Patents by Inventor In-Bo Shim

In-Bo Shim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGES
    Publication number: 20210343617
    Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.
    Type: Application
    Filed: July 15, 2021
    Publication date: November 4, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ji Hwang KIM, Jong Bo SHIM, Jang Woo LEE, Yung Cheol KONG, Young Hoon HYUN
  • METHOD OF REDUCING STORAGE CAPACITY FOR BIG DATA PROCESSING
    Publication number: 20210326070
    Abstract: An operating method of a data storage system comprising a processor and multiple storage devices, the operating method comprising: a first storage operation of selecting a first storage device, a second storage device, and a third storage device among the multiple storage devices and transmitting and storing data generated by the processor in the first storage device and the second storage device, a second storage operation of transmitting, to the third storage device, the data stored in the second storage device and compressing and storing the data in the third storage device, a first access operation of accessing the data in the first storage device, by the processor, after the first storage operation is completed, and a second access operation of accessing the data in the second storage device after fail of the first access operation.
    Type: Application
    Filed: September 29, 2020
    Publication date: October 21, 2021
    Inventor: Eung Bo SHIM
  • BIOSENSOR AND MANUFACTURING METHOD THEREFOR
    Publication number: 20210282681
    Abstract: Disclosed is a biosensor. The biosensor comprises: an electrode; and a polymer structure disposed on the electrode and formed of poly-5,2?:5?,2?-terthiophene-3-carboxylic acid (pTTCA), wherein an enzyme is present in a state of covalently binding with pTTCA inside the polymer structure.
    Type: Application
    Filed: December 29, 2016
    Publication date: September 16, 2021
    Inventors: Kwang-bok KIM, Yoon-Bo SHIM, Han-gyol PARK, Youn-joo SONG, Seong-je CHO, Chul-ho CHO, Dong-Min KIM
  • DATA PROCESSING SYSTEM AND OPERATING METHOD THEREOF
    Publication number: 20210271541
    Abstract: A data processing system includes a plurality of memory boards including a plurality of memory devices, and an error management controller that generates second error information based on plural pieces of first error information respectively received from each of the memory devices, and a memory error analysis device that analyzes the second error information received from the memory boards.
    Type: Application
    Filed: May 18, 2021
    Publication date: September 2, 2021
    Inventor: Eung-Bo SHIM
  • Resin composition for semiconductor package, prepreg, and metal clad laminate using the same
    Patent number: 11091630
    Abstract: The present invention relates to a resin composition having high miscibility between internal components, low thermal expansion characteristics, and excellent mechanical properties, and a prepreg and a metal clad laminate formed from the same.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: August 17, 2021
    Assignee: LG CHEM, LTD
    Inventors: Chang Bo Shim, Hee Yong Shim, Hyun Sung Min, Young Chan Kim, Seung Hyun Song
  • PERORAL ENDOSCOPIC APPARATUS
    Publication number: 20210219828
    Abstract: Disclosed is a peroral endoscopic apparatus of a swallowable type, the peroral endoscopic apparatus including: at least one imaging unit configured to perform imaging of a human body digestive system and output image data; at least one ultrasonic unit configured to output ultrasonic data on a submucosal region of the digestive system and a peripheral organ located therearound; a magnetic unit configured to adjust a position, a posture, and a proceeding direction of the peroral endoscopic apparatus in response to an external magnetic force; a transceiving unit configured to transmit the image data and the ultrasonic data to an external device or receive an external control signal; a control unit configured to control the imaging unit and the ultrasonic unit to perform imaging of the digestive system and the submucosal region simultaneously or individually; and a power supply unit configured to supply power.
    Type: Application
    Filed: August 31, 2018
    Publication date: July 22, 2021
    Applicant: Endolfin Co., Ltd.
