Patents by Inventor Hung-Yi Lin

Hung-Yi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100283792
    Abstract: An image processing system includes a memory, a data slicer and an image processor. The data slicer divides each of current image data and adjacent image data into a first portion and a second portion to be stored into the memory. The image processor reads from the memory the first portion and the second portion of the current image data and the first portion of the adjacent image data for image processing.
    Type: Application
    Filed: April 20, 2010
    Publication date: November 11, 2010
    Applicant: MSTAR SEMICONDUCTOR, INC.
    Inventors: Jiunn-Kuang Chen, Hung-Yi Lin, Yuan-Ming Liu
  • Patent number: 7821094
    Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: October 26, 2010
    Assignee: Touch Micro-System Technology Inc.
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Publication number: 20100165191
    Abstract: A de-interlacing method and controller is provided. The de-interlacing method includes steps of de-interlacing based on an ith odd input pixel row of an odd field and an ith even input pixel row of an even field to generate an ith odd output pixel row, where i is a natural number; de-interlacing based on the ith even input pixel row and an (i+1)th odd input pixel row of the odd field to generate an ith even output pixel row; and adjusting i and repeating the above steps to generate a complete interpolated frame.
    Type: Application
    Filed: May 8, 2009
    Publication date: July 1, 2010
    Applicant: MStar Semiconductor, Inc.
    Inventors: LI-HUAN JEN, HUNG-YI LIN, ZHI-REN CHANG
  • Patent number: 7741772
    Abstract: A white light emitting diode package structure having a silicon substrate is disclosed. The white light emitting diode package structure comprises a silicon substrate having a plurality of cup-structures thereon, one of a plurality of blue light emitting diodes is respectively disposed in each cup-structure, and a phosphor structure covering the silicon substrate and the cup-structures. The blue light emitting diodes have various wavelengths and the phosphor structure has a plurality of kinds of phosphor powders and a sealing material. Each kind of phosphor powder is able to convert blue light within a certain wavelength into yellow light.
    Type: Grant
    Filed: April 18, 2007
    Date of Patent: June 22, 2010
    Assignee: Touch Micro-System Technology Inc.
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Publication number: 20100149122
    Abstract: A touch panel with a multi-touch function and a method for detecting a multi-touch thereof are provided. The touch panel includes transparent conductive substrate, a transparent conductive film, first conducting wires, second conducting wires and a main detecting module. The transparent conductive film is disposed on the transparent conductive substrate. The two first conducting wires and second conducting wires are disposed at four corresponding sides of the transparent conductive substrate, to provide a constant voltage. A dividing voltage corresponding to the constant voltage is generated while the transparent conductive film is touched to conduct the transparent conductive film and transparent conductive substrate.
    Type: Application
    Filed: November 23, 2009
    Publication date: June 17, 2010
    Applicant: ASUSTEK COMPUTER INC.
    Inventor: Hung-Yi Lin
  • Patent number: 7732233
    Abstract: The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, serial/parallel electrical connections between light emitting diode chips can be easily implemented by virtue of the planar patterned conductive layer.
    Type: Grant
    Filed: June 10, 2009
    Date of Patent: June 8, 2010
    Assignee: Touch Micro-System Technology Corp.
    Inventors: Hung-Yi Lin, Kuan-Jui Huang, Yen-Ting Kung, She-Fen Tien
  • Publication number: 20100116561
    Abstract: A resistive touch panel includes a first-direction first electrode group and a first-direction second electrode group. The first-direction first electrode group includes multiple electrodes having sequentially arranged and alternate one unit length and two unit length. The first-direction second electrode group includes multiple electrodes having sequentially arranged and alternate two unit length and one unit length. Two ends of multiple first-group strip-shaped ITO layers in the first direction are connected between the first-direction first electrode group and the first-direction second electrode group.
    Type: Application
    Filed: November 2, 2009
    Publication date: May 13, 2010
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: HUNG-YI LIN, Yung-Lang Huang
  • Publication number: 20100117976
    Abstract: A resistive touch panel including a first-direction first electrode group and a first-direction second electrode group is provided. The first-direction first electrode group includes an electrode having N unit length. The first-direction second electrode group includes N electrodes each of which has one unit length. Two ends of multiple first-group strip-shaped layers are connected between the first-direction first electrode group and the first-direction second electrode group.
