Patents by Inventor Ji-Yong Park

Ji-Yong Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12374610
    Abstract: A semiconductor package includes a first substrate including a first wiring layer inside the first substrate, a second substrate including a second wiring layer inside the second substrate, and a mold layer between the first substrate and the second substrate. An upper surface of the mold layer is on a same plane as upper surfaces of the first substrate and the second substrate. The package includes a first connecting film on each of the upper surface of the first substrate and the upper surface of the second substrate, the first connecting film connecting the first substrate and the second substrate, and a first semiconductor chip on the upper surface of the first substrate. The first semiconductor chip is spaced apart from the first connecting film, and an upper surface of the first connecting film is lower than an upper surface of the first semiconductor chip.
    Type: Grant
    Filed: September 6, 2022
    Date of Patent: July 29, 2025
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Se-Ho You, Ji-Yong Park
  • Publication number: 20250233783
    Abstract: Provided are a data transmission circuit system and a data reception circuit system, which use an edge of a pulse signal. The data transmission circuit system modulates a digital signal by using time levels determined by time differences between rising edges (or falling edges) of a clock pulse signal and rising edges (or falling edges) of a data pulse signal. The data reception circuit system demodulates a digital signal by using time levels determined by time differences between rising edges (or falling edges) of a recovered clock pulse signal and rising edges (or falling edges) of a data pulse signal.
    Type: Application
    Filed: September 4, 2024
    Publication date: July 17, 2025
    Applicant: Konkuk University Industrial Cooperation Corp
    Inventors: Ju Sung PARK, Ji Yong Park, Jintae Kim
  • Publication number: 20250233583
    Abstract: Provided are a data transmission circuit system and a data reception circuit system, which use an edge of a pulse signal. The data transmission circuit system modulates a digital signal by using time levels determined based on time differences between rising edges and falling edges of a clock pulse signal, and rising edges and falling edges of a data pulse signal. The data reception circuit system demodulates a digital signal by using time levels determined based on time differences between rising edges and falling edges of a recovered clock pulse signal, and rising edges and falling edges of a data pulse signal.
    Type: Application
    Filed: September 11, 2024
    Publication date: July 17, 2025
    Applicant: Konkuk University Industrial Cooperation Corp
    Inventors: Ji Yong PARK, Ju Sung PARK, Jintae KIM
  • Publication number: 20250224837
    Abstract: A display device includes: a display panel including a display layer and a touch layer; and a touch driving circuit connected to first electrodes and second electrodes of the touch layer. The touch driving circuit is to: determine frequencies of touch driving signals to be supplied to the first electrodes; assign the frequencies to the touch driving signals in an ascending order; determine a first phase of each of the touch driving signals that minimizes a cumulative value of PAPRs while sequentially varying phases of the touch driving signals; update the phases of the touch driving signals from the first phase to a second phase that minimizes the cumulative value of the PAPRs by sequentially varying the first phase of each of the touch driving signals; and output the touch driving signals based on the frequencies assigned to the touch driving signals, respectively, and the second phase.
    Type: Application
    Filed: August 15, 2024
    Publication date: July 10, 2025
    Inventors: Ji Hoon KIM, Kae Won CHOI, Ji Yong PARK, Min Jun JEONG, Jang Hui KIM, Keum Dong JUNG
  • Publication number: 20250161878
    Abstract: The present invention relates to an air purifier, and more particularly, to a portable or vehicle-mounted air purifier. The present invention is advantageous for effectively capturing and sterilizing airborne virus particles by generating OH radicals with sterilizing capabilities through the application of a light source and a photocatalyst containing a light-responsive material.
    Type: Application
    Filed: July 7, 2023
    Publication date: May 22, 2025
    Inventors: Su Jin Woo, Ji-Yong Park, Sung Ro Go
  • Publication number: 20250162691
    Abstract: A floating-type offshore wind power mooring system capable of reducing a yaw motion including a floating body having three columns, disposed at the vertices of a triangle, respectively, and three pontoon units, disposed in a triangular shape to connect the multiple columns; and a wind power generation unit disposed in any one of the three columns and including a mooring unit. The mooring unit includes first, second, and third mooring lines, and a connection unit. The first mooring line has one end connected to any one of the three columns; the second mooring line has one end connected to another of the three columns; the third mooring line has one end connected to the seabed. The connection unit connects the other end of the first, second and third mooring lines so that the first mooring line, the second mooring line, and the third mooring line are arranged in a Y-shape.
