Abstract: A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.

Abstract: A color tunable light emitting diode is disclosed in the present invention. At least two light emitting chip groups each has a number of light emitting chips mixed with at least one phosphor to produce light with a specific correlated color temperature. By supplying tunable currents to the light emitting chip groups, properly arranging the light emitting chips and providing a suitable substrate, the color tunable light emitting diode can be achieved. The present invention provides a simple and workable method to manufacture tunable light emitting diodes which fulfill the requirement of compact design of modern electronic products.

Abstract: The present invention relates to a polarized light emitting diode (LED) device and the method for manufacturing the same, in which the LED device comprises: a base, a light emitting diode (LED) chip, a polarizing waveguide and a packaging material. In an exemplary embodiment, the LED chip is disposed on the base and is configured with a first light-emitting surface for outputting light therefrom; and the waveguide, being comprised of a polarization layer, a reflection layer, a conversion layer and a light transmitting layer, is disposed at the optical path of the light emitted from the LED chip; and the packaging material is used for packaging the waveguide, the LED chip and the base into a package.

Abstract: A method of manufacturing light emitting diode packaging lens and packages made by using the method are disclosed in the present invention. By using electrophoretic deposition, one or more layers of phosphors are coated onto one surface of a cup which has a curved portion. The cup is used for the packaging lens. Thickness of phosphor layer can be controlled and distribution of phosphor particles is uniform. Therefore, light emitting diode packages with the lens can be a uniform light source.

Abstract: An antenna structure includes a radiation element, a grounding element, and a feeding point. The radiation element includes a first section and a second section coupled to the first section. The grounding element includes a third section and a fourth section coupled to the third section. The third section is substantially parallel to the first section. The feeding point is coupled between the second section of the radiation element and the fourth section of the grounding element.

Abstract: The invention relates to a touch panel correcting apparatus includes a control module, a processing module, a detecting module, a judging module and a correcting module. The control module is used for generating a controlling signal. The processing module is used for executing a pointing action under a first predetermined manner after receiving the controlling signal. The detecting module is used for detecting the touch panel according to the pointing action under a second predetermined manner and generating at least one detecting result. The judging module is used for executing a predetermined operation according to the at least one detecting result and a predetermined information and generating at least one correcting value. The correcting module is used for correcting the touch panel according to the at least one correcting value.

Abstract: The invention discloses an electronic device with a touch panel and the method for controlling the same. The method includes the steps of: determining that the electronic device is operated in a stylus mode or a general mode; determining that the touch point is an effective touch point when the electronic device is in a stylus mode and the touch point on the touch panel is determined to be the first-type touch point; determining that the touch point is an ineffective touch point when the electronic device is in a stylus mode and the touch point on the touch panel is determined to be a second-type touch point; and determining that the touch point on the touch panel is an effective touch point when the electronic device is in a general mode.

Abstract: A resistive touch panel and a method for detecting the touch point type are disclosed. The resistive touch panel has multiple detecting areas. The method includes the following steps: obtaining the positions of multiple touch points when a touch operation is generated on the touch panel; determining whether the touch points can be combined to be a combined touch point when the touch points are located at adjacent areas; and determining whether the combined touch point is a first-type touch point or a second-type touch point when the touch points can be combined to be the combined touch point.

Abstract: The invention discloses a method for detecting touch point type in a resistive touch panel. The method includes the steps of: connecting the first electrode to a voltage source and connecting the fourth electrode to the ground end when it is determined that a touch point is generated on the first detecting area, thereby making the second electrode generate a first voltage and the third electrode generate a second voltage; determining that the touch point is the first-type touch point when the difference between the first voltage and the second voltage is larger than a threshold value; and determining that the touch point is the second-type touch point when the difference between the first voltage and the second voltage is smaller than a first threshold value.

Abstract: An image processing system includes a memory, a data slicer and an image processor. The data slicer divides each of current image data and adjacent image data into a first portion and a second portion to be stored into the memory. The image processor reads from the memory the first portion and the second portion of the current image data and the first portion of the adjacent image data for image processing.

Abstract: A light emitting diode structure has a silicon substrate, a conductive layer, and a light emitting diode. The top surface of the silicon substrate has a cup-structure like paraboloid, and the bottom of the cup-structure has a plurality of through-holes penetrating the silicon substrate. The conductive layer fills up the through-holes and protrudes out from the through-holes. The light emitting diode is disposed on the top of the conductive layer protruding out from the through-holes and is located at the focus of the cup-structure.