    Type: Application
    Filed: November 2, 2009
    Publication date: May 13, 2010
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: HUNG-YI LIN, YUNG-LANG HUANG
  • Publication number: 20100117983
    Abstract: A resistive touch panel and a method for detecting touch points on the resistive touch panel are provided. The method includes steps as follows. The whole area of a touch panel is detected and a first touch point position is calculated during a touch point detecting procedure. The partial area of the touch panel including the first touch point position is detected and a second touch point position is calculated during a touch point verifying procedure. When the first touch point position and the second touch point position overlap each other, a single touch point is determined. When the first touch point position and the second touch point position do not overlap each other, multiple touch points are determined.
    Type: Application
    Filed: November 2, 2009
    Publication date: May 13, 2010
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: HUNG-YI LIN, Yung-Lang Huang
  • Publication number: 20100117984
    Abstract: A resistive touch panel includes a first-direction first electrode group and a first-direction second electrode group. The first-direction first electrode group includes multiple electrodes having a first electrode with one unit length, a last electrode with one unit length or two unit length and the other electrodes with two unit length. The first-direction second electrode group includes multiple electrodes having a last electrode with one unit length or two unit length and the other electrodes with two unit length. Wherein, two ends of multiple first-group strip-shaped layers are connected to the first-direction first electrode group and the first-direction second electrode group.
    Type: Application
    Filed: November 2, 2009
    Publication date: May 13, 2010
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: HUNG-YI LIN, Yung-Lang Huang
  • Patent number: 7710132
    Abstract: A method for manufacturing a conductive film as well as the structure thereof and a probe card using the same are provided in the invention. The conductive film is substantially a stacked structure of a specific thickness formed by the adhering and stacking of at least a substrate in a vacuum environment by the use of surface processing and mechanical healing whereas each substrate has an array of metal micro-threads formed thereon, in which the plural metal micro-threads, each being wrapped in an insulating film, are arranged on the substrate to form the array in a unidirectional and single-layered manner by the use of a LIGA process and polymer thin film technology. In an exemplary embodiment, the insulating film can be a polymer thin film of high dielectric constant, being made of a material such as polydimethylsiloxane (PDMA) or polyimide (PI); and the metal micro-thread is made of a high conductivity and high strength Ni—Co alloy.
    Type: Grant
    Filed: February 15, 2008
    Date of Patent: May 4, 2010
    Assignee: Industrial Technology Research Institute
    Inventors: Tung-Chuan Wu, Min-Chieh Chou, Hung-Yi Lin
  • Publication number: 20100101316
    Abstract: A valve stem cap to be coupled with the inlet/outlet end of a tire valve stem includes a connecting seat having a closed end fitted with a sealing washer and an open end having a threaded hole for coupling with the tire valve stem. An external thread is formed on an outer tubular surface of the connecting seat near the closed end for coupling threadingly with a threaded hole of a light penetrable cover and thereby enclosing a light-emitting unit in the light penetrable cover. The light-emitting unit includes first and second conductive plates electrically connected by a conducting element and at least one battery. When the tire valve stem, coupled with the valve stem cap, leaks, a light-emitting diode on a top surface of the first conductive plate emits light as an alert. Meanwhile, the valve stem cap stops the leak so as to maintain an acceptable tire pressure.
    Type: Application
    Filed: June 16, 2009
    Publication date: April 29, 2010
    Inventor: Hung-Yi LIN
  • Publication number: 20100090245
    Abstract: The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.
    Type: Application
    Filed: June 9, 2009
    Publication date: April 15, 2010
    Inventors: Hung-Yi Lin, Kuan-Jui Huang, Yen-Ting Kung, She-Fen Tien
  • Publication number: 20100066674
    Abstract: The invention relates to a cursor controlling apparatus for controlling a cursor according to an input information comprising an input module, a processing module and a controlling module. The input module is used for generating the input information. The processing module coupled to the input module is used for generating processing data according to the input information. The controlling module is coupled to the processing module for comparing the processing data with a predetermined value to generate a comparing result and further generating a first control signal or a second control signal corresponding to the processing data and the compared result to control the cursor respectively.