    Inventor: Han Bo SHIM
  • Semiconductor packages including a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure
    Patent number: 11069592
    Abstract: A semiconductor includes a lower structure, an upper structure on the lower structure, and a connection pattern between the lower structure and the upper structure. The connection pattern is configured to electrically connect the lower structure and the upper structure to each other. The lower structure includes a lower base and a first lower chip on the lower base. The first lower chip includes a chip bonding pad, a pad structure, and a heat sink structure. The connection pattern is connected to the upper structure and extends away from the upper structure to be connected to the pad structure. The pad structure has a thickness greater than a thickness of the chip bonding pad. At least a portion of the heat sink structure is at a same height level as at least a portion of the pad structure.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: July 20, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji Hwang Kim, Jong Bo Shim, Jang Woo Lee, Yung Cheol Kong, Young Hoon Hyun
  • NONVOLATILE MEMORY DEVICE AND PROGRAM METHOD OF THE SAME
    Publication number: 20210217477
    Abstract: A program method of a nonvolatile memory device that performs a plurality of program loops is provided. At least one of the plurality of program loops includes dividing a channel of a selected cell string into a first side channel and a second side channel during a first interval and a second interval, turning off a string selection transistor of the selected cell string by applying a string select line voltage of a first level during the first interval, and boosting a first voltage of the first side channel and a second voltage of the second side channel, and turning on the string selection transistor by applying the string select line voltage of a second level different from the first level during the second interval, and performing a hot carrier injection (HCI) program operation on a selected memory cell corresponding to the first side channel or the second side channel.
    Type: Application
    Filed: April 1, 2021
    Publication date: July 15, 2021
    Inventors: Won-bo SHIM, Ji-ho CHO, Yong-seok KIM, Byoung-taek KIM, Sun-gyung HWANG
  • DISPLAY DEVICE
    Publication number: 20210216157
    Abstract: A display device includes a first display area including a first pixel area; a second display area including a second pixel area and a transmissive area; a signal line, a common electrode, and a touch electrode that are disposed in the second display area. The common electrode includes an opening overlapping the transmissive area, and the common electrode is disposed between the signal line and the touch electrode to overlap the signal line.
    Type: Application
    Filed: September 15, 2020
    Publication date: July 15, 2021
    Applicant: Samsung Display Co., LTD.
    Inventors: Jin Ho JEONG, Myoung-Ho KWON, Ho Seok SON, Jin Bo SHIM
  • MEMORY SYSTEM FOR SELECTING COUNTER-ERROR OPERATION THROUGH ERROR ANALYSIS AND DATA PROCESS SYSTEM INCLUDING THE SAME
    Publication number: 20210208966
    Abstract: A data processing system comprising: a memory system comprising a plurality of memory devices, each of which comprises a first error correction unit and a plurality of cell array regions each having a plurality of memory cells coupled in an array to a plurality of word lines and a plurality of bit lines; and a host comprising a second error correction unit for correcting an error of data transferred from the memory system, and suitable for generating error correction information on the error correction operation of the second error correction unit, setting error correcting strengths to the respective memory devices using the error correction information and log information, and performing counter-error operations on the respective memory devices according to the error correcting strengths.
    Type: Application
    Filed: July 8, 2020
    Publication date: July 8, 2021
    Inventors: Eung Bo SHIM, Nam Young AHN
  • Method of erasing data in nonvolatile memory device, nonvolatile memory device performing the same and memory system including the same
    Patent number: 11056194
    Abstract: A nonvolatile memory device includes a memory cell region, a peripheral circuit region, a memory block in the memory cell region, a row decoder in the peripheral circuit region, and a control circuit in the peripheral circuit region. The memory cell region includes a first metal pad. The peripheral circuit region includes a second metal pad and is vertically connected to the memory cell region by the first metal pad and the second metal pad. The memory block includes memory cells stacked in a direction intersecting a substrate, and is divided into a plurality of sub-blocks configured to be erased independently. The row decoder selects the memory block by units of a sub-block.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: July 6, 2021
    Inventors: Won-Bo Shim, Sang-Wan Nam, Ji-Ho Cho
  • IMAGE SENSOR PACKAGE
    Publication number: 20210202563
    Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 1, 2021
    Inventors: Ji-hwang KIM, Jong-bo SHIM, Sang-uk HAN, Cha-jea JO, Won-il LEE
  • Data processing system and operating method thereof
    Patent number: 11048573
    Abstract: A data processing system includes a plurality of memory boards including a plurality of memory devices, and an error management controller that generates second error information based on plural pieces of first error information respectively received from each of the memory devices, and a memory error analysis device that analyzes the second error information received from the memory boards.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: June 29, 2021
    Assignee: SK hynix Inc.
