the second cell. The first function voltage and the second function voltage are different.

Abstract: Embodiments of the present invention provide improved 3D non-volatile memory devices and associated methods. In one embodiment, a string of 3D non-volatile memory cells is provided. The string comprises a core extending along an axis of the string, the core having an elliptical cross section in a plane perpendicular to the axis; and a plurality of word lines, each word line disposed around a part of the core, the plurality of word lines spaced along the axis, and each word line corresponding to one of the memory cells. In various embodiments, at least one operating parameter is defined in order to improve the operation of the 3D non-volatile memory device.

Abstract: Provided are improved semiconductor memory devices and methods for manufacturing such semiconductor memory devices. A method may incorporate the formation of a p-n junction in a conductive layer. The method may allow for the production of semiconductor memory devices of reduced size.

Abstract: A three-dimensional memory, which includes memory cell stacked structures. The memory cell stacked structures are stacked by a plurality of memory cell array structures and insulation layers alternatively, and each memory cell array structure includes word lines, active layers, composite layers and sources/drains. The word lines, the active layers and the composite layers extend along a Y direction. The active layers are disposed between the adjacent word lines. The composite layers are disposed between the adjacent word lines and the adjacent active layers, and each composite layer includes a first dielectric layer, a charge storage layer and a second dielectric layer in sequence from the active layers. The sources/drains are disposed in the active layers at equal intervals. A memory cell includes two adjacent sources/drains, the active layer between the two adjacent sources/drains, the first dielectric layer, the charge storage layer and the second dielectric layer on the active layer, and the word lines.