Patents by Inventor Hung Liao

Hung Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mechanisms for forming bonding structures
    Patent number: 11233032
    Abstract: Embodiments of mechanisms for forming a package are provided. The package includes a substrate and a contact pad formed on the substrate. The package also includes a conductive pillar bonded to the contact pad through solder formed between the conductive pillar and the contact pad. The solder is in direct contact with the conductive pillar.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: January 25, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yeong-Jyh Lin, Hsin-Hung Liao, Chien-Ling Hwang, Bor-Ping Jang, Hsiao-Chung Liang, Chung-Shi Liu
  • Method of operating semiconductor apparatus and semiconductor apparatus
    Patent number: 11229111
    Abstract: A method of operating a semiconductor apparatus includes generating, by a droplet generator, a target material droplet; receiving, by a catcher, the target material droplet, wherein the catcher has a first section and a second section, wherein the first section of the catcher is closer to the droplet generator than the second section of the catcher; and heating the second section of the catcher, wherein the first section of the catcher is longer than the second section of the catcher and is free of a heater, and heating the second section of the catcher is performed such that a temperature of the second section of the catcher is higher than a temperature of the first section of the catcher.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: January 18, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Ming Shih, Chi-Hung Liao
  • Lens control for lithography tools
    Patent number: 11221563
    Abstract: Embodiments described herein relate to a dynamically controlled lens used in lithography tools. Multiple regions of the dynamic lens can be used to transmit a radiation beam for lithography process. By allowing multiple regions to transmit the radiation beam, the dynamically controlled lens can have an extended life cycle compared to conventional fixed lens. The dynamically controlled lens can be replaced or exchanged at a lower frequency, thus, improving efficiency of the lithography tools and reducing production cost.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: January 11, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yueh Lin Yang, Chi-Hung Liao
  • Wafer table with dynamic support pins
    Patent number: 11217475
    Abstract: A method for semiconductor fabrication includes mounting a wafer onto a first wafer table. The first wafer table includes a first set of pins that support the wafer, the first set of pins having a first pitch between adjacent pins. The method further includes forming a first set of overlay marks on the wafer; and transferring the wafer onto a second wafer table. The second wafer table includes a second set of pins having a second pitch between adjacent pins. The second set of pins are individually and vertically movable, and the second pitch is smaller than the first pitch. The method further includes moving a portion of the second set of pins such that a remaining portion of the second set of pins supports the wafer and the remaining portion has the first pitch between adjacent pins.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: January 4, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Hung Liao, Min-Cheng Wu
  • METHOD AND APPARATUS FOR CONTROLLING DROPLET IN EXTREME ULTRAVIOLET LIGHT SOURCE
    Publication number: 20210389680
    Abstract: A lithography method in semiconductor fabrication is provided. The method includes generating multiple groups of small drops of a target material through a number of nozzles in such a way that small drops in each of the groups are aggregated to an elongated droplet of the target material. The method also includes generating a laser pulse from a laser generator to convert the elongated droplets to plasma which generates an EUV radiation. The method further includes exposing a semiconductor wafer to the EUV radiation.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 16, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Hung LIAO, Yueh-Lin YANG
  • DROPLET SPLASH CONTROL FOR EXTREME ULTRAVIOLET PHOTOLITHOGRAPHY
    Publication number: 20210389675
    Abstract: A photolithography system utilizes tin droplets to generate extreme ultraviolet radiation for photolithography. The photolithography system irradiates the droplets with a laser. The droplets become energized and emit extreme ultraviolet radiation. A collector reflects the extreme ultraviolet radiation toward a photolithography target. The photolithography system reduces splashback of the tin droplets onto the receiver by generating a net electric charge within the droplets using a charge electrode and decelerating the droplets by applying an electric field with a counter electrode.
    Type: Application
    Filed: June 15, 2020
    Publication date: December 16, 2021
    Inventors: Po-Ming SHIH, Chi-Hung LIAO
  • PHOTOMASK HAVING RECESSED REGION
    Publication number: 20210382387
    Abstract: A method includes forming a photoresist layer over a wafer. The photoresist layer is exposed to a pattern of radiation using a photomask. The photoresist layer is developed after the photoresist layer is exposed to the pattern of radiation. The photomask includes a substrate and at least one opaque main feature. The substrate has a recessed region recessed from a first surface of the substrate and has a first width. The at least one opaque main feature protrudes from the first surface of the substrate and has a second width greater than the first width of the recessed region of the substrate. A height of the at least one opaque main feature is greater than a depth of the recess region of the substrate.
