Abstract: A semiconductor integrated circuit includes a semiconductor chip or a plurality of semiconductor chip stacked therein, wherein each semiconductor chip includes, a compatible mode selection unit configured to select a chip allocation signal allocated to the semiconductor chip, among a plurality of chip allocation signals inputted through a plurality of pads, in response to a stack package information, and an internal circuit configured to perform a given operation in response to the chip allocation signal selected by the compatible mode selection unit.

Abstract: A command buffer circuit of a semiconductor apparatus includes a first buffer configured to receive a first command signal and generate a first command control signal, a second buffer configured to receive a second command signal and generate a second command control signal, a second block configured to select and output the first command control signal or the second command control signal in response to a rank control signal, and a control signal generation block configured to generate the rank control signal in response to a single rank signal and a chip select signal.

Abstract: An address delay circuit of a semiconductor memory apparatus includes a first group control pulse generation unit configured to generate a first control pulse after input of a first group column address strobe pulse and passage of a time corresponding to a first set multiple of one cycle of a clock, a second group control pulse generation unit configured to generate a second control pulse after input of a second group column strobe address pulse and passage of a time corresponding to a second set multiple of the one cycle of the clock, a first address storage unit configured to receive and store a first group external address in response to the first control pulse, and output a first group internal address, and a second address storage unit configured to receive and store a second group external address in response to the second control pulse, and output a second group internal address.

Abstract: Methods for generating a refresh signal in a semiconductor device and methods for performing a refresh operation in a semiconductor memory device are disclosed. A method for generating a refresh signal includes measuring a temperature of the semiconductor memory device, generating a temperature controlled voltage based on the measured temperature, generating an N-bit digital signal based on the temperature controlled voltage, and generating a refresh signal whose frequency is determined by the N-bit digital signal. The generation of the temperature controlled voltage includes generating a first current that is increased when the measured temperature is decreased and is decreased with the measured temperature is increased, and generating the temperature controlled voltage.

Abstract: A precharge signal generation circuit of a semiconductor memory apparatus may comprise a read/write precharge command generation section configured to delay a precharge command by a first delay time set in response to a control signal to generate one of a read precharge command and a write precharge command; and a read/write bank precharge address generation section configured to delay a bank column address strobe signal by a second delay time set in response to the precharge command delayed in the read/write precharge command generation section, and generate one of a read bank precharge address and a write bank precharge address.

Abstract: A column command buffer includes a variable delay section configured to determine a delay time based on a frequency of a clock, and output a column command after delaying it by the delay time; and a buffering section configured to receive an output of the variable delay section and generate internal column commands.

Abstract: A semiconductor integrated circuit includes: a plurality of chips configured to receive an external voltage. Each one of the chips detects a signal delay characteristic of the one of the chips to generate an internal voltage having a level corresponding to the signal delay characteristic.

Abstract: A package includes a master chip including a storage circuit configured to store an impedance setting of the master chip and an impedance setting of a slave chip, and a termination circuit for an impedance matching with an outside of the package, and the slave chip connected to the master chip, wherein if a termination operation for the slave chip is activated, the termination circuit of the master chip performs an impedance matching operation using the impedance setting for the slave chip.

Abstract: A semiconductor apparatus includes an individual chip designating code setting block configured to generate a plurality of individual chip designating codes which have different code values or at least two of which have the same code value, in response to a plurality of chip fuse signals; and an individual chip activation block configured to compare the plurality of individual chip designating codes with chip selection address in response to the plurality of chip fuse signals, and enable one of a plurality of individual chip activation signals based on a result of the comparison.

Abstract: A delay circuit includes: a delay unit configured to receive a clock signal, delay an input signal sequentially by a predetermined time interval, and output a plurality of first delayed signals; and an option unit configured to select one of the plurality of first delayed signals based on one or more select signals, and output a second delayed signal.

Abstract: An address delay circuit of a semiconductor memory apparatus includes a control pulse generation unit configured to generate a control pulse following a time corresponding to a predetermined multiple of cycles of a clock after a read write pulse is inputted; and a delay unit configured to output internal addresses when the control pulse is inputted, wherein the internal addresses are input as external addresses.

Abstract: In one embodiment, an external signal input circuit of a semiconductor memory may include: an input block configured to receive a plurality of external signals and to generate a plurality of internal signals; and a control block configured to output one or more internal signals of the plurality of internal signals that correspond to a rank configuration of the semiconductor memory and to block output of one or more internal signals of the plurality of internal signals that do not correspond to the rank configuration.

Abstract: A semiconductor integrated circuit includes a plurality of dies, wherein each of the dies is configured to enable a power circuit provided therein according to a power control signal, in a state in which the die was determined to be a good die or a fail die.

Abstract: A semiconductor integrated circuit includes a plurality of semiconductor chips respectively selected in response to a plurality of chip selection signals, and a chip selection signal generator configured to generate the chip selection signals in response to one first control signal for deciding whether to drive the semiconductor chips and at least one second control signal for selecting at least one semiconductor chip from among the semiconductor chips.

Abstract: A semiconductor apparatus includes an individual-chip-designating-code setting block configured to generate a plurality of sets of individual-chip-designating-codes which have different code values or in which at least two sets of individual-chip-designating-codes have the same code value, in response to a plurality of chip fuse signals; a control block configured to generate a plurality of enable control signals in response to the plurality of chip fuse signals and most significant bits of the plurality of sets of individual-chip-designating-codes; and an individual chip activation block configured to compare individual-chip-designating-codes of the plurality of sets of individual-chip-designating-codes excluding the most significant bits, with chip selection addresses in response to the plurality of enable control signals, and enable one of a plurality of individual-chip-activation-signals depending upon a comparison result.

Abstract: An address delay circuit of a semiconductor memory apparatus includes a first group control pulse generation unit configured to generate a first control pulse after input of a first group column address strobe pulse and passage of a time corresponding to a first set multiple of one cycle of a clock, a second group control pulse generation unit configured to generate a second control pulse after input of a second group column strobe address pulse and passage of a time corresponding to a second set multiple of the one cycle of the clock, a first address storage unit configured to receive and store a first group external address in response to the first control pulse, and output a first group internal address, and a second address storage unit configured to receive and store a second group external address in response to the second control pulse, and output a second group internal address.

Abstract: Various embodiments of a semiconductor memory apparatus are disclosed.

Abstract: Semiconductor memory device includes a cell array including a plurality of unit cells; and a test circuit configured to perform a built-in self-stress (BISS) test for detecting a defect by performing a plurality of internal operations including a write operation through an access to the unit cells using a plurality of patterns during a test procedure carried out at a wafer-level.

Abstract: A semiconductor memory apparatus includes one or more semiconductor chips configured to have predetermined capacity and structure; and a signal level control unit configured to control levels of external signals, which are input to the one or more semiconductor chips, in order to realize various capacities and structures using the one or more semiconductor chips.

Abstract: A command buffer circuit of a semiconductor apparatus includes a first buffer configured to receive a first command signal and generate a first command control signal, a second buffer configured to receive a second command signal and generate a second command control signal, a second block configured to select and output the first command control signal or the second command control signal in response to a rank control signal, and a control signal generation block configured to generate the rank control signal in response to a single rank signal and a chip select signal.