Abstract: A semiconductor package includes a semiconductor device, an encapsulating material, and a redistribution structure. The semiconductor device includes a chamfer disposed on one of a plurality of side surfaces of the semiconductor device. The encapsulating material encapsulates the semiconductor device. The redistribution structure is disposed over the encapsulating material and electrically connected to the semiconductor device.

Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

Abstract: A chemical mechanical polishing (CMP) slurry composition includes an oxidant including oxygen, and an abrasive particle having a core structure encapsulated by a shell structure. The core structure includes a first compound and the shell structure includes a second compound different from the first compound, where a diameter of the core structure is greater than a thickness of the shell structure, and where the first compound is configured to react with the oxidant to form a reactive oxygen species.

Abstract: A photolithography method includes dispensing a first liquid onto a first target layer formed over a first wafer through a nozzle at a first distance from the first target layer; capturing an image of the first liquid on the first target layer; patterning the first target layer after capturing the image of the first liquid; comparing the captured image of the first liquid to a first reference image to generate a first comparison result; responsive to the first comparison result, positioning the nozzle and a second wafer such that the nozzle is at a second distance from a second target layer on the second wafer; dispensing a second liquid onto the second target layer formed over the second wafer through the nozzle at the second distance from the second target layer; and patterning the second target layer after dispensing the second liquid.

Abstract: A method includes transmitting a radiation toward an electrostatic chuck, receiving a reflection of the radiation, analyzing the reflection of the radiation, determining whether a particle is present on the electrostatic chuck based on the analyzing the reflection of the radiation, and moving a cleaning tool to a location of the particle on the electrostatic chuck when the determination determines that the particle is present.

Abstract: Embodiments described herein provide a lithographic system having two or more lithographic tools connected to a radiation source using two or more variable attenuation units. In some embodiments, the variable attenuation unit reflects a portion of the received light beam to the lithographic tool attached thereto and transmits a remaining portion of the received light beam to the lithographic tools downstream. In some embodiments, the radiation source includes two or more laser sources to provide laser beams with an enhanced power level and which can prevent operation interruption due to laser source maintenances and repair.

Abstract: The present invention provides a control method of a communication device, wherein the control method includes the steps of: controlling a wireless communication module of the communication device to use a first channel to communicate with a wireless device; when the wireless communication module is using the first channel, detecting a plurality of channels to generate a plurality of quality parameters, respectively; referring to the plurality of quality parameters to determine if the plurality of channels have a second channel whose quality parameter is better than the quality parameter of the first channel; and if there is the second channel whose quality parameter is better than the quality parameter of the first channel, selectively controlling the wireless communication module to use the second channel to communicate with the wireless device.

Abstract: A lithography system includes a collector having a mirror surface, a laser generator aiming at an excitation zone in front of the mirror surface of the collector, a droplet generator, and a droplet deflector operative to apply a force at a position between the droplet generator and the excitation zone.

Abstract: A model building system, a quality prediction system, and a quality management system using the same are provided. The quality management system includes the quality prediction system, a measurement device, and a quality inspection device. The quality prediction system includes the model building system and a model application device. The model building system includes a data transformation device and a model training device. The data transformation device transforms raw measured data, including measurement properties of products, to sets of cluster data and multi-dimensional metadata corresponding to the measurement properties. The model training device creates a prediction model according to the cluster data, the quality inspection results, and the multi-dimensional metadata corresponding to a portion of the products, and then modifies structural parameters of the prediction model according to the raw measured data and the quality inspection results corresponding to the other portion of the products.

Abstract: A semiconductor substrate has an exposed surface having a compositionally uniform metal, and an embedded surface having the metal and an oxide. The exposed surface is polished using a first slurry including a first abrasive and a first amine-based alkaline until the embedded surface is exposed. The embedded surface is polished using a second slurry including a second abrasive and a second amine-based alkaline. The second abrasive is different from the first abrasive. The second amine-based alkaline is different from the first amine-based alkaline. The metal and the oxide each has a first and a second removal rate in the first slurry, respectively, and a third and fourth removal rate in the second slurry, respectively. A ratio of the first removal rate to the second removal rate is greater than 30:1, and a ratio of the third removal rate to the fourth removal rate is about 1:0.5 to about 1:2.

