Abstract: Provided is a camera module including an image sensor module including a substrate; an image sensor that is mounted on a top surface of the substrate; a ground pad that is disposed on a bottom surface of the substrate; and a sealing member that seals the image sensor mounted on the substrate; a lens member that is stacked on the image sensor module; and a conductive member that is formed on side surfaces of the image sensor module and the lens member so as to be electrically connected to the ground pad.

Abstract: Provided are a WLCSP of an image sensor and a method of manufacturing the same. The WLCSP includes a wafer, support members, glass, and metal bumps. The wafer has an image sensor and a pair of pads disposed thereon, a portion of the bottom surface of the image sensor being exposed outward from the both ends of the wafer. The support members are disposed on the pads to support the both bottom sides of the glass, the support members being formed to a predetermined thickness to provide a space for forming an air cavity. The glass is safely seated on the support members such that the air cavity is formed on the wafer. The metal bumps are disposed on the both sides of the wafer corresponding to the pads such that the bottom surfaces of the metal bumps protrude beyond the bottom surface of the wafer and form conductive lines electrically connected to the pads. Therefore, the package can be directly attached to a camera module even without using a separate PCB or ceramic substrate.

Abstract: Disclosed herein is a method for fabricating a pattern using a photomask that includes forming a first light shielding layer pattern over a substrate; forming a first resist layer pattern aligned to the first light shielding layer pattern over the first light shielding layer pattern; forming a phase shift region by selectively etching a portion of the substrate exposed by the first light shielding layer pattern; forming a second resist layer pattern by reducing the line width of the first resist layer pattern; forming a second light shielding layer pattern, having a reduced line width, by etching an exposed portion of the first light shielding layer pattern, and exposing a portion of the substrate adjacent the groove to form a rim region; removing the second resist layer pattern to form a photomask; and transferring a second pattern onto a wafer by performing an exposure process using the photomask.

Abstract: A method of fabricating a photomask includes includes forming a light blocking layer over a transparent substrate, and forming a hard mask pattern over the light blocking layer. The hard mask pattern exposes a portion of the light blocking layer. The method also includes depositing a self assembly molecule (SAM) layer over the hard mask pattern. The SAM layer covers the hard mask pattern and a portion of the exposed light blocking layer. The method also includes forming a resist layer pattern over an exposed portion of the light blocking layer that is not covered by the deposited SAM layer. The method further includes removing the SAM layer to expose the hard mask pattern and the light blocking layer, and etching the light blocking layer with the hard mask pattern and the resist layer pattern to form the photomask. Still further, the method includes removing the hard mask pattern and the resist layer pattern.

Abstract: Provided is a method for fabricating a photomask. A light blocking layer is formed on a transparent substrate having a first region and a second region. A hard mask layer is formed on the light blocking layer. A first polymer film is formed on the hard mask layer. Here, the first polymer film is formed of single strand polymers that can form a complementary binding. A portion of the first polymer film corresponding to the first region is changed to comprise polymers having partial complementary binding. A hard mask pattern for exposing a portion of the light blocking layer under the first polymer film is formed by performing an etching process using the changed portion as an etch stop. A light blocking pattern is formed by removing an exposed portion of the light blocking layer by performing an etching process using the hard mask pattern as an etch mask, and then removing the hard mask pattern.

Abstract: The present invention relates to a combi-card which can be used in a contact-type or noncontact-type fashion and a method for manufacturing the same. More particularly, this invention relates to a combi-card and a method for making the same, in which an inlay layer on which an antenna terminal made of a coil or conductive fiber is formed and a COB (chip on board) on which ACF (anisotropic conductor film) is applied, are pre-treated by a heating head and the like, the COB is attached to an antenna coil insertion layer, and an upper printing sheet with a protection film, and a lower printing sheet with a protection film, which are cut out to be suitable for the COB shape, are stacked to construct a combi-card.

Abstract: Disclosed is a semiconductor package and method for package a semiconductor that has high reliability. A semiconductor package according to the present invention comprises a first substrate on which a circuit pattern and an electrode pad are formed; a second substrate which is adhered to the first substrate and on which a hole is formed; and a solder ball adhered to the electrode pad through the hole formed on the second substrate. Then, the second substrate is used as a solder resist. Accordingly, since the first substrate and the second substrate are formed of same material, the BGA package can be prevented from being cracked and being nonuniform when fired.

Abstract: In polymers for an anti-reflective coating, compositions for an anti-reflective coating and methods of forming a pattern of a semiconductor device using the same, the compositions for an anti-reflective coating include a polymer that includes a first repeating unit having a basic side group, a second repeating unit having a light-absorbing group, and a third repeating unit having a cross-linkable group; a photoacid generator; a cross-linking agent; and a solvent. The polymer for the anti-reflective coating, which may have a basic side group chemically bound to a backbone of the polymer, may properly adjust diffusion of an acid in an anti-reflective coating layer to improve the profile of a pattern.

