Patents by Inventor Jin Lu

Jin Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230238167
    Abstract: An electromagnetic component assembly includes a first magnetic core piece, a second magnetic core piece, and an inverted U-shaped conductive winding including a base section and first and second legs extending from base section. One of the first and second magnetic core pieces is configured to receive the base section. The first and second magnetic core pieces are gapped from one another to define a first gap, and one of the first and second magnetic core pieces includes a second gap that, in combination with the first gap, allows the component to be operated at more than one stable open circuit inductance (OCL) corresponding to different current loads.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Inventors: Yipeng Yan, Dengyan Zhou, Jinliang Xu, Jin Lu
  • Publication number: 20230177404
    Abstract: A system receives a plurality of data sets relating to differently trained versions of a global machine learning model, from a plurality of vehicles, the data sets including at least a present local loss value experienced by a current version of the global model executing on a given vehicle for which a data set of the plurality of data sets was received. The system determines a loss reduction for each received data set, representing a loss reduction since a previous local loss value included in a previous received data set corresponding to the given vehicle. The system determines whether the loss reduction for each received data set of the plurality of data sets exceeds a predefined threshold cutoff value and trains the global model using federated learning and based on the data sets of the plurality of data sets for which the loss reduction exceeds the predefined cutoff value.
    Type: Application
    Filed: December 7, 2021
    Publication date: June 8, 2023
    Inventors: Zaydoun Rawashdeh, Harsh Bhupendra Bhate, Jin Lu
  • Publication number: 20230148653
    Abstract: This application provides an arecoline salt and a preparation method and a product thereof. The arecoline salt is a benzoate of arecoline, with a structural formula shown as follows: where X is a molar ratio of arecoline to benzoic acid. The arecoline salt, with good physicochemical stability, is convenient to use and widely used.
    Type: Application
    Filed: March 26, 2021
    Publication date: May 18, 2023
    Inventors: JIN LU, GUOFENG FU, MING CHU, XING ZHOU, WENWEN HUANG, ZHONGLI XU, YONGHAI LI
  • Publication number: 20230133076
    Abstract: This application provides an areca nut-flavored product, containing an arecoline salt. Because an arecoline salt is used in the product, a user absorbs arecoline when consuming the product, and an effect similar to chewing areca nuts is produced, with relatively little irritation.
    Type: Application
    Filed: March 26, 2021
    Publication date: May 4, 2023
    Inventors: GUOFENG FU, JIN LU, MING CHU, XING ZHOU, WENWEN HUANG, ZHONGLI XU, YONGHAI LI
  • Patent number: 11641742
    Abstract: A method used in forming a memory array comprising strings of memory cells comprises forming a stack comprising vertically-alternating first tiers and second tiers. Horizontally-elongated trenches are formed into the stack to form laterally-spaced memory-block regions. A wall is formed in individual of the trenches laterally-between immediately-laterally-adjacent of the memory-block regions. The forming of the wall comprises lining sides of the trenches with insulative material comprising at least one of an insulative nitride and elemental-form boron. A core material is formed in the trenches to span laterally-between the at least one of the insulative nitride and the elemental-form boron. Structure independent of method is disclosed.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: May 2, 2023
    Assignee: Micron Technology, Inc.
    Inventors: Cole Smith, Ramey M. Abdelrahaman, Silvia Borsari, Chris M. Carlson, David Daycock, Matthew J. King, Jin Lu
  • Patent number: 11631520
    Abstract: An electromagnetic component assembly includes a first magnetic core piece, a second magnetic core piece, and an inverted U-shaped conductive winding including a base section and first and second legs extending from base section. One of the first and second magnetic core pieces is configured to receive the base section. The first and second magnetic core pieces are gapped from one another to define a first gap, and one of the first and second magnetic core pieces includes a second gap that, in combination with the first gap, allows the component to be operated at more than one stable open circuit inductance (OCL) corresponding to different current loads.
    Type: Grant
    Filed: October 14, 2019
    Date of Patent: April 18, 2023
    Assignee: Eaton Intelligent Power Limited
    Inventors: Yipeng Yan, Dengyan Zhou, Jinliang Xu, Jin Lu
  • Patent number: 11562036
    Abstract: The disclosed embodiments include computerized methods, systems, and devices, including computer programs encoded on a computer storage medium, for generating terms of a search query based on a user's spoken utterances, identifying multiple cross-platform messages based on the generated terms, and to generating, via a presentation device, a single interface that enables the user to interact with identified messages. Based on a spoken utterance, the disclosed embodiments may determine user-specified search terms and/or criteria, and based on the user-specified search terms and/or criteria, may obtain cross-platform message data that corresponds to the search query. The communications device may generate one or more interface elements that describe corresponding ones of the cross-platform messages, which may be presented within a unified graphical user interface or voice-user interface by a communications device.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: January 24, 2023
    Assignee: GOOGLE LLC
    Inventors: Vinh Quoc Ly, Ahmet Onur Tekdas, Timo Mertens, Okan Kolak, Charles Randell Sievert, Christine Nguyen, Jin Lu
  • Publication number: 20220320396
    Abstract: A display screen allowing higher pixel density and thus better screen resolution by virtue of the structures connecting to LED chip light sources includes a substrate, a number of pad structures, the LED chips, and a number of carrier boards. Each pad structure includes a positive electrode pad and three negative electrode pads. Each LED chip package includes a red light chip, a green light chip, and a blue light chip arranged on the three negative electrode pads. Each carrier board includes a positive electrode connection terminal and a negative electrode connection terminal, the positive electrode connection terminal is electrically connected to the positive electrode pad, the negative electrode connection terminal is electrically connected to one red light chip, one green light chip, or one blue light chip. The disclosure also provides a displaying device having the display screen.