    Inventor: Eung-Bo Shim
  • Semiconductor device and method of manufacturing the same
    Patent number: 11037953
    Abstract: Provided herein may be a semiconductor device. The semiconductor device may include a first substrate, a second substrate disposed on the first substrate, a stack which is disposed on the second substrate and includes stacked memory cells, and a discharge contact structure electrically coupling the second substrate with the first substrate such that charges in the second substrate are discharged to the first substrate.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: June 15, 2021
    Assignee: SK hynix Inc.
    Inventors: Sung Bo Shim, Jung Dal Choi
  • TIP FOR INTRA-TYMPANIC INJECTION
    Publication number: 20210128843
    Abstract: Provided is a tip for intra-tympanic injection capable of allowing a practitioner to accurately recognize an injection location and preventing the practitioner from piercing regions of an external auditory meatus other than the eardrum with an injection needle, in case of piercing the eardrum with the injection needle.
    Type: Application
    Filed: July 20, 2018
    Publication date: May 6, 2021
    Inventor: Min Bo SHIM
  • Photosensitive resin composition and display device including the same
    Patent number: 10982061
    Abstract: A photosensitive resin composition includes: a) an acryl-based copolymer obtained by copolymerizing i) a hydroxyl group-containing unsaturated compound; ii) an unsaturated carboxylic acid, an unsaturated carboxylic anhydride, or a mixture thereof; iii) an epoxy group-containing unsaturated compound; and iv) an olefin-based unsaturated compound, b) a 1,2-quinonediazide 5-sulfonic ester compound having a phenol compound including a compound represented by the above Chemical Formula A as ballast, c) a silane coupling agent, and d) a solvent.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: April 20, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seung Bo Shim, Chang Hun Kwak, Hye Won Jang, Byung Uk Kim, Tai Hoon Yeo, Hyoc Min Youn, Sang-Hoon Lee, Tae Pyo Cho
  • Image sensor package
    Patent number: 10971535
    Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.
    Type: Grant
    Filed: June 29, 2017
    Date of Patent: April 6, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-hwang Kim, Jong-bo Shim, Sang-uk Han, Cha-jea Jo, Won-il Lee
  • Nonvolatile memory device and program method of the same
    Patent number: 10971232
    Abstract: A program method of a nonvolatile memory device that performs a plurality of program loops is provided. At least one of the plurality of program loops includes dividing a channel of a selected cell string into a first side channel and a second side channel during a first interval and a second interval, turning off a string selection transistor of the selected cell string by applying a string select line voltage of a first level during the first interval, and boosting a first voltage of the first side channel and a second voltage of the second side channel, and turning on the string selection transistor by applying the string select line voltage of a second level different from the first level during the second interval, and performing a hot carrier injection (HCI) program operation on a selected memory cell corresponding to the first side channel or the second side channel.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: April 6, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won-bo Shim, Ji-ho Cho, Yong-seok Kim, Byoung-taek Kim, Sun-gyung Hwang
  • Refrigerator
    Patent number: 10962281
    Abstract: Disclosed herein is a refrigerator having a storage box by which the humidity in a storage compartment is controllable. The refrigerator includes a body having a storage compartment, a storage box installed to be drawable in the storage compartment, a cover located above the storage box and provided to be rotatable, a cover frame configured to support the cover, and a knob configured to rotate the cover to adjust humidity inside the storage box.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: March 30, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae Bok Lee, Myoung Jin Jang, Yong Bo Shim
  • Semiconductor package and method of manufacturing the same
    Patent number: 10964618
    Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip attached to an upper surface of the first semiconductor chip, a silicon heat-dissipation body thermally connected to at least one of the first semiconductor chip and the second semiconductor chip, and a molding member configured to surround the first semiconductor chip and the second semiconductor chip and exposing an upper surface of the silicon heat-dissipation body.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jang-woo Lee, Kyung-suk Oh, Yung-cheol Kong, Woo-hyun Park, Jong-bo Shim, Jae-myeong Cha