Abstract: A de-interlacing method and controller is provided. The de-interlacing method includes steps of de-interlacing based on an ith odd input pixel row of an odd field and an ith even input pixel row of an even field to generate an ith odd output pixel row, where i is a natural number; de-interlacing based on the ith even input pixel row and an (i+1)th odd input pixel row of the odd field to generate an ith even output pixel row; and adjusting i and repeating the above steps to generate a complete interpolated frame.

Abstract: A white light emitting diode package structure having a silicon substrate is disclosed. The white light emitting diode package structure comprises a silicon substrate having a plurality of cup-structures thereon, one of a plurality of blue light emitting diodes is respectively disposed in each cup-structure, and a phosphor structure covering the silicon substrate and the cup-structures. The blue light emitting diodes have various wavelengths and the phosphor structure has a plurality of kinds of phosphor powders and a sealing material. Each kind of phosphor powder is able to convert blue light within a certain wavelength into yellow light.

Abstract: A touch panel with a multi-touch function and a method for detecting a multi-touch thereof are provided. The touch panel includes transparent conductive substrate, a transparent conductive film, first conducting wires, second conducting wires and a main detecting module. The transparent conductive film is disposed on the transparent conductive substrate. The two first conducting wires and second conducting wires are disposed at four corresponding sides of the transparent conductive substrate, to provide a constant voltage. A dividing voltage corresponding to the constant voltage is generated while the transparent conductive film is touched to conduct the transparent conductive film and transparent conductive substrate.

Abstract: The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, serial/parallel electrical connections between light emitting diode chips can be easily implemented by virtue of the planar patterned conductive layer.

Abstract: A resistive touch panel includes a first-direction first electrode group and a first-direction second electrode group. The first-direction first electrode group includes multiple electrodes having a first electrode with one unit length, a last electrode with one unit length or two unit length and the other electrodes with two unit length. The first-direction second electrode group includes multiple electrodes having a last electrode with one unit length or two unit length and the other electrodes with two unit length. Wherein, two ends of multiple first-group strip-shaped layers are connected to the first-direction first electrode group and the first-direction second electrode group.

Abstract: A resistive touch panel including a first-direction first electrode group and a first-direction second electrode group is provided. The first-direction first electrode group includes an electrode having N unit length. The first-direction second electrode group includes N electrodes each of which has one unit length. Two ends of multiple first-group strip-shaped layers are connected between the first-direction first electrode group and the first-direction second electrode group.

Abstract: A resistive touch panel and a method for detecting touch points on the resistive touch panel are provided. The method includes steps as follows. The whole area of a touch panel is detected and a first touch point position is calculated during a touch point detecting procedure. The partial area of the touch panel including the first touch point position is detected and a second touch point position is calculated during a touch point verifying procedure. When the first touch point position and the second touch point position overlap each other, a single touch point is determined. When the first touch point position and the second touch point position do not overlap each other, multiple touch points are determined.

Abstract: A resistive touch panel includes a first-direction first electrode group and a first-direction second electrode group. The first-direction first electrode group includes multiple electrodes having sequentially arranged and alternate one unit length and two unit length. The first-direction second electrode group includes multiple electrodes having sequentially arranged and alternate two unit length and one unit length. Two ends of multiple first-group strip-shaped ITO layers in the first direction are connected between the first-direction first electrode group and the first-direction second electrode group.

Abstract: A method for manufacturing a conductive film as well as the structure thereof and a probe card using the same are provided in the invention. The conductive film is substantially a stacked structure of a specific thickness formed by the adhering and stacking of at least a substrate in a vacuum environment by the use of surface processing and mechanical healing whereas each substrate has an array of metal micro-threads formed thereon, in which the plural metal micro-threads, each being wrapped in an insulating film, are arranged on the substrate to form the array in a unidirectional and single-layered manner by the use of a LIGA process and polymer thin film technology. In an exemplary embodiment, the insulating film can be a polymer thin film of high dielectric constant, being made of a material such as polydimethylsiloxane (PDMA) or polyimide (PI); and the metal micro-thread is made of a high conductivity and high strength Ni—Co alloy.