    Type: Application
    Filed: August 19, 2021
    Publication date: December 9, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Yu CHEN, Chi-Hung LIAO
  • ELECTRONIC PACKAGE
    Publication number: 20210375783
    Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
    Type: Application
    Filed: July 16, 2020
    Publication date: December 2, 2021
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chih-Hsien Chiu, Wen-Jung Tsai, Yu-Wei Yeh, Tsung-Hsien Tsai, Chi-Liang Shih, Sheng-Ming Yang, Ping-Hung Liao
  • Photolithography Method and Photolithography System
    Publication number: 20210372946
    Abstract: A photolithography method includes dispensing a first liquid onto a first target layer formed over a first wafer through a nozzle at a first distance from the first target layer; capturing an image of the first liquid on the first target layer; patterning the first target layer after capturing the image of the first liquid; comparing the captured image of the first liquid to a first reference image to generate a first comparison result; responsive to the first comparison result, positioning the nozzle and a second wafer such that the nozzle is at a second distance from a second target layer on the second wafer; dispensing a second liquid onto the second target layer formed over the second wafer through the nozzle at the second distance from the second target layer; and patterning the second target layer after dispensing the second liquid.
    Type: Application
    Filed: August 6, 2021
    Publication date: December 2, 2021
    Inventors: Chi-Hung Liao, Wei Chang Cheng
  • Photolithography apparatus and method for handling wafer
    Patent number: 11187997
    Abstract: A method for adhering a reticle onto a top surface of a chuck is provided in accordance with some embodiments of the present disclosure. The method includes sliding a reticle relative to a chuck along a first direction, such that a plurality of fibers over a top surface of the chuck are inclined away from an imaginary line normal to the top surface of the chuck by sliding the reticle relative to the chuck along the first direction; performing a photolithography process using the reticle; and after performing the photolithography process, sliding the reticle relative to the chuck along a second direction opposite to the first direction, such that the fibers are moved back toward the imaginary line by sliding the reticle relative to the chuck along the second direction.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: November 30, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Po-Ming Shih, Chi-Hung Liao
  • SUBSTRATE TABLE WITH VACUUM CHANNELS GRID
    Publication number: 20210343575
    Abstract: A substrate table is provided. The substrate table includes a main body having a surface and a plurality of burls extending from the surface. The burls are configured to support a substrate on the main body. The substrate table further includes a number of vacuum channels provided in the burls to apply a vacuum to the substrate. The vacuum channels are distributed throughout the main body and arranged in a grid pattern.
    Type: Application
    Filed: July 14, 2021
    Publication date: November 4, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Min-Cheng WU, Chi-Hung LIAO
  • SUBSTRATE MEASURING DEVICE AND A METHOD OF USING THE SAME
    Publication number: 20210341842
    Abstract: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.
    Type: Application
    Filed: July 13, 2021
    Publication date: November 4, 2021
    Inventors: Min-Cheng WU, Chi-Hung LIAO
  • SUBSTRATE MEASURING DEVICE AND A METHOD OF USING THE SAME
    Publication number: 20210341841
    Abstract: Embodiments of the present disclosure provide a substrate measuring device in a lithography projection apparatus that provides multiple light sources having different wavelengths. In some embodiments, a lithography projection apparatus includes a substrate measuring system disposed proximate to a substrate stage, the substrate measuring system further including an emitter including multiple light sources configured to provide multiple beams of light, each of at least some of the multiple beams of light having a different wavelength, at least one optical fiber, wherein each of respective portions of the at least one optical fiber is configured to pass a respective one of the multiple beams of light, and a receiver positioned to collected light emitted from the emitter and reflected off of a substrate disposed on the substrate stage.
    Type: Application
    Filed: July 13, 2021
    Publication date: November 4, 2021
    Inventors: Min-Cheng WU, Chi-Hung LIAO
  • TEMPERATURE CONTROLLING APPARATUS
    Publication number: 20210333714
    Abstract: A temperature controlling apparatus includes a platen, a first and a second conduits, and a first and a second outlet thermal sensors. The first conduit includes a first inlet, a first outlet, and a first heater. A first fluid enters the first inlet and exits the first outlet, the first heater heats the first fluid to a first heating temperature, and the first fluid is dispensed on the platen. The second conduit includes a second inlet, a second outlet, and a second heater. A second fluid enters the second inlet and exits the second outlet, the second heater heats the second fluid to a second heating temperature, and the second fluid is dispensed on the platen. The first and the second outlet thermal sensors are respectively disposed at the first and the second outlets to sense temperatures of the first and the second fluid.