Abstract: A method for fabricating a photomask includes forming a phase shift layer and a light blocking layer on a transparent substrate, forming a light blocking pattern including a space through which the phase shift layer is selectively exposed by etching light blocking layer, forming a resist pattern to fill the space, reducing a critical dimension (CD) of the resist pattern by irradiating ultraviolet (UV) rays onto the resist pattern, forming a phase shift pattern by etching the phase shift layer exposed during the reducing of the CD of the resist pattern using the reduced resist pattern and the light blocking pattern as an etch mask, and removing the resist pattern.

Abstract: The present invention is to reduce a manufacturing cost and improve productivity by manufacturing a small module in comparison with a conventional module and simplifying a process. In order to achieve the object, the present invention provides a glass cap molding package including a substrate with an external connection terminal formed on a peripheral region of a top surface; an image sensor mounted on the top surface of the substrate; a transparent member installed on an upper part of the image sensor; and a molding unit formed to seal the image sensor and the transparent member and exposing the external connection terminal of the substrate to a lateral surface of the substrate, a manufacturing method thereof and a camera module including the same.

Abstract: The present invention relates to a method for preparing a styrenic olefin. The method of the present invention comprises the steps of: adding a catalyst and a solvent in a reactor and heating the reactor to create a reflux state; adding an alcohol starting material to the reactor dropwise at a constant rate; removing water generated by adding the alcohol starting material from the reactor, and purifying the obtained styrenic olefin. The method of the present invention is advantageous in minimizing byproducts and preparing styrenic olefins having a variety of substituents in high yield.

Abstract: The present invention relates to a camera module capable of being surface mounted (SMT) on a main substrate.

Abstract: In a method for fabricating a photo mask, first resist patterns are formed on a transparent substrate where a light blocking layer and a phase shift layer are formed. Line widths of the first resist patterns are measured to define a region requiring a line width correction. Second resist patterns exposing the defined region are formed on the first resist patterns. The line width of the light blocking layer is corrected by over-etching the exposed light blocking layer to a predetermined thickness. The second resist patterns are removed. Phase shift patterns and light blocking patterns are formed using the first resist patterns as an etch mask. Then, the first resist patterns are removed.

Abstract: In a photoresist composition for a semiconductor manufacturing process and a method of forming a photoresist pattern using the photoresist composition, the photoresist composition includes an organic dispersing agent for dispersing acid (H+). The photoresist film may have enough spaces among photosensitive polymers so that acid may be dispersed sufficiently in an exposure process. Thus, a photoresist pattern may be easily formed in a defocus region. Defects in a semiconductor device may be reduced and a productivity of the semiconductor manufacturing process may be enhanced.

Abstract: Disclosed herein are a semiconductor package used in digital optical instruments and a method of manufacturing the same. The semiconductor package comprises a wafer made of a silicon material and having pad electrodes formed at one side surface thereof, an IR filter attached on the pad electrodes of the wafer by means of a bonding agent, terminals electrically connected to the pad electrodes, respectively, in via holes formed at the other side surface of the wafer, which is opposite to the pad electrodes, and bump electrodes, each of which is connected to one side of each of the terminals. The present invention is capable of minimizing the size of a semiconductor package having an image sensor, which is referred to as a complementary metal oxide semiconductor (CMOS) or a charge coupled device (CCD), through the application of a wafer level package technology, thereby reducing the manufacturing costs of the semiconductor package and accomplishing production on a large scale.

Abstract: Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel.

Abstract: A semiconductor device according to example embodiments that may include an on-die termination (ODT) control circuit having a pipe line structure which changes in response to a frequency of a clock signal and a termination resistance generator for generating termination resistance in response to a termination resistance control signal.

Abstract: The present invention relates to a method for preparation of organofluoro compounds containing radioactive isotope fluorine-18. More particularly, the present invention relates to a method for preparation of organofluoro compound by reacting fluorine salt containing radioactive isotope fluorine-18 with alkyl halide or alkyl sulfonate in the presence of alcohol of Chemistry (FIG. 1) as a solvent to obtain high yield of organofluoro compound. Synthesis reaction according to the present invention may be carried out under mild condition to give high yield of the organofluoro compounds and the reaction time is decreased, and thereby is suitable for the mass production of the organofluoro compounds.

Abstract: The present invention relates to a plasma display panel, and more particularly, to a plasma display panel and method of manufacturing the same in which a manufacturing process is simple. To this end, in a plasma display panel according to an embodiment of the present invention, metal electrodes are composed of a green tape having a black electrode formed at the bottom and a silver electrode formed at the top, and are formed by exposing the green tape to ultraviolet rays of different wavelengths consecutively. Therefore, it is possible to simplify a manufacturing process of a plasma display panel and to reduce manufacturing cost.

Abstract: Provided are a wafer level chip scale package of an image sensor and a manufacturing method thereof. The wafer level chip scale package includes: a wafer including an image sensor and a pad on the top surface thereof and inclined surfaces on both ends thereof; expansion pads formed on the inclined surfaces of the wafer, including the pad, such that the expansion pads are electrically connected to the pad, a bottom surface of the expansion pads being on a straight line with respect to that of the wafer; a support formed on the expansion pads to support both bottom surfaces of a glass, the support having a height to provide a space where an air cavity is formed; and a glass disposed on the support to provide the air cavity over the wafer.