Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.

Abstract: The present invention relates to an electric precipitator which adsorbs and filters fine dust included in air from air conditioning apparatuses such as an air conditioner or an air purification apparatus, wherein an electric charging part and a precipitating part to which high voltage is applied do not adversely affect each other and may increase precipitation efficiency.

Abstract: A supercooling refrigerator (1000) including: a refrigerator body (100); a door (200) for opening and closing one side of the refrigerator body (100); an accommodating portion (400) provided inside the refrigerator body (100) and seated with an object (M) to be stored; a cooling duct (600) including a fan for taking in air in the refrigerator body (100) and discharging the air, and an evaporator (630) for cooling the air discharged from the fan; and a cool air supply duct (700) formed with a cool air discharge port (710) through which the air cooled through the cooling duct (600) is discharged into the refrigerator body (100), the fan being a cross flow fan (620) including a plurality of discs (622), and a plurality of blades (623) disposed between the discs (622) along outer circumferential surfaces of the discs (622).

Abstract: Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.

Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.

Abstract: A vehicle air conditioner is equipped with a photocatalyst which is irradiated with light so that bacteria generated in the photocatalyst is removed. In particular, an entire area of the photocatalyst is irradiated with the light using a small number of light sources so that sterilization effect of a filter can be improved.

Abstract: An apparatus is provided which comprises: a cavity made in a substrate of a printed circuit board (PCB); a plurality of solder balls embedded in the cavity; and a horizontal trace within the substrate, wherein the horizontal trace is partially directly under the plurality of solder balls and is coupled to the plurality of solder balls and another trace or via in the substrate such that a substrate region under the plurality of solder balls is independent of a stop layer under the cavity.

Abstract: Techniques for fabricating a semiconductor package having magnetic materials embedded therein are described. For one technique, fabrication of package includes: forming a pad and a conductive line on a build-up layer; forming a raised pad structure on the build-up layer, the raised pad comprising a pillar structure on the pad; encapsulating the conductive line and the raised pad structure in a magnetic film comprising one or more magnetic fillers; planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar; depositing a primer layer on the top surfaces; removing one or more portions of the primer layer above the raised pad structure to create an opening; and forming a via in the opening on the raised pad structure. The primer layer may comprise one or more of a build-up layer, a photoimageable dielectric layer, and a metal mask.

Abstract: A carrageenan derivative according to the present disclosure can quickly and easily detect and label the presence of inflammation-related macrophages and, particularly, can accurately and easily identify M1-type macrophages highly associated with early inflammation. In addition, the carrageenan derivative has advantages in that it can be produced easily, environmental pollution is minimized because a small amount of organic solvent is used, and initial cost is low.

Abstract: Provided is a T1 contrast agent for magnetic resonance imaging. The T1 contrast agent includes fine iron oxide nanoparticle cores and micelles encapsulating the core particles. The micelles include a nonionic surfactant consisting of a hydrophilic moiety containing at least two chains and a hydrophobic moiety containing at least one C10-C30 hydrocarbon chain. The T1 contrast agent of the present invention is a novel one based on fine iron oxide nanoparticles that can replace conventional gadolinium-based T1 contrast agents. The T1 contrast agent based on fine iron oxide nanoparticles according to the present invention is harmless to humans, is rapidly distributed in the blood, and has a uniform size, ensuring its uniform contrast effect. In addition, the T1 contrast agent of the present invention enables image observation for at least 1 hour to up to 2 hours and is excreted through the kidneys and liver.

Abstract: Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.

Abstract: Disclosed is a refrigerator having an improved structure to improve space utilization of a storage container. Provided is a refrigerator including a refrigerator including: a main body; a storage chamber provided inside the main body and having an open front surface; a door provided to open and close the open front surface of the storage chamber; and a storage container having a storage space and provided to be withdrawn in the storage chamber, wherein the storage container may include a plurality of guide rails installed to face each other on an inner wall of the storage container; and a divider provided to be movable along the plurality of guide rails to divide the storage space into a plurality of storage spaces.

