Abstract: The disclosed embodiments include computerized methods, systems, and devices, including computer programs encoded on a computer storage medium, for generating terms of a search query based on a user's spoken utterances, identifying multiple cross-platform messages based on the generated terms, and to generating, via a presentation device, a single interface that enables the user to interact with identified messages. Based on a spoken utterance, the disclosed embodiments may determine user-specified search terms and/or criteria, and based on the user-specified search terms and/or criteria, may obtain cross-platform message data that corresponds to the search query. The communications device may generate one or more interface elements that describe corresponding ones of the cross-platform messages, which may be presented within a unified graphical user interface or voice-user interface by a communications device.

Abstract: The disclosed computer-implemented method for connecting Internet-connected devices to wireless access points may include (1) receiving, over the Internet from a client device at a server, a request to connect the client device to an access point that is secured by a passcode, (2) transmitting a verification-request message from the server to the access point and/or the client device that instructs the access point and/or the client device to perform an action that enables the physical proximity of a user of the client device to the access point to be verified, (3) receiving a verification-response message that indicates that the user of the client device has physical access to the access point, and (4) enabling the client device to connect to the access point by transmitting, from the server to the client device, the passcode. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: The disclosed computer-implemented method for managing computing device access to local area computer networks may include (i) receiving, at a router computing device, a request to connect a client computing device to a local area computer network, (ii) determining whether the client computing device has prior authorization to connect to the local area computer network, (iii) sending, when the client computing device is determined to not have prior authorization, a request to an administrator computing device for authorization to connect the client computing device to the local area computer network, (iv) receiving, from the administrator computing device, an instruction to allow the client computing device to connect or to block the client computing device from connecting, and (v) performing a security action to block or allow the client computing device's request based on the instruction. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: An electromagnetic component assembly includes a first magnetic core piece, a second magnetic core piece, and an inverted U-shaped conductive winding including a base section and first and second legs extending from base section. One of the first and second magnetic core pieces is configured to receive the base section. The first and second magnetic core pieces are gapped from one another to define a first gap, and one of the first and second magnetic core pieces includes a second gap that, in combination with the first gap, allows the component to be operated at more than one stable open circuit inductance (OCL) corresponding to different current loads.

Abstract: Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device includes a substrate having an opening that extends at least partially through the substrate. A conductive material having a positive coefficient of thermal expansion (CTE) partially fills the opening. A negative thermal expansion (NTE) having a negative CTE also partially fills the opening. In one embodiment, the conductive material includes copper and the NTE material includes zirconium tungstate.

Abstract: The disclosed computer-implemented method for tagging client devices may include (i) receiving from a router at least one network packet that indicates that a client device has attempted to connect to the router and that includes device information identifying the client device, (ii) prompting, automatically in response to receiving the network packet indicating that the client device has attempted to connect to the router, a user to tag the client device with a descriptive name to facilitate management of the client device, (iii) receiving, in response to prompting the user to tag the client device, a tag that indicates a specific descriptive name for the client device, and (iv) transmitting, automatically in response to receiving the tag, the specific descriptive name to at least one of the router and a cloud security server. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A nail polish composition, in particular nail polish formulation, is disclosed which is based on a specific solvent-free aqueous polyurethane polymer dispersion, which is derived from at least one isocyanate-terminated ethylenically unsaturated polyurethane pre-polymer in a reactive diluent, after a chain extension reaction with a chain extender bearing isocyanate-reactive groups. The polyurethane pre-polymer comprises at least one (meth)acrylate functional group and at least one isocyanate functional group.

Abstract: A multi-phase integrated power inductor component assembly includes a plurality of conductive windings on an integrated magnetic core structure accepting each of the plurality of conductive windings in a spaced apart, non-coupled arrangement with respect to one another. The integrated magnetic core structure includes a series of magnetic gaps each being respectively centered on one of the plurality of conductive windings. The windings include surface mount terminations for connection to a circuit board.

Abstract: Semiconductor device interconnect structures comprising nitrided barriers are disclosed herein. In one embodiment, an interconnect structure includes a conductive material at least partially filling an opening in a semiconductor substrate, and a nitrided barrier between the conductive material and a sidewall in the opening. The nitrided barrier comprises a nitride material and a barrier material, such as tantalum, between the nitride material and the sidewall of the substrate.

Abstract: A solvent-free aqueous curable polyurethane dispersion is derived from at least one isocyanate-terminated ethylenically unsaturated polyurethane pre-polymer in a reactive diluent. The polyurethane pre-polymer comprises at least one (meth)acrylate functional group and at least one isocyanate functional group. Methods for making a solvent-free aqueous polyurethane dispersion, curable compositions comprising the dispersion and resulting cured products are also disclosed.

Abstract: A three dimensional or stacked circuit device includes a conductive channel cap on a conductor channel. The channel cap can be created via selective deposition or other process to prevent polishing down the conductive material to isolate the contacts. The conductor channel extends through a deck of multiple tiers of circuit elements that are activated via a gate. The gate is activated by electrical potential in the conductor channel. The conductive cap on the conductor channel can electrically connect the conductor channel to a bitline or other signal line, and/or to another deck of multiple circuit elements.

Abstract: An ethylenically unsaturated polyurethane, which is an oligomer or polymer, results from the reaction of A) an alcohol component comprising: A1) at least one hydroxylated polydiene oligomer or polymer which may optionally be alkoxylated and A2) at least one hydroxyl-functional ethylenically unsaturated compound, which is a monomer or oligomer, bearing at least one ethylenic unsaturation and B) an isocyanate component comprising at least one polyisocyanate with a functionality of at least 2, wherein the molar ratio OH/NCO is greater than 1 and wherein said polyurethane bears reactive free hydroxyl groups. Such ethylenically unsaturated polyurethanes are useful as components of curable compositions such as coatings or adhesives.

Abstract: The present disclosure discloses a method and apparatus for acquiring information. The method comprises: acquiring images of a plurality of unregistered users, the unregistered users being users having no registered images belonging to the unregistered users in a face recognition system; calculating a maximum similarity corresponding to an image of each unregistered user, the maximum similarity being a maximum similarity among similarities between a face object in the image of the unregistered user and face objects in a plurality of registered images; and determining a similarity threshold corresponding to a preset condition based on the calculated maximum similarity corresponding to the image of the each unregistered user, the preset condition comprising a ratio of a number of images of the unregistered users with corresponding maximum similarities greater than the similarity threshold to a number of the images of the unregistered users being smaller than a ratio threshold.

Abstract: Apparatuses and methods are disclosed herein for densification of through substrate insulating liners. An example method may include forming a through substrate via through at least a portion of a substrate, forming a first liner layer in the through substrate via, and densifying the first liner layer. The example method may further include forming a second liner layer on the first liner layer, and densifying the second liner layer.

Abstract: Semiconductor device interconnect structures comprising nitrided barriers are disclosed herein. In one embodiment, an interconnect structure includes a conductive material at least partially filling an opening in a semiconductor substrate, and a nitrided barrier between the conductive material and a sidewall in the opening. The nitrided barrier comprises a nitride material and a barrier material, such as tantalum, between the nitride material and the sidewall of the substrate.

Abstract: Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device includes a substrate having an opening that extends at least partially through the substrate. A conductive material having a positive coefficient of thermal expansion (CTE) partially fills the opening. A negative thermal expansion (NTE) having a negative CTE also partially fills the opening. In one embodiment, the conductive material includes copper and the NTE material includes zirconium tungstate.

Abstract: Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device includes a substrate having an opening that extends at least partially through the substrate. A conductive material having a positive coefficient of thermal expansion (CTE) partially fills the opening. A negative thermal expansion (NTE) having a negative CTE also partially fills the opening. In one embodiment, the conductive material includes copper and the NTE material includes zirconium tungstate.

Abstract: Semiconductor device interconnect structures having low capacitance and associated systems and methods are disclosed herein. In one embodiment, a method of manufacturing an interconnect structure includes forming an opening in a surface of a semiconductor device and forming an interconnect structure at least within the opening. Forming the interconnect structure includes depositing a first insulator material on both the surface and a sidewall of the opening, selectively removing a first portion of the first insulator material on the surface over a second portion of the first insulator material on the sidewall, depositing a second insulator material on the second portion, and depositing a conductive material on the second insulator material. The method further includes selecting the thickness of the first and second insulators materials based on a threshold level of capacitance between the sidewall and the conductive material.

Abstract: Some embodiments include semiconductor constructions having first and second electrically conductive lines that intersect with one another at an intersection. The first line has primarily a first width, and has narrowed regions directly against the second line and on opposing sides of the second line from one another. Electrically conductive contacts are along the first line and directly electrically coupled to the first line, and one of the electrically conductive contacts is directly against the intersection. Some embodiments include methods of forming intersecting lines of material. First and second trenches are formed, and intersect with one another at an intersection. The first trench has primarily a first width, and has narrowed regions directly against the second trench and on opposing sides of the second trench from one another. Material is deposited within the first and second trenches to substantially entirely fill the first and second trenches.

Abstract: Pressure sensitive adhesive (PSA) compositions that include at least one urethane (meth)acrylate oligomer having a molecular weight between about 2,000 g/mol and about 50,000 g/mol and an OH number of from 0.01 mg KOH/g to 100 mg KOH/g, at least one mono (meth)acrylate functional monomer and at least one tackifying resin. The PSA systems may also optionally include other additives, such as at least one initiator system that includes at least one photo-initiator or free radical initiator. The PSA systems are liquid at a temperature of 25° C.±2° C. with a viscosity of 15,000 cPs or less and are adapted to form smooth, uniform coatings or films upon curing without the application of heat, whereby the resulting films have advantageous properties with respect to peel strength, tack and shear resistance. In embodiments, the PSA systems include less than 1 wt % of solvent and less than 1 wt % of water or are free of solvent and are free of water.