    Type: Application
    Filed: July 1, 2021
    Publication date: October 28, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chi-Hung Liao, Wei-Chang Cheng
  • DRIVING SYSTEM FOR DRIVING PIEZOELECTRIC PUMP
    Publication number: 20210332811
    Abstract: A driving system for driving piezoelectric pump includes one or more mechanical devices and a driving circuit system electrically connected to the at least one mechanical device. The driving circuit system includes a pump-driving unit, a linear voltage-stabilizing unit, a microcontroller unit, a current-sensing unit, and a connection unit.
    Type: Application
    Filed: April 20, 2021
    Publication date: October 28, 2021
    Inventors: Hao-Jan Mou, Shih-Chang Chen, Che-Wei Huang, Chun-Hung Liao, Wei-Chuan Liao, Chi-Feng Huang, Yung-Lung Han, Tsung-I Lin, Chin-Wen Hsieh
  • EUV PHOTOMASK AND RELATED METHODS
    Publication number: 20210335599
    Abstract: A method of fabricating a semiconductor device includes providing a first substrate and forming a resist layer over the first substrate. In some embodiments, the method further includes performing an exposure process to the resist layer. The exposure process includes exposing the resist layer to a radiation source through an intervening mask. In some examples, the intervening mask includes a second substrate, a multi-layer structure formed over the second substrate, a capping layer formed over the multi-layer structure, and an absorber layer disposed over the capping layer. In some embodiments, the absorber layer includes a first main pattern area and an opening area spaced a distance from the first main pattern area. In various examples, the method further includes, after performing the exposure process, developing the exposed resist layer to form a patterned resist layer.
    Type: Application
    Filed: December 3, 2020
    Publication date: October 28, 2021
    Inventors: Chi-Hung LIAO, Po-Ming SHIH
  • CLEANING TOOL
    Publication number: 20210327743
    Abstract: A method includes transmitting a radiation toward an electrostatic chuck, receiving a reflection of the radiation, analyzing the reflection of the radiation, determining whether a particle is present on the electrostatic chuck based on the analyzing the reflection of the radiation, and moving a cleaning tool to a location of the particle on the electrostatic chuck when the determination determines that the particle is present.
    Type: Application
    Filed: July 1, 2021
    Publication date: October 21, 2021
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yueh-Lin YANG, Chi-Hung LIAO
  • Wafer characteristic prediction method and electronic device
    Patent number: 11144695
    Abstract: A wafer characteristic prediction method and an electronic device are provided. The method includes: receiving a process parameter of a wafer during a mass production; inputting the process parameter to a prediction model to obtain a wafer characteristic of the wafer being mass produced; and outputting the wafer characteristic.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: October 12, 2021
    Assignee: DigWise Technology Corporation, LTD
    Inventors: JingJie Wu, Yuan-Hung Liao, Chih-Chen Liu
  • Mask and method for forming the same
    Patent number: 11137675
    Abstract: A method includes clamping a mask on a mask stage, in which the mask includes a multilayered magnetic film; performing a first lithography process by using the mask; moving the mask away from the mask stage; and determining whether a surface condition of a surface layer of the multilayered thin film is acceptable; and peeling the surface layer of the multilayered magnetic film from the multilayered magnetic film when the surface condition of the surface layer is determined as unacceptable.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: October 5, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chi-Hung Liao, Ju-Wei Liao
  • Method of fabricating semiconductor package structure
    Patent number: 11139177
    Abstract: A method of fabricating a semiconductor package structure is provided. The method includes applying a plurality of first adhesive portions onto a carrier; applying a second adhesive portion onto the carrier; disposing a plurality of micro pins respectively in the first adhesive portions, such that each of the micro pins has a first portion embedded in a corresponding one of the first adhesive portions and a second portion protruding from said corresponding one of the first adhesive portions; bonding a die to the second adhesive portion; forming a molding compound surrounding the micro pins and the die; and removing the carrier from the molding compound after forming the molding compound.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: October 5, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chien-Ling Hwang, Bor-Ping Jang, Chung-Shi Liu, Hsin-Hung Liao, Ying-Jui Huang