Abstract: A method for forming a layer includes following operations. A workpiece is received in an apparatus for deposition. The apparatus for deposition includes a chamber, a pedestal disposed in the chamber to accommodate the workpiece, and a ring disposed on the pedestal. The ring includes a ring body having a first top surface and a second top surface and a barrier structure disposed between the first top surface and the second top surface. A vertical distance is defined by a top surface of the barrier structure and a top surface of the workpiece. The vertical distance is between approximately 0 mm and approximately 50 mm. A target disposed in the apparatus for deposition is sputtered. A sputtered material is deposited onto a top surface of the workpiece to form a layer. The barrier structure alters an electrical density distribution during the depositing the sputter material.

Abstract: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.

Abstract: The present invention provides a control method of a communication device, wherein the control method includes the steps of: controlling a wireless communication module of the communication device to use a first channel to communicate with an access point; detecting a plurality of channels to generate a plurality of first quality parameters, respectively, to generate a first channel detection result; receiving a second channel detection result from the access point, wherein the second channel detection result comprises a plurality of second quality parameters respectively generated by the access point detecting at least part of the plurality of channels; calculating a plurality of final quality parameters according to the first channel detection result and the second channel detection result; and determining whether to control the wireless communication module to switch from the first channel to a second channel according to the plurality of final quality parameters.

Abstract: A hinge is provided. The hinge includes a first plate, a second plate, a third plate, a shaft, a first elastic element, and a second elastic element. The second plate is connected to the first plate. The third plate is disposed on the second plate. The shaft is connected to the first plate and the second plate. The first elastic element surrounds the shaft. The second elastic element is connected to the second plate and the third plate. The second plate is rotatable around the shaft via the first elastic element. The second plate is movable relative to the third plate via the second elastic element.

Abstract: A scanner includes a light source configured to apply a light to a backside of a wafer. The light is reflected from the backside of the wafer. A first mirror is configured to receive the light from the backside of the wafer and reflect the light. A sensor is configured to receive the light from the first mirror and generate an output signal indicative of a backside topography of the wafer.

Abstract: A mask includes a substrate, a light-reflecting structure, a patterned layer, and a plurality of bumps. The substrate has a first surface and a second surface. The light-reflecting structure is located on the first surface of the substrate. The patterned layer is located on the light-reflecting structure. The bumps are located on the second surface of the substrate. The bumps define a plurality of voids therebetween and protrude in a direction away from the second surface of the substrate.

Abstract: A method of detecting phase loss of a three-phase AC power source includes steps of: acquiring any two line voltages of the AC power source with a first cycle period, acquiring a first digital signal and a second digital signal, performing an exclusive OR operation between the first digital signal and the second digital signal to generate a level signal, accumulating a high-level time count value, or accumulating a low-level time count value, resetting the low-level time count value when the high-level time count value is accumulated, or resetting the high-level time count value when the low-level time count value is accumulated, and determining that the AC power source occurs a phase-loss abnormality when the high-level time count value is greater than or equal to ? of the first cycle period or the low-level time count value is greater than or equal to ? of the first cycle period.

Abstract: A method is described. The method includes obtaining a relationship between a thickness of a contamination layer formed on a mask and an amount of compensation energy to remove the contamination layer, obtaining a first thickness of a first contamination layer formed on the mask from a thickness measuring device, and applying first compensation energy calculated from the relationship to a light directed to the mask.

Abstract: Embodiments described herein provide a lithographic system having two or more lithographic tools connected to a radiation source using two or more variable attenuation units. In some embodiments, the variable attenuation unit reflects a portion of the received light beam to the lithographic tool attached thereto and transmits a remaining portion of the received light beam to the lithographic tools downstream. In some embodiments, the radiation source includes two or more laser sources to provide laser beams with an enhanced power level and which can prevent operation interruption due to laser source maintenances and repair.

Abstract: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.