Patents by Inventor Jin-won Lee

Jin-won Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10868036
    Abstract: Provided herein may be a method of manufacturing a semiconductor device including the step of replacing sacrificial layers of a stack with line patterns through slits that pass through the stack and have different depths.
    Type: Grant
    Filed: May 9, 2019
    Date of Patent: December 15, 2020
    Assignee: SK hynix Inc.
    Inventor: Jin Won Lee
  • Patent number: 10861783
    Abstract: A printed circuit board includes an insulating layer having a first surface and a second surface opposing the first surface; and a first wiring including a first line pattern disposed on the first surface of the insulating layer, and a plurality of first protruding patterns penetrating a portion of the insulating layer from the first surface and connected to the first line pattern, respectively, such that the plurality of first protruding patterns overlap the first line pattern in a plan view of the printed circuit board.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: December 8, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Soo Kim, Eun Young Hwang, Jin Won Lee
  • Publication number: 20200328207
    Abstract: A semiconductor device including a plurality of active regions extending in a first direction on a substrate; a device isolation layer between the plurality of active regions such that upper portions of the plurality of active regions protrude from the device isolation layer; a first gate electrode and a second gate electrode extending in a second direction crossing the first direction and intersecting the plurality of active regions, respectively, on the substrate, the first gate electrode being spaced apart from the second gate electrode in the second direction; a first gate separation layer between the first gate electrode and the second gate electrode; and a second gate separation layer under the first gate separation layer and between the first gate electrode and the second gate electrode, the second gate separation layer extending into the device isolation layer in a third direction crossing the first direction and the second direction.
    Type: Application
    Filed: January 10, 2020
    Publication date: October 15, 2020
    Inventors: Seung Soo HONG, Jeong Yun LEE, Geum Jung SEONG, Jin Won LEE, Hyun Ho JUNG
  • Publication number: 20200318723
    Abstract: The present disclosure relates to a composition for a worm wheel having excellent durability and wear resistance and a worm wheel manufactured using the same. In one embodiment, the composition for a worm wheel includes a polyamide resin, wherein the polyamide resin includes a polyamide 66 resin having a relative viscosity (RV) of about 2.5 or higher and a polyamide 12 resin having a relative viscosity (RV) of about 1.0 or higher.
    Type: Application
    Filed: April 3, 2020
    Publication date: October 8, 2020
    Inventors: Jin Won LEE, Yeong Ah CHEON, Woo Jeong OH, Jae Kyung YANG, Jae Wha KIM, Soo Min KIM, Min Han KWAK, Sang Rock LEE
  • Patent number: 10796972
    Abstract: A display panel includes first and second test lines connected to the each of data lines, extending in the second direction, and arranged in the first direction, a first test pad electrically connected to the first test line, the first test pad and the first test line being formed from a same layer, and a second test pad electrically connected to the second test line through a contact hole formed through a first insulation layer and disposed adjacent to the first test pad in the second direction.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: October 6, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Ji-Yun Hong, Joon-Geol Kim, Jin-Won Lee, Ki-Won Kim
  • Publication number: 20200308392
    Abstract: The present disclosure relates to a composition for a worm wheel having excellent durability and moisture absorption resistance and a worm wheel manufactured using the same. In one embodiment, the composition for a worm wheel includes about 30 wt % to about 70 wt % of a polyketone copolymer and about 30 wt % to about 70 wt % of a polyamide resin, and the composition for a worm wheel has a friction coefficient of about 0.3 or less as measured in accordance with JIS K7218, an abrasion loss of about 0.002 g or less as measured in accordance with JIS K7218, and a moisture absorption rate of about 4% or less as measured in accordance with ASTM D570 (23° C. and 50 RH %).
    Type: Application
    Filed: March 26, 2020
    Publication date: October 1, 2020
    Inventors: Jin Won LEE, Yeong Ah CHEON, Woo Jeong OH, Seong Hwan KIM, Sung Kyoun YOON, Joong In KIM, Soo Ho SUNG, Jae Woo PARK
  • Patent number: 10784517
    Abstract: A device for manufacturing a membrane-electrode assembly for a fuel cell may include top and bottom side bonding rolls respectively disposed above and below a transfer path through which an electrolyte membrane and top and bottom electrode films transferred with a predetermined line speed, one of the top side and bottom side bonding rolls provided reciprocally movable in a vertical direction through a first driving source, and transfer anode and cathode catalyst electrode layers of the top and bottom electrode films to top and bottom sides of the electrolyte membrane while compressing the top and bottom electrode films; film rewinders provided above and below the transfer path to rewind the top and bottom electrode films; and a compulsive driving roll provided in a rewinding path of an electrode film rewound by one of the film rewinders and selectively compulsively feeding the electrode film with a predetermined driving speed.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: September 22, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventor: Jin Won Lee
  • Patent number: 10732694
    Abstract: A method of operating a shared resource in a mobile device includes extracting a set of features from a plurality of subsystems of the mobile device. The set of features may be extracted from each subsystem of the plurality of subsystems requesting services from one or more shared resources of the mobile device. One or more parameter of the shared resource(s) may be determined based on the extracted set of features from the plurality of subsystems. The shared resource(s) may be operated based on the determined parameter(s).
    Type: Grant
    Filed: September 22, 2017
    Date of Patent: August 4, 2020
    Assignee: Qualcomm Incorporated
    Inventors: Shankar Sadasivam, Jin Won Lee
  • Publication number: 20200170102
    Abstract: A printed circuit board includes: a first insulating layer; and a heat radiating circuit pattern disposed on a first surface of the first insulating layer and having a pad and a via. The heat radiating circuit pattern includes: a first metal layer disposed on the first insulating layer; a graphite layer disposed on the first metal layer; and a second metal layer disposed on the graphite layer.
    Type: Application
    Filed: October 25, 2019
    Publication date: May 28, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: A-ran LEE, Kee-Ju UM, Ju-Ho KIM, Myeong-Hui JUNG, Kyuong-Hwan LIM, Jin-Won LEE, Seung-On KANG, Jong-Guk KIM
  • Publication number: 20200161327
    Abstract: Provided herein are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes an etch stop pattern having a top surface and a sidewall disposed over a gate stack having interlayer insulating layers alternately stacked with conductive patterns. The semiconductor device also includes a plurality of channel structures passing through the etch stop pattern and the gate stack. The semiconductor device further includes an insulating layer extending to cover the top surface and the sidewall of the etch stop pattern, wherein a depression is included in a sidewall of the insulating layer. The semiconductor device additionally includes a contact plug passing through the insulating layer so that the contact plug is coupled to a channel structure of the plurality of channel structures.
    Type: Application
    Filed: August 6, 2019
    Publication date: May 21, 2020
    Applicant: SK hynix Inc.
    Inventor: Jin Won LEE
  • Publication number: 20200153015
    Abstract: A manufacturing apparatus of a membrane-electrode assembly for a fuel cell includes: an electrode film sheet supply unit supplying a first electrode film sheet including a first electrode film coated with an anode layer and a second electrode film sheet including a second electrode film coated with a cathode layer; an electrolyte membrane sheet supply unit supplying the electrolyte membrane between the anode layer of the first electrode film sheet and the cathode layer of the second electrode film sheet; a drive bonding roll rotatable by an operation of a first driver; and a driven bonding roll movable closer to or farther apart from the drive bonding roll and pressing the electrolyte membrane and the first and second electrode film sheets with the drive bonding roll. In particular, an engraved portion and an embossing portion are alternately formed on a circumference of the drive bonding roll.
    Type: Application
    Filed: May 29, 2019
    Publication date: May 14, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Jin Won LEE
  • Publication number: 20200131214
    Abstract: The present invention relates to nanoparticles including a crystal structure-controlled zeolitic imidazolate framework (ZIF) and a method of producing the same. Nanoparticles according to the present invention comprise: metal ions; and an organic ligand coupled to the metal ions, wherein the organic ligand includes an imidazolate-based organic ligand and an alkylamine-based organic ligand.
    Type: Application
    Filed: October 22, 2019
    Publication date: April 30, 2020
    Inventors: Jong Suk Lee, Kie Yong Cho, Jin Won Lee, Byung Keun Oh, Jeong Geol Na, He Seong An, Ju Ho Shin
  • Publication number: 20200135754
    Abstract: Provided herein may be a method of manufacturing a semiconductor device including the step of replacing sacrificial layers of a stack with line patterns through slits that pass through the stack and have different depths.
    Type: Application
    Filed: May 9, 2019
    Publication date: April 30, 2020
    Applicant: SK hynix Inc.
    Inventor: Jin Won LEE
  • Publication number: 20200135179
    Abstract: Various embodiments include methods and devices for implementing automatic grammar augmentation for improving voice command recognition accuracy in systems with a small footprint acoustic model. Alternative expressions that may capture acoustic model decoding variations may be added to a grammar set. An acoustic model-specific statistical pronunciation dictionary may be derived by running the acoustic model through a large general speech dataset and constructing a command-specific candidate set containing potential grammar expressions. Greedy based and cross-entropy-method (CEM) based algorithms may be utilized to search the candidate set for augmentations with improved recognition accuracy.
    Type: Application
    Filed: October 28, 2019
    Publication date: April 30, 2020
    Inventors: Yang Yang, Anusha Lalitha, Jin Won Lee, Christopher Lott
  • Publication number: 20200122095
    Abstract: The present invention relates to a hybrid membrane mixed with nanoparticles including a zeolitic imidazolate framework (ZIF), and a gas separation method using the same. A hybrid membrane according to the present invention comprises a polymer matrix, and nanoparticles which are dispersed in the polymer matrix and include the ZIF.
    Type: Application
    Filed: October 22, 2019
    Publication date: April 23, 2020
    Inventors: Jong Suk LEE, Kie Yong CHO, Jin Won LEE, Byung Keun OH, Jeong Geol NA, He Seong AN
  • Publication number: 20200118959
    Abstract: A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection structure and having a plurality of first and second openings exposing, respectively, first and second regions of the redistribution layer; and a plurality of underbump metal bumps connected to the first region of the redistribution layer through the plurality of first openings, respectively.
    Type: Application
    Filed: September 4, 2019
    Publication date: April 16, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Soo KIM, Pyung Hwa HAN, Sung Hawn BAE, Jin Won LEE
  • Patent number: 10611797
    Abstract: A peptide binding to transcription factor CP2c, having an activity of preventing and treating cancer and represented by SEQ ID NO: 1: Asn-Tyr-Pro-Gln-Arg-Pro, and a pharmaceutical composition and a dietary supplement composition for preventing and treating cancer, both of which contain the same as an active ingredient are disclosed. When cancer cells are treated with the peptide and the pharmaceutical composition containing the same, the peptide can specifically bind to CP2c by passing, with very high stability, through the cell membrane and can inhibit the DNA binding ability of CP2c, thereby disturbing CP2c-mediated cancer cell-specific transcriptional activity through the inhibition of CP2c activity. Thus, the peptide and pharmaceutical composition containing the same can be effectively used for specifically treating only cancer cells and can be utilized for cancer prevention and as a dietary supplement additive therefor.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: April 7, 2020
    Assignee: IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)
    Inventors: Chul Geun Kim, Min Young