Abstract: A method of inspecting patterns formed the manufacturing of semiconductor devices or the like includes producing an image of the patterns, producing a boundary image including a plurality of boundary patterns corresponding to first and second boundaries of each of the patterns, combining the pattern image and the boundary image to produce an overlapping image including overlapping patterns in which the patterns fill regions between the boundary patterns, and binarizing the overlapping image to produce a binary image including binary patterns corresponding to the overlapping patterns.

Abstract: A semiconductor package includes a package substrate, an image sensor disposed on the package substrate, and a bonding layer disposed between the package substrate and the image sensor, and including a first region and a second region, the second region has a modulus of elasticity lower than that of the first region and is disposed on a periphery of the first region.

Abstract: A color filter array panel and a display device including the same are provided. The color filter array panel includes a substrate; a first pixel and a second pixel disposed adjacent to each other; a data line disposed on the substrate and between the first pixel and the second pixel; a first color filter disposed in the first pixel; a second color filter disposed in the second pixel, the first color filter and the second color filter overlap each other to form a color filter overlapped portion overlapping the data line; an inorganic layer disposed on the color filter overlapped portion; an organic layer disposed on the inorganic layer, the first color filter, and the second color filter; and a first pixel electrode disposed in the first pixel; and a second pixel electrode disposed in the second pixel The inorganic layer is disposed between the first pixel electrode and the second pixel electrode.

Abstract: A touch sensor includes: an active area including a first sub-active area and a second sub-active area; a plurality of first touch electrodes in the first sub-active area and the second sub-active area; and a plurality of second touch electrodes in the first sub-active area and the second sub-active area, and a length of a first border portion that is a separated area between adjacent first and second touch electrodes in the first sub-active area is different from a length of a second border portion that is a separated area between adjacent first and second touch electrodes in the second sub-active area.

Abstract: A semiconductor package includes a substrate, a rewiring layer, a plurality of semiconductor chip stack structures, and a second semiconductor chip. The rewiring layer is disposed on an upper surface of the substrate. The rewiring layer includes a concave portion. The semiconductor chip stack structures include a plurality of first semiconductor chips. The first semiconductor chips are disposed on the rewiring layer. The first semiconductor chips are spaced apart from each other in a horizontal direction. The second semiconductor chip is disposed within the concave portion. The second semiconductor chip is configured to electrically connect each of the plurality of semiconductor chip stack structures to each other.

Abstract: A graft for augmentation rhinoplasty, the graft including bone tissue and cartilage tissue, and a method of performing augmentation rhinoplasty by using the graft are disclosed. According to the disclosure, autologous tissue for augmentation rhinoplasty can be obtained in a sufficient amount to so that a nose can be uplifted to a desired height. In addition, rhinoplasy can be easily performed, resulting in a naturally-shaped nose. As the osseous tissue is grafted on the originally existing osseous tissue and cartilage tissue is grafted on the originally existing cartilage, the construction of the original anatomical structure of the nose can be allowed and there is an effect that there is no side effect such as a foreign body reaction.

Abstract: Disclosed herein is a control method of a wearable robot, including: generating reference gait data based on the results of sensing by a sensor unit included in a structure; estimating, when a wearer walks, the wearer's gait phase based on the results of sensing by the sensor unit; detecting a gait phase having a minimum difference from the estimated gait phase from the reference gait data; and driving a driver of the structure, according to a control signal generated based on the estimated gait phase and the detected gait phase.

Abstract: An input sensing unit including a plurality of capacitive sensing electrodes, and a conductive layer disposed on at least a portion of the sensing electrodes, in which the conductive layer overlaps at least a portion of the sensing electrodes in a plan view, and the conductive layer includes a plurality of conductive patterns spaced apart from each other.

Abstract: A printed circuit board (PCB) includes a substrate base including at least two chip attach regions spaced apart from one another, a plurality of upper pads disposed in the at least two chip attach regions of the substrate base, an accommodation cavity overlapping a part of each of the at least two chip attach regions and recessed in an upper surface of the substrate base, and at least one spacing groove recessed in the upper surface of the substrate base. The at least one spacing groove is connected to the accommodation cavity, and extends in a region between the at least two chip attach regions.

Abstract: An exposure mask includes a first transmission portion, a second transmission portion, and a blocking portion. The first transmission portion is configured to, when illuminated with light, transmit the light at a first energy level. The first transmission portion is disposed in association with formation of a first contact hole in an underlying layer. The second transmission portion is configured to, when illuminated with the light, transmit the light at a second energy level. The second transmission portion is disposed in association with formation of a second contact hole in the underlying layer. The blocking portion is configured to block the light, and is disposed in association with a boundary region between a first region and a second region of the underlying layer. The second transmission portion is further configured to enable the second contact hole to be formed deeper into the underlying layer than the first contact hole.