    Type: Application
    Filed: December 29, 2021
    Publication date: October 6, 2022
    Inventors: HSI-CHE CHANG, JIN-LU LI, BO CHEN
  • Patent number: 11377577
    Abstract: Pressure sensitive adhesive (PSA) compositions that include at least one urethane (meth)acrylate oligomer having a molecular weight between about 2,000 g/mol and about 50,000 g/mol and an OH number of from 0.01 mg KOH/g to 100 mg KOH/g, at least one mono (meth)acrylate functional monomer and at least one tackifying resin. The PSA systems may also optionally include other additives, such as at least one initiator system that includes at least one photo-initiator or free radical initiator. The PSA systems are liquid at a temperature of 25° C.±2° C. with a viscosity of 15,000 cPs or less and are adapted to form smooth, uniform coatings or films upon curing without the application of heat, whereby the resulting films have advantageous properties with respect to peel strength, tack and shear resistance. In embodiments, the PSA systems include less than 1 wt % of solvent and less than 1 wt % of water or are free of solvent and are free of water.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: July 5, 2022
    Assignee: Arkema France
    Inventors: Jinping Wu, Xiaoxing Dong, Jin Lu
  • Patent number: 11361897
    Abstract: A multi-phase integrated power inductor component assembly includes a plurality of conductive windings on an integrated magnetic core structure accepting each of the plurality of conductive windings in a spaced apart, non-coupled arrangement with respect to one another. The integrated magnetic core structure includes a series of magnetic gaps each being respectively centered on one of the plurality of conductive windings. The windings include surface mount terminations for connection to a circuit board.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: June 14, 2022
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Yipeng Yan, Jinliang Xu, Dengyan Zhou, Jin Lu
  • Publication number: 20210408039
    Abstract: A method used in forming a memory array comprising strings of memory cells comprises forming a stack comprising vertically-alternating first tiers and second tiers. Horizontally-elongated trenches are formed into the stack to form laterally-spaced memory-block regions. A wall is formed in individual of the trenches laterally-between immediately-laterally-adjacent of the memory-block regions. The forming of the wall comprises lining sides of the trenches with insulative material comprising at least one of an insulative nitride and elemental-form boron. A core material is formed in the trenches to span laterally-between the at least one of the insulative nitride and the elemental-form boron. Structure independent of method is disclosed.
    Type: Application
    Filed: September 7, 2021
    Publication date: December 30, 2021
    Applicant: Micron Technology, Inc.
    Inventors: Cole Smith, Ramey M. Abdelrahaman, Silvia Borsari, Chris M. Carlson, David Daycock, Matthew J. King, Jin Lu
  • Patent number: 11152388
    Abstract: A method used in forming a memory array comprising strings of memory cells comprises forming a stack comprising vertically-alternating first tiers and second tiers. Horizontally-elongated trenches are formed into the stack to form laterally-spaced memory-block regions. A wall is formed in individual of the trenches laterally-between immediately-laterally-adjacent of the memory-block regions. The forming of the wall comprises lining sides of the trenches with insulative material comprising at least one of an insulative nitride and elemental-form boron. A core material is formed in the trenches to span laterally-between the at least one of the insulative nitride and the elemental-form boron. Structure independent of method is disclosed.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: October 19, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Cole Smith, Ramey M. Abdelrahaman, Silvia Borsari, Chris M. Carlson, David Daycock, Matthew J. King, Jin Lu
  • Publication number: 20210277144
    Abstract: Provided is an anti-HER3 humanized monoclonal antibody. The antibody is bound with HER3 antigen, has high affinity and biological activity and low immunogenicity, and is stable in structure. The antibody can be used for preparing drugs for preventing or treating HER3-related diseases.
