Abstract: A semiconductor device includes an internal command generation circuit suitable for generating a first internal command, a second internal command, and a third internal command based on a command/address signal. The semiconductor device also includes a driving signal generation circuit suitable for enabling a fuse driving signal for reading fuse data from a nonvolatile memory circuit, where the fuse signal is enabled while the second internal command is inputted a predetermined number of times. Further included is an output circuit suitable for outputting the fuse data in response to the third internal command.

Abstract: A semiconductor package includes a substrate, a rewiring layer, a plurality of semiconductor chip stack structures, and a second semiconductor chip. The rewiring layer is disposed on an upper surface of the substrate. The rewiring layer includes a concave portion. The semiconductor chip stack structures include a plurality of first semiconductor chips. The first semiconductor chips are disposed on the rewiring layer. The first semiconductor chips are spaced apart from each other in a horizontal direction. The second semiconductor chip is disposed within the concave portion. The second semiconductor chip is configured to electrically connect each of the plurality of semiconductor chip stack structures to each other.

Abstract: A photomask is provided. A photomask, comprising: a transparent substrate; and a plurality of filter layers disposed on the transparent substrate, wherein the filter layers include a first filter layer, which selectively transmits first-wavelength light therethrough, and a second filter layer, which selectively transmits second-wavelength light therethrough.

Abstract: An exposure mask includes a first transmission portion, a second transmission portion, and a blocking portion. The first transmission portion is configured to, when illuminated with light, transmit the light at a first energy level. The first transmission portion is disposed in association with formation of a first contact hole in an underlying layer. The second transmission portion is configured to, when illuminated with the light, transmit the light at a second energy level. The second transmission portion is disposed in association with formation of a second contact hole in the underlying layer. The blocking portion is configured to block the light, and is disposed in association with a boundary region between a first region and a second region of the underlying layer. The second transmission portion is further configured to enable the second contact hole to be formed deeper into the underlying layer than the first contact hole.

Abstract: A program method of a nonvolatile memory device that performs a plurality of program loops is provided. At least one of the plurality of program loops includes dividing a channel of a selected cell string into a first side channel and a second side channel during a first interval and a second interval, turning off a string selection transistor of the selected cell string by applying a string select line voltage of a first level during the first interval, and boosting a first voltage of the first side channel and a second voltage of the second side channel, and turning on the string selection transistor by applying the string select line voltage of a second level different from the first level during the second interval, and performing a hot carrier injection (HCI) program operation on a selected memory cell corresponding to the first side channel or the second side channel.

Abstract: A walking assistance device may include at least one walking assistance unit configured to assist a user in walking; and/or a controller configured to control, based on a walk pattern of the user, the at least one walking assistance unit to produce torque only in at least one assistance period needing walking assistance in a walk cycle. A method of controlling walking assistance may include: calculating a walking assistance time using a difference between a start time and a termination time of an assistance period needing the walking assistance in a walk pattern; and/or assisting a user in walking when the assistance period begins, by producing torque for the walking assistance time.

Abstract: A method of manufacturing a semiconductor package includes forming at least two partial package chip stacks, each partial package chip stack including at least two semiconductor chips each including a plurality of through substrate vias (TSVs), and including a first mold layer surrounding side surfaces of the at least two semiconductor chips, and sequentially mounting the at least two partial package chip stacks on a package substrate in a direction vertical to a top surface of the package substrate, such that the at least two partial package chip stacks include a first partial package chip stack and a second partial package chip stack directly connected to the first partial package chip stack.

Abstract: An analog-digital converter may include: an analog-digital converter comprising: a ramp signal selection unit suitable for receiving ramp signals having different offsets, and sequentially selecting one of the ramp signals according to a preset order; a comparison unit suitable for comparing the magnitudes of the selected ramp signal with a pixel signal, and outputting a comparison signal according to the comparison result; and a counting unit suitable for counting the number of clocks of a clock signal until the comparison signal transitions, and outputting a count signal based on the count when the comparison signal transitions.

Abstract: A display device includes a substrate including a first region and a second region, a gate line and a data line on the substrate, a thin film transistor on the substrate, being connected to the gate line and the data line, and a pixel electrode connected to the thin film transistor, wherein the second region has a second contact hole of which an area is larger than that of a first contact hole of the first region.

