Abstract: A security monitoring system/method implementing distributed Internet-based environmental monitoring and control is disclosed. The system utilizes a smart gateway power controller (SGPC) configured for new/retrofit installation into electrical power distribution networks to allow controlled connection of an AC power source to a customer load device under direction of local or remote Internet direction. The SGPC may also be configured with sensors to detect motion, audio, video, visual images, smoke, carbon monoxide, carbon dioxide, light/darkness, and other environmental data. The SGPC may be configured using a local web-based graphical user interface (GUI) to relay collected sensor information to a remote web browser hosted on a remote computing device. The GUI may incorporate a configuration/setup interface allowing mapping of sensor data to information associated with the sensor location and triggered security reports to occur based on collected sensor data.

Abstract: Semiconductor device interconnect structures having low capacitance and associated systems and methods are disclosed herein. In one embodiment, a method of manufacturing an interconnect structure includes forming an opening in a surface of a semiconductor device and forming an interconnect structure at least within the opening. Forming the interconnect structure includes depositing a first insulator material on both the surface and a sidewall of the opening, selectively removing a first portion of the first insulator material on the surface over a second portion of the first insulator material on the sidewall, depositing a second insulator material on the second portion, and depositing a conductive material on the second insulator material. The method further includes selecting the thickness of the first and second insulators materials based on a threshold level of capacitance between the sidewall and the conductive material.

Abstract: A three dimensional or stacked circuit device includes a conductive channel cap on a conductor channel. The channel cap can be created via selective deposition or other process to prevent polishing down the conductive material to isolate the contacts. The conductor channel extends through a deck of multiple tiers of circuit elements that are activated via a gate. The gate is activated by electrical potential in the conductor channel. The conductive cap on the conductor channel can electrically connect the conductor channel to a bitline or other signal line, and/or to another deck of multiple circuit elements.

Abstract: A data dependent equalizer circuit includes a plurality of noise prediction filters. Respective ones of the noise prediction filters are configured to filter noise in sample data for at least one predetermined non-return to zero (NRZ) condition. A plurality of equalizers is communicatively coupled with the plurality of noise prediction filters. Respective ones of the plurality of equalizers are configured to yield equalized sample data that corresponds to the at least one predetermined NRZ condition for one or more of the noise prediction filters.

Abstract: A multi direction switch (100) includes a first cover (2), a second cover (3), a printed circuit board (PCB) (4) positioned between the first cover and the second cover, a pair of stacked, orthogonal electrode plates (5) positioned between the second cover and the PCB, a spring member (7) positioned between the first cover and the PCB, and a button (6) for actuating the electrode plates to move on the PCB. The second cover forms a protrusion (21), the button has a radial portion (611) and a wall portion (612) extending downwardly from the radial portion, and the spring member is positioned between the protrusion and the wall portion.

Abstract: Antibody expression vectors and plasmids can incorporate various antibody gene portions for transcription of the antibody DNA and expression of the antibody in an appropriate host cell. The expression vectors and plasmids have restriction enzyme sites that facilitate ligation of antibody-encoding DNA into the vectors. The vectors incorporate enhancer and promoter sequences that can be varied to interact with transcription factors in the host cell and thereby control transcription of the antibody-encoding DNA. A kit can incorporate these vectors and plasmids.

Abstract: Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device includes a substrate having an opening that extends at least partially through the substrate. A conductive material having a positive coefficient of thermal expansion (CTE) partially fills the opening. A negative thermal expansion (NTE) having a negative CTE also partially fills the opening. In one embodiment, the conductive material includes copper and the NTE material includes zirconium tungstate.

Abstract: Exemplary embodiments of the present invention are directed towards a method for fabricating a semiconductor memory device comprising selectively depositing a material to form a cap above a recessed cell structure in order to prevent degradation of components inside the cell structure in oxidative or corrosive environments.

Abstract: A method of forming a planar surface for a semiconductor device structure. The method comprises forming a particle film comprising a plurality of discrete particles on a non-planar surface of a semiconductor device structure. The semiconductor device structure is subjected to at least one chemical-mechanical polishing process after forming the particle film on the non-planar surface of the semiconductor device structure. Methods of forming a semiconductor device structure are also described.