    Type: Application
    Filed: July 17, 2019
    Publication date: September 9, 2021
    Inventors: Aidong QU, Hongyuan LIANG, Fanhong XU, Aoxiang LI, Lina WU, Jingye ZHU, Jianhua QIU, Jin LU, Lin ZHANG, Xin ZHAO, Xiaofei SONG
  • Patent number: 11033482
    Abstract: Disclosed herein are coating compositions that may include at least one urethane (meth)acrylate oligomer having a molecular weight between about 2,000 g/mol and about 50,000 g/mol and at least one cycloaliphatic (meth)acrylate. The coating compositions may also optionally include at least one photo-initiator, adhesion promoter, pigment, dye and/or plasticizer. The coating compositions may be hardened, after application, by curing by exposure to radiant energy, by exposure to electron beam radiation, by exposure to heat, by exposure to chemicals and combinations thereof. Upon hardening, the coating composition typically has two phases, a soft phase which has a Tg between ?50° C. and 0° C. and a hard phase which has a Tg between 60° C. and 120° C. Methods of using the coating compositions are also described.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: June 15, 2021
    Assignee: Arkema France
    Inventors: Jin Lu, Jinping Wu, Xiaoxing Dong
  • Patent number: 11011420
    Abstract: Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device includes a substrate having an opening that extends at least partially through the substrate. A conductive material having a positive coefficient of thermal expansion (CTE) partially fills the opening. A negative thermal expansion (NTE) having a negative CTE also partially fills the opening. In one embodiment, the conductive material includes copper and the NTE material includes zirconium tungstate.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: May 18, 2021
    Assignee: Micron Technology, Inc.
    Inventors: Hongqi Li, Anurag Jindal, Jin Lu, Shyam Ramalingam
  • Publication number: 20210111184
    Abstract: A method used in forming a memory array comprising strings of memory cells comprises forming a stack comprising vertically-alternating first tiers and second tiers. Horizontally-elongated trenches are formed into the stack to form laterally-spaced memory-block regions. A wall is formed in individual of the trenches laterally-between immediately-laterally-adjacent of the memory-block regions. The forming of the wall comprises lining sides of the trenches with insulative material comprising at least one of an insulative nitride and elemental-form boron. A core material is formed in the trenches to span laterally-between the at least one of the insulative nitride and the elemental-form boron. Structure independent of method is disclosed.
    Type: Application
    Filed: October 15, 2019
    Publication date: April 15, 2021
    Applicant: Micron Technology, Inc.
    Inventors: Cole Smith, Ramey M. Abdelrahaman, Silvia Borsari, Chris M. Carlson, David Daycock, Matthew J. King, Jin Lu
  • Patent number: 10847442
    Abstract: A semiconductor device in accordance with some embodiments includes a substrate structure and a conductive interconnect extending through at least a portion of the substrate structure. The conductive interconnect can include a through-silicon via and a stress-relief feature that accommodates thermal expansion and/or thermal contraction of material to manage internal stresses in the semiconductor device. Methods of manufacturing the semiconductor device in accordance with some embodiments includes removing material of the conductive interconnect to form the stress-relief gap.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: November 24, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Hongqi Li, Anurag Jindal, Jin Lu, Gowrisankar Damarla, Shyam Ramalingam
  • Patent number: 10795947
    Abstract: The disclosed embodiments include computerized methods, systems, and devices, including computer programs encoded on a computer storage medium, for generating terms of a search query based on a user's spoken utterances, identifying multiple cross-platform messages based on the generated terms, and to generating, via a presentation device, a single interface that enables the user to interact with identified messages. Based on a spoken utterance, the disclosed embodiments may determine user-specified search terms and/or criteria, and based on the user-specified search terms and/or criteria, may obtain cross-platform message data that corresponds to the search query. The communications device may generate one or more interface elements that describe corresponding ones of the cross-platform messages, which may be presented within a unified graphical user interface or voice-user interface by a communications device.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: October 6, 2020
    Assignee: GOOGLE LLC
    Inventors: Vinh Quoc Ly, Ahmet Onur Tekdas, Timo Mertens, Okan Kolak, Charles Randell Sievert, Christine Nguyen, Jin Lu
  • Patent number: 10740597
    Abstract: The present disclosure discloses a method and apparatus for acquiring information. The method comprises: acquiring images of a plurality of unregistered users, the unregistered users being users having no registered images belonging to the unregistered users in a face recognition system; calculating a maximum similarity corresponding to an image of each unregistered user, the maximum similarity being a maximum similarity among similarities between a face object in the image of the unregistered user and face objects in a plurality of registered images; and determining a similarity threshold corresponding to a preset condition based on the calculated maximum similarity corresponding to the image of the each unregistered user, the preset condition comprising a ratio of a number of images of the unregistered users with corresponding maximum similarities greater than the similarity threshold to a number of the images of the unregistered users being smaller than a ratio threshold.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: August 11, 2020
    Assignee: BAIDU ONLINE NETWORK TECHNOLOGY (BEIJING) CO., LTD.
    Inventors: Gang Zhang, Jin Lu
  • Publication number: 20200235007
    Abstract: Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device includes a substrate having an opening that extends at least partially through the substrate. A conductive material having a positive coefficient of thermal expansion (CTE) partially fills the opening. A negative thermal expansion (NTE) having a negative CTE also partially fills the opening. In one embodiment, the conductive material includes copper and the NTE material includes zirconium tungstate.
    Type: Application
    Filed: January 27, 2020
    Publication date: July 23, 2020
    Inventors: Hongqi Li, Anurag Jindal, Jin Lu, Shyam Ramalingam