    Type: Application
    Filed: March 18, 2009
    Publication date: March 18, 2010
    Applicant: IdeaCom Technology Corporation
    Inventors: Sheng-Chun Chueh, Wei-Jen Huang, Hung-Yi Lin
  • Publication number: 20100047942
    Abstract: A method of making a white LED package structure having a silicon substrate comprises providing a silicon substrate and performing an etching process to form a plurality of cup-structures on a top surface of the silicon substrate. Next, a reflective layer on the top surface of the silicon substrate is formed, and a transparent insulating layer on the reflective layer is formed. Subsequently, a plurality of blue LEDs are respectively bonded in each cup-structure, wherein the blue LEDs have various wavelengths. Last, a plurality of kinds of phosphor powders corresponding to the wavelengths of the blue LEDs are mixed with each other and added to a sealing material, and a sealing process is performed to form a phosphor structure on the cup-structures.
    Type: Application
    Filed: November 5, 2009
    Publication date: February 25, 2010
    Inventors: Hung-Yi Lin, Hong-Da Chang
  • Patent number: 7663559
    Abstract: An antenna structure includes a radiation element, a grounding element, and a feeding point. The grounding element includes a first grounding sub-element and a second grounding sub-element. The second grounding sub-element is coupled to the first grounding sub-element and has a loop structure. One section of the loop structure overlaps a first end of the radiation element and is at a designated distance from the first end of the radiation element in a designated direction. The feeding point is coupled between a second end of the radiation element and the first grounding sub-element.
    Type: Grant
    Filed: April 9, 2008
    Date of Patent: February 16, 2010
    Assignee: Wistron NeWeb Corporation
    Inventors: Chih-Sen Hsieh, Hung-Yi Lin, Feng-Chi Eddie Tsai
  • Publication number: 20090309852
    Abstract: A touch panel input device includes a touch panel, an analog multiplexer and an embedded controller. The touch panel generates a plurality of analog signals when the touch panel is touched. The analog multiplexer is communicated with the touch panel. The embedded controller is communicated with the analog multiplexer for generating a select signal to the analog multiplexer. The analog multiplexer sequentially outputs one of the analog signals to the embedded controller according to the select signal. The analog signals are converted into corresponding digital signals by the embedded controller.
    Type: Application
    Filed: June 2, 2009
    Publication date: December 17, 2009
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Wei-Po Lin, Hung-Yi Lin
  • Publication number: 20090284538
    Abstract: A video streaming data processing method is used in a video streaming data processing system including a central processing unit, a system memory, a graphic processing unit and a video random-access memory. After video streaming data are received, a video decoding operation is performed on the video streaming data by the central processing unit to produce image data and the image data are then stored into the system memory. Next, the image data are stored from the system memory to a texture buffer of the video random-access memory. Next, the image data that are stored in the texture buffer are read out and subject to a specific image processing algorithm by the graphic processing unit, and then stored back to the texture buffer. Afterwards, the image data are stored from the texture buffer to a video buffer of the video random-access memory.
    Type: Application
    Filed: May 7, 2009
    Publication date: November 19, 2009
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: HUNG-YI LIN, CHI-YI TSAI
  • Publication number: 20090284275
    Abstract: A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.
    Type: Application
    Filed: November 25, 2008
    Publication date: November 19, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Min-Chieh Chou, Tung-Chuan Wu, Jen-Hui Tsai, Hung-Yi Lin
  • Publication number: 20090273005
    Abstract: Disclosed herein is a structure of opto-electronic package having a Si-substrate. The Si-substrates are manufactured in batch utilizing the micro-electromechanical processes or the semiconductor processes, so that these Si-substrates are made with great precision and full of varieties. Based on the material characteristic of the Si-substrate, and the configuration of the components, such as the connectors, opto-electronic devices, depressions, solder bumps, etc., the present invention can improve the optical effect, the heat dissipating effect, and the reliability of the opto-electronic package structure, and simplifies the complexity of the opto-electronic package structure.
    Type: Application
    Filed: July 9, 2009
    Publication date: November 5, 2009
    Inventor: Hung-Yi Lin