Abstract: A semiconductor manufacturing device includes a plasma chamber, a source power supply, and first and second bias power supplies. The source power supply applies a first source voltage to the plasma chamber at a first time and a second source voltage to the plasma chamber at a second time. The first bias power supply applies a first turn-on voltage to the plasma chamber at the first time and a first turn-off voltage to the plasma chamber at the second time. The second bias power supply applies a second turn-off voltage to the plasma chamber at the first time and a second turn-on voltage to the plasma chamber at the second time. The plasma chamber forms plasmas of different conditions from a gas mixture in the plasma chamber based on the source, turn-on, and turn-off voltages.

Abstract: The present invention relates to a method and device for generating an engineering topology of a digital substation. The method may include: generating, by a single line diagram generation module, a single line diagram of the digital substation based on input information regarding a plurality of substation component devices and connection relations therebetween; converting, by a topology conversion module, the single line diagram of the digital substation into an engineering topology conforming to international standards by use of conversion conditions stored in a topology component management module; verifying, by a topology verification module, whether the engineering topology is suitable for the digital substation based on the international standards; and generating, by an international standard file generation module, a single line diagram engineering file of the digital substation as a system specification description (SSS) by use of the verified engineering topology.

Abstract: A plasma processing apparatus and a method for fabricating a semiconductor device using the same are provided. The plasma processing apparatus includes: a chuck stage configured to support a wafer thereon; a dielectric ring configured to surround a periphery of the chuck stage, the dielectric ring including a paraelectric material; and a dielectric constant controller configured to control a dielectric constant of the dielectric ring.

Abstract: A semiconductor device may include a refresh control circuit which may generate test addresses that are counted based on a refresh signal and a detection clock signal and may senses logic levels of internal data corresponding to the test addresses to generate a sense signal. The semiconductor device may include a memory circuit may include a plurality of word lines which are selected by the test addresses and may output the internal data stored in memory cells connected to the word lines. The semiconductor device may include an address storage circuit may divide each of the test addresses into a main group and a sub-group to store the main groups and the sub-groups of the test addresses. The address storage circuit may store the sub-groups which are inputted at a point of time that the sense signal is generated, regarding the stored main groups having the same level combination.

Abstract: A semiconductor device, a test method, and a system including the same are disclosed, which may relate to a technology for testing open and short states of a pad of a semiconductor device.

Abstract: The described technology relates to a light detection and ranging (LIDAR) device. The LIDAR device can include a transmission unit configured to emit a first signal, a first lens unit configured to convert the first signal into parallel light, a reflection unit configured to adjust a direction of the converted first signal and a second lens unit configured to enable the first signal to have the same focal plane even when a reflection angle of the reflection unit changes. The LIDAR device can also include a third lens unit configured to convert the first signal passing through the second lens unit into parallel light, a fourth lens unit configured to increase an angle of the first signal passing through the third lens unit and a reception unit configured to receive a second signal reflected by an object after passing through the fourth lens unit.

Abstract: Provided herein may be a semiconductor device. The semiconductor device may include a first substrate, a second substrate disposed on the first substrate, a stack which is disposed on the second substrate and includes stacked memory cells, and a discharge contact structure electrically coupling the second substrate with the first substrate such that charges in the second substrate are discharged to the first substrate.

Abstract: There is provided a method of controlling a wearable robot. The method includes measuring an electrical signal from a scalp of a wearer, estimating a current walking speed of the wearer using the measured electrical signal, and outputting assistive torque which allows the estimated current walking speed to approximate a target walking speed.

Abstract: A charging device of a robot cleaner is provided. The charging device of a robot cleaner according to the embodiment includes at least one cover forming an appearance of the charging device, a base which is coupled with the cover and includes a terminal unit for charging the robot cleaner, an induction signal generating unit disposed at a side of the cover or the base to transmit a return induction signal to the robot cleaner, and an induction signal guide member disposed at a side of the induction signal generating unit to enhance a docking performance of the robot cleaner by improving linearity of the induction signal. The charging device according to the embodiment can guide the path for the return of the robot cleaner and recharge the robot cleaner stably.

Abstract: A charging device of a robot cleaner is provided. The charging device of a robot cleaner according to the embodiment includes at least one cover forming an appearance of the charging device, a base which is coupled with the cover and includes a terminal unit for charging the robot cleaner, an induction signal generating unit disposed at a side of the cover or the base to transmit a return induction signal to the robot cleaner, and an induction signal guide member disposed at a side of the induction signal generating unit to enhance a docking performance of the robot cleaner by improving linearity of the induction signal. The charging device according to the embodiment can guide the path for the return of the robot cleaner and recharge the robot cleaner stably.