    Type: Application
    Filed: October 17, 2022
    Publication date: May 22, 2025
    Inventors: Kyong Hwan KIM, Se Wan PARK, Yoon Jin HA, Ji Yong PARK, Chan ROH, Hyeon Jeong AHN, Chang Hyuck LIM, Jang Whan KIM, Jo Hyun KYOUNG, Aldric BAQUET, Zhirong SHEN
  • Publication number: 20250149501
    Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.
    Type: Application
    Filed: January 8, 2025
    Publication date: May 8, 2025
    Inventors: Rahul JAIN, Ji Yong PARK, Kyu Oh LEE
  • Patent number: 12291583
    Abstract: A carrageenan derivative according to the present disclosure can quickly and easily detect and label the presence of inflammation-related macrophages and, particularly, can accurately and easily identify M1-type macrophages highly associated with early inflammation. In addition, the carrageenan derivative has advantages in that it can be produced easily, environmental pollution is minimized because a small amount of organic solvent is used, and initial cost is low.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: May 6, 2025
    Assignees: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Hong Seog Seo, Yong Jik Lee, Jae Min Jeong, Yun Sang Lee, Ji Yong Park
  • Patent number: 12288744
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: April 29, 2025
    Assignee: Intel Corporation
    Inventors: Ji Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew James Brown, Cheng Xu, Jiwei Sun
  • Patent number: 12287322
    Abstract: The present invention relates to a composition for detecting hydrogen sulfide or measuring a concentration of hydrogen sulfide, and a composition comprising same as an effective ingredient for diagnosing or imaging in vivo inflammation, tissues having hypoxic damage, or cancer.
    Type: Grant
    Filed: September 11, 2019
    Date of Patent: April 29, 2025
    Assignee: Seoul National University R&DB Foundation
    Inventors: Jae Min Jeong, Young Ju Kim, Yun-Sang Lee, Ji Yong Park
  • Publication number: 20250129767
    Abstract: A floating type offshore wind structure having improved structural strength and reduced weight, including a floating body having buoyancy in the seat; and a wind power generation unit fixed to the floating body, wherein the floating body includes a plurality of columns disposed at the vertex positions of a triangle, respectively, and a plurality of pontoon units disposed in the form of a triangle, so as to connect the plurality of columns, the wind power generation unit is placed at any one of the plurality of columns, each of the plurality of columns includes a first side in contact with a first pontoon unit which is any one of the plurality of pontoon units, and a second side in contact with a second pontoon unit which is another one of the plurality of pontoon units, and each of the first side and the second side is a planar surface.
    Type: Application
    Filed: October 17, 2022
    Publication date: April 24, 2025
    Inventors: Kyong Hwan KIM, Se Wan PARK, Yoon Jin HA, Ji Yong PARK, Chan ROH, Hyeon Jeong AHN, Chang Hyuck LIM, Jang Whan KIM, Jo Hyun KYOUNG, Aldric BAQUET, Zhirong SHEN
  • Patent number: 12246330
    Abstract: A dust collecting apparatus for an electric precipitator, capable of adsorbing and filtering fine dust contained in air in an air ventilation apparatus such as an air conditioner or an air purifier and, more specifically, to a dust collecting apparatus for an electric precipitator which is capable of improving manufacturability and dust collection performance because the dust collecting apparatus comprises a first connection unit that is continuously provided on one side of a plurality of first dust collection plates, and is capable of improving assemblability because a first dust collection unit and a second dust collection unit can be assembled at accurate positions in a first case and a second case, respectively.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: March 11, 2025
    Assignee: HANON SYSTEMS
    Inventors: Ji-Yong Park, Ki Hong Kim, Jae Ho Kim
  • Patent number: 12239998
    Abstract: The present invention relates to an electric precipitator which adsorbs and filters fine dust included in air from air conditioning apparatuses such as an air conditioner or an air purification apparatus, wherein an electric charging part and a precipitating part to which high voltage is applied do not adversely affect each other and may increase precipitation efficiency.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: March 4, 2025
    Assignee: HANON SYSTEMS
    Inventor: Ji-Yong Park
  • Patent number: 12224264
    Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.