Abstract: Disclosed herein is a refrigerator having a storage box by which the humidity in a storage compartment is controllable. The refrigerator includes a body having a storage compartment, a storage box installed to be drawable in the storage compartment, a cover located above the storage box and provided to be rotatable, a cover frame configured to support the cover, and a knob configured to rotate the cover to adjust humidity inside the storage box.

Abstract: A plasma processing apparatus including an electrostatic chuck supporting a wafer; a focus ring disposed to surround an outer circumferential surface of the wafer; an insulation ring disposed to surround an outer circumferential surface of the focus ring; and an edge ring supporting lower portions of the focus ring and the insulation ring, the edge ring being spaced apart from the electrostatic chuck and surrounding an outer circumferential surface of the electrostatic chuck; wherein the edge ring includes a flow channel containing a fluid therein.

Abstract: A semiconductor device includes an internal command generation circuit suitable for generating a first internal command, a second internal command, and a third internal command based on a command/address signal. The semiconductor device also includes a driving signal generation circuit suitable for enabling a fuse driving signal for reading fuse data from a nonvolatile memory circuit, where the fuse signal is enabled while the second internal command is inputted a predetermined number of times. Further included is an output circuit suitable for outputting the fuse data in response to the third internal command.

Abstract: A semiconductor package includes a substrate, a rewiring layer, a plurality of semiconductor chip stack structures, and a second semiconductor chip. The rewiring layer is disposed on an upper surface of the substrate. The rewiring layer includes a concave portion. The semiconductor chip stack structures include a plurality of first semiconductor chips. The first semiconductor chips are disposed on the rewiring layer. The first semiconductor chips are spaced apart from each other in a horizontal direction. The second semiconductor chip is disposed within the concave portion. The second semiconductor chip is configured to electrically connect each of the plurality of semiconductor chip stack structures to each other.

Abstract: The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

Abstract: A refrigerator includes a storeroom configured to have a pantry install part. The refrigerator also includes a pantry arranged in the pantry install part. The refrigerator also includes a filter case configured to receive a water filter and arranged in the pantry install part to be covered by the pantry.

Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

Abstract: A semiconductor package comprising: a substrate including an external connection terminal and a cavity; a first semiconductor chip disposed in the cavity, the first semiconductor chip including a first pad and a second pad different from the first pad, the first pad and the second pad being disposed on a first surface of the first semiconductor chip; a metal line disposed on the substrate and the first semiconductor chip and electrically connecting the first pad of the first semiconductor chip with the external connection terminal of the substrate; a second semiconductor chip disposed on the first semiconductor chip, the second semiconductor chip including a third pad disposed on a second surface of the second semiconductor chip facing the first semiconductor chip; and a connection terminal electrically connecting the second pad of the first semiconductor chip with the third pad of the second semiconductor chip, the connection terminal being not electrically connected to the metal line.

Abstract: A data processing system includes: a memory device suitable for performing an operation corresponding to a command and outputting a memory data; a data collecting device suitable for collecting big data by integrating the command and the memory data at a predetermined cycle or at every predetermined time, splitting the collected big data based on a predetermined unit, and transferring the split big data; and a data processing device suitable for storing the split big data received from the data collecting device in block-based files in a High-Availability Distributed Object-Oriented Platform (HADOOP) distributed file system (HDFS), classifying the block-based files based on a particular memory command, and processing the block-based files.

Abstract: A display device includes a substrate corresponding to a display area in which an image is displayed, and a non-display area at at least one side of the display area, a touch sensing device at the display area, first outer lines electrically connected to the touch sensing device, and located at a first non-display area that is a first portion of the non-display area, second outer lines connecting the first outer lines and the touch sensing device, a plurality of pixels at the display area, a driving circuit at the first non-display area for driving the pixels, and a power supply line electrically connected to the pixels and located at a second non-display area that is a second portion of the non-display area.

Abstract: A touch screen for a display device includes a base substrate having a sensing area, and a peripheral area disposed around the sensing area; an insulating layer including at least one contact hole; a sensor provided in the sensing area; and sensing lines connected to the sensor, the sensing lines comprising a first metal layer disposed in the periphery area, and a second metal layer electrically connected to the first metal layer through the contact hole. At least some of the sensing lines include a first portion adjacent to the contact hole, and a second portion spaced from the first portion, with the first portion and the second portion having different widths.