Abstract: A dust collecting apparatus for an electric precipitator, capable of adsorbing and filtering fine dust contained in air in an air ventilation apparatus such as an air conditioner or an air purifier and, more specifically, to a dust collecting apparatus for an electric precipitator which is capable of improving manufacturability and dust collection performance because the dust collecting apparatus comprises a first connection unit that is continuously provided on one side of a plurality of first dust collection plates, and is capable of improving assemblability because a first dust collection unit and a second dust collection unit can be assembled at accurate positions in a first case and a second case, respectively.

Abstract: Provided are a decoration sheet and a method for producing same. The decoration sheet sequentially includes a thermosetting resin layer, a deposition layer, and a base layer. The thermosetting resin layer has a micropattern on a surface thereof, and the elongation rate of the sheet is 200% to 300%. The method includes forming a photocurable imprint film having a first pattern on a first surface thereof, forming a thermosetting resin layer having a second pattern, which has a reverse phase to the first pattern, on a first surface thereof, forming a deposition layer on a second surface of the thermosetting resin layer, forming a substrate layer on one surface of the deposition layer, and releasing the photocurable imprint film from the thermosetting resin layer.

Abstract: An apparatus is provided which comprises: a cavity made in a substrate of a printed circuit board (PCB); a plurality of solder balls embedded in the cavity; and a horizontal trace within the substrate, wherein the horizontal trace is partially directly under the plurality of solder balls and is coupled to the plurality of solder balls and another trace or via in the substrate such that a substrate region under the plurality of solder balls is independent of a stop layer under the cavity.

Abstract: Disclosed is a refrigerator having an improved structure to improve space utilization of a storage container. Provided is a refrigerator including a refrigerator including: a main body; a storage chamber provided inside the main body and having an open front surface; a door provided to open and close the open front surface of the storage chamber; and a storage container having a storage space and provided to be withdrawn in the storage chamber, wherein the storage container may include a plurality of guide rails installed to face each other on an inner wall of the storage container; and a divider provided to be movable along the plurality of guide rails to divide the storage space into a plurality of storage spaces.

Abstract: An air blower device of an air-conditioning system for a vehicle including: a blower case including a duct part having an indoor air inlet and an outdoor air inlet, an air blowing part connected with an inlet of an air-conditioning case and a connection part for connecting the duct part with the air blowing part, the connection part having an insertion part of which the certain area is hollowed; an indoor and outdoor air converting door disposed inside the duct part of the blower case to open and close the indoor air inlet and the outdoor air inlet; an air blower is disposed inside the air blowing part of the blower case to forcedly blow air; an electric dust collector located at the connection part through the insertion part of the blower case; and a cover for opening and closing the insertion part of the blower case.

Abstract: Disclosed is a semiconductor package including a base film that has a first surface and a second surface opposite to the first surface, a plurality of input/output lines on the first surface of the base film, a semiconductor chip disposed on the first surface of the base film and connected to the input/output lines and including a central portion and end portions on opposite sides of the central portion, and a heat radiation pattern on the second surface of the base film The heat radiation pattern corresponds to the semiconductor chip and has a plurality of openings that correspond to the end portions of the semiconductor chip and that vertically overlap the end portions of the semiconductor chip.

Abstract: Techniques of protecting cored or coreless semiconductor packages having materials formed from dissimilar metals from galvanic corrosion are described. An exemplary semiconductor package comprises one or more build-up layers; first and second semiconductor components (e.g., die, EMIB, etc.) on or embedded in the one or more build-up layers. The first semiconductor component may be electrically coupled to the second semiconductor component via a contact pad and an interconnect structure that are formed in the one or more build-up layers. The contact pad can comprise a contact region, a non-contact region, and a gap region that separates the contact region from the non-contact region. Coupling of the contact pad and an interconnect structure is performed by coupling only the contact region with the interconnect structure. Also, a surface area of the contact region can be designed to substantially equal to a surface area of the interconnect structure.

Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.