    Type: Grant
    Filed: October 30, 2023
    Date of Patent: February 11, 2025
    Assignee: Intel Corporation
    Inventors: Rahul Jain, Ji Yong Park, Kyu Oh Lee
  • Publication number: 20250026457
    Abstract: Proposed is an arrangement of local structures for TLP-type floating offshore wind turbine platform stress distribution and strength enhancement, the arrangement being characterized in that a plurality of supporting members of which at least one is elongated in a different direction protrudes from the bottom plate of a node, so the top plate of the node to which load is applied by a wind turbine is supported by the supporting members, stress is distributed, and damage to the top plate is prevented such that the wind turbine can be stably supported through the node.
    Type: Application
    Filed: May 24, 2024
    Publication date: January 23, 2025
    Applicant: KOREA INSTITUTE OF OCEAN SCIENCE & TECHNOLOGY
    Inventors: Kyong Hwan KIM, Ji Yong PARK, Yoon Jin HA, Se Wan PARK, Gil Won KIM, Chang Hyuck LIM, Byung Soo KIM
  • Publication number: 20240421043
    Abstract: Various embodiments disclosed relate to methods of making hybrid bonds for semiconductor assemblies, such as including substrate, semiconductor dies, and/or interconnects. The present disclosure includes a hybrid bond assembly having a via and a dielectric layer, each of the via and the dielectric layer bonding two or more components to each other.
    Type: Application
    Filed: June 19, 2023
    Publication date: December 19, 2024
    Inventors: Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Ji Yong Park, Kyu Oh Lee, Sheng Li, Gang Duan, Sameer Paital
  • Publication number: 20240408616
    Abstract: The present invention relates to an electrification unit and an electrostatic precipitator comprising same. The electrification unit includes: an electrification frame having a through-hole formed to pass through both surfaces thereof in a direction in which air including dust particles flows; a counter electrode coupled to the electrification frame; and a discharge electrode coupled to the electrification frame and causing corona discharge with respect to the counter electrode, wherein a catalyst layer capable of decomposing or removing ozone is coated on a surface of the counter electrode to decompose, reduce and remove ozone generated by corona discharge, and decompose and remove harmful gas.
    Type: Application
    Filed: November 4, 2022
    Publication date: December 12, 2024
    Inventors: Ji-Yong Park, Jae Ho Kim, Su Jin Woo
  • Patent number: 12154715
    Abstract: Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: November 26, 2024
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Kyu-Oh Lee, Junnan Zhao, Rahul Jain, Ji Yong Park, Sai Vadlamani, Seo Young Kim
  • Publication number: 20240335841
    Abstract: The present invention relates to a dust collection unit and an electric dust collection apparatus including the same, and more particularly, to a dust collection unit and an electric dust collection apparatus including the same, in which films are inserted into an insertion groove formed in a casing, and a conductive terminal is inserted to electrically connect the plurality of films at once, thereby easily, conveniently, and electrically connecting the films and stably maintaining electrical connection.
    Type: Application
    Filed: November 9, 2022
    Publication date: October 10, 2024
    Inventors: Ji-Yong Park, Jae Ho Kim, Su Jin Woo
  • Publication number: 20240278259
    Abstract: A dust collection unit for an electric precipitator and the electric precipitator including same, comprising: a plurality of dust collection films arranged apart from each other and including different, alternately arranged electrodes; a fixing member which is coupled to the plurality of dust collection films at one side or both sides where the plurality of collection films are arranged, so as to fix the plurality of dust collection films to be spaced apart from each other at specific intervals, and a ground electrode accommodated inside the fixing member. Accordingly, the dust collection performance of the electric precipitator may be improved by facilitating the discharge of a charging unit by suppressing an electric field generated by applying a high voltage to the plurality of dust collection films.
    Type: Application
    Filed: October 17, 2022
    Publication date: August 22, 2024
    Inventors: Ji-Yong Park, Jae Ho Kim, Su Jin Woo