Abstract: Systems, methods, devices, circuits for data processing, and more particularly to systems and methods for processing servo data using two or more sensing heads.

Abstract: Systems, methods, devices, circuits for data processing, and more particularly to systems and methods for processing servo data using two or more sensing heads.

Abstract: Systems, methods, devices, circuits for data processing, and more particularly to systems and methods for determining a down track distance between two or more read heads on a read/write head assembly.

Abstract: A semiconductor device in accordance with some embodiments includes a substrate structure and a conductive interconnect extending through at least a portion of the substrate structure. The conductive interconnect can include a through-silicon via and a stress-relief feature that accommodates thermal expansion and/or thermal contraction of material to manage internal stresses in the semiconductor device. Methods of manufacturing the semiconductor device in accordance with some embodiments includes removing material of the conductive interconnect to form the stress-relief gap.

Abstract: A method and apparatus for rapid replication of deduplicated file system data is described. The method may include initiating replication of a file from a source deduplication system to a destination deduplication system, and transferring deduplication metadata for each block of the file from the source deduplication system to the destination deduplication system. The method may also include transferring an identifier file from the source deduplication system to the destination deduplication system that includes a block number corresponding to a block of the file and a unique identifier value generated from the block of the file. The method may also include receiving a data request file from the destination deduplication system, and transferring the blocks of data identified in the data request file to complete replication of the file on the destination deduplication system.

Abstract: Semiconductor devices having interconnects incorporating negative expansion (NTE) materials are disclosed herein. In one embodiment a semiconductor device includes a substrate having an opening that extends at least partially through the substrate. A conductive material having a positive coefficient of thermal expansion (CTE) partially fills the opening. A negative thermal expansion (NTE) having a negative CTE also partially fills the opening. In one embodiment, the conductive material includes copper and the NTE material includes zirconium tungstate.

Abstract: Systems, methods, devices, circuits for data processing, and more particularly to systems and methods for determining a down track distance between two or more read heads on a read/write head assembly.

Abstract: Described and claimed herein are combinatorial synthetic Fab libraries displayed on a phage pIX protein. The libraries were built on scaffolds representing the most frequently used genes in human antibodies, which were diversified to mirror the variability of natural antibodies. After selection using a diverse panel of proteins, numerous specific and high-affinity Fabs were isolated. By a process called in-line maturation the affinity of some antibodies was improved up to one hundred-fold yielding low pM binders suitable for in vivo use. This work thus demonstrates the feasibility of displaying complex Fab libraries as pIX-fusion proteins for antibody discovery and lays the foundations for studies on the structure-function relationship of antibodies.

Abstract: Antibody expression vectors and plasmids can incorporate various antibody gene portions for transcription of the antibody DNA and expression of the antibody in an appropriate host cell. The expression vectors and plasmids have restriction enzyme sites that facilitate ligation of antibody-encoding DNA into the vectors. The vectors incorporate enhancer and promoter sequences that can be varied to interact with transcription factors in the host cell and thereby control transcription of the antibody-encoding DNA. A kit can incorporate these vectors and plasmids.

Abstract: Antibody expression vectors and plasmids can incorporate various antibody gene portions for transcription of the antibody DNA and expression of the antibody in an appropriate host cell. The expression vectors and plasmids have restriction enzyme sites that facilitate ligation of antibody-encoding DNA into the vectors. The vectors incorporate enhancer and promoter sequences that can be varied to interact with transcription factors in the host cell and thereby control transcription of the antibody-encoding DNA. A kit can incorporate these vectors and plasmids.

Abstract: Some embodiments include semiconductor constructions having first and second electrically conductive lines that intersect with one another at an intersection. The first line has primarily a first width, and has narrowed regions directly against the second line and on opposing sides of the second line from one another. Electrically conductive contacts are along the first line and directly electrically coupled to the first line, and one of the electrically conductive contacts is directly against the intersection. Some embodiments include methods of forming intersecting lines of material. First and second trenches are formed, and intersect with one another at an intersection. The first trench has primarily a first width, and has narrowed regions directly against the second trench and on opposing sides of the second trench from one another. Material is deposited within the first and second trenches to substantially entirely fill the first and second trenches.