Abstract: A chip package structure and method thereof uses a semiconductor substrate as a package substrate, which improve heat dissipation. Also, the chip package structure is incorporated with a planarization structure, which renders the chip and the package substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, electrical connections in series or in parallel between chips can be easily implemented by virtue of the planar patterned conductive layer.

Abstract: The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, serial/parallel electrical connections between light emitting diode chips can be easily implemented by virtue of the planar patterned conductive layer.

Abstract: A power control method is used with a video camera of a computer system. The power control method includes steps of executing a virtual web camera software to load a virtual web camera, executing a video application program such that the virtual web camera software generates a power-on message, and providing electric energy to the video camera in response to the power-on message.

Abstract: The present invention provides A control device for determining 4-wire or 5-wire resistive touch screen, comprising: detecting means for respectively sending 4-wire control instruction and 5-wire control instruction in the period before sending control instructions of fetching X-axis and Y-axis coordinate position, so as to detect whether a 4-wire resistive touch screen or 5-wire resistive touch screen are being attached; control means, in accordance with the detected result of the detecting means, the control device is switched to 4-wire or 5-wire resistive touch screen so as to fetch the coordinate position.

Abstract: The present invention relates to a beam modulating apparatus for mold fabrication by ultra-fast laser technique. More particularly, the present invention discloses a beam modulating apparatus for fabricating micro-/nano-scaled structures, which adopts an energy shaping scheme for beam shape modulation while using the modulated beam for mold fabrication. Following the development of flexible electronic devices, such as flexible displays, all kinds of roller molds formed with micro-/nano-scaled structures are becoming the key issue for commercialization and mass production which require a breakthrough in ultra-precision machining and photo-lithography that overcomes the bottlenecks related to shape, size, thermal effect and precision for fabricating sub-micron sized structures and thus greatly enhancing product design capability and functionality.

Abstract: An antenna structure includes a radiation element, a grounding element, and a feeding point. The grounding element includes a first grounding sub-element and a second grounding sub-element. The second grounding sub-element is coupled to the first grounding sub-element and has a loop structure. One section of the loop structure overlaps a first end of the radiation element and is at a designated distance from the first end of the radiation element in a designated direction. The feeding point is coupled between a second end of the radiation element and the first grounding sub-element.

Abstract: An antenna structure includes a radiation element, a grounding element, and a feeding point. The radiation element includes a first section and a second section coupled to the first section. The grounding element includes a third section and a fourth section coupled to the third section. The third section is substantially parallel to the first section. The feeding point is coupled between the second section of the radiation element and the fourth section of the grounding element.

Abstract: A method for manufacturing a conductive film as well as the structure thereof and a probe card using the same are provided in the invention. The conductive film is substantially a stacked structure of a specific thickness formed by the adhering and stacking of at least an substrate in a vacuum environment by the use of surface processing and mechanical healing whereas each substrate has an array of metal micro-threads formed thereon, in which the plural metal micro-threads, each being wrapped in an insulating film, are arranged on the substrate to form the array in a unidirectional and single-layered manner by the use of a LIGA process and polymer thin film technology. In an exemplary embodiment, the insulating film can be a polymer thin film of high dielectric constant, being made of a material such as polydimethylsiloxane (PDMA) or polyimide (PI); and the metal micro-thread is made of a high conductivity and high strength Ni—Co alloy.

Abstract: A method for reducing dimension of an MEMS device. A single crystalline substrate having a diaphragm is provided. A first-step anisotropic dry etching process is performed to form an opening corresponding to the diaphragm in the back surface, the anisotropic dry etching stopping on a specific lattice plane extending from the edge of the diaphragm. A second-step anisotropic wet etching process is performed to etch the single crystalline substrate along the specific lattice plane until the diaphragm is exposed to form a cavity having a diamond-like shape.

Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.

Abstract: A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a connecting area and an actuating area respectively located thereon, c) forming plural microstructures in the actuating area, d) mounting a conducting element in the connecting area and the actuating area, e) forming an insulating layer on the conducting element and f) connecting the first substrate to the connecting area to form the MEMS device. The concavity contains the plural microstructures.

Abstract: A method for producing single-dimensioned gold-nano-particle patterns having a single-particle resolution in which the line-width is only limited by the particle size. Initially, a focused electron beam is used to generate a positive charge layer on an SiO2 surface. Biotinated DNA molecules attracted by these positive charges are then used to acquire Au-nano-particles revealing the e-beam exposure patterns. The particles in the single-line patterns become separated in an orderly manner, due to the repulsive force between different Au colloidal particles. Each single-line pattern has potential use in nano-photonics and nano-electronics. In nano-electronics, the line patterns serve as a template for high or low resistance conductive nano-wires. Low resistance wires exhibit linear current-voltage characteristics with an extremely high maximum allowed current density. The high resistance wires display charging effect with clear Coulomb oscillation behavior at low temperatures.

Abstract: A OSD management method for writing OSD data into a memory, the management method includes: respectively writing a first partial data and a second partial data of the first OSD data into a first memory space and a second memory space of the memory; and respectively writing a third partial data and a fourth partial data of the first OSD data into a third memory space and a fourth memory space of the memory; wherein the first and third memory space associate with a first row address of the memory, and the second and fourth memory space associate with a second row address of the memory.

Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.

Abstract: A substrate is provided and a plurality of trenches are formed in the front surface of the substrate. Then, a thermal oxide layer is formed on inner walls of the trenches and the front surface of the substrate. Subsequently, a first structural layer is formed on the thermal oxide layer, dopants are implanted into the first structural layer, a second structural layer is formed on the first structural layer, and an annealing process is performed to reduce the stress of the first and second structural layers. Following that, the first and second structural layers are patterned to form diaphragms. Finally, the second structural layer is mounted on a support wafer with a bonding layer, and the back surface of the substrate is etched by deep etching techniques to form back chambers corresponding to the diaphragms. Each back chamber has a vertical sidewall and partially exposes the first structural layer.

Abstract: A display controller for displaying multiple windows and associated memory access method are provided. The display controller receives a first video source and a second video source for displaying multiple windows, and includes a line buffer, a deinterlacer, a scaler, and a memory interface unit. The line buffer buffers pixel data of a non-overlapped area of a main image associated with the first video source, and pixel data of a sub image associated with the second video source. The deinterlacer is coupled to the line buffer for selectively deinterlacing data in the line buffer. The scaler is coupled to the deinterlacer for selectively scaling data outputted from the deinterlacer. The memory interface unit is coupled to the line buffer for accessing an external memory.

Abstract: A light emitting diode package structure has a silicon substrate, a plurality of cup-structures on the silicon substrate, a plurality of conductive patterns disposed on the silicon substrate, one of a plurality of light emitting diodes respectively disposed on each cup-structure and a plurality of wires electrically connected to the light emitting diodes and the conductive patterns. The light emitting diodes are electrically connected in series through the conductive wires and the conductive patterns.

Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.

Abstract: A white light emitting diode package structure having a silicon substrate is disclosed. The white light emitting diode package structure comprises a silicon substrate having a plurality of cup-structures thereon, one of a plurality of blue light emitting diodes is respectively disposed in each cup-structure, and a phosphor structure covering the silicon substrate and the cup-structures. The blue light emitting diodes have various wavelengths and the phosphor structure has a plurality of kinds of phosphor powders and a sealing material. Each kind of phosphor powder is able to convert blue light within a certain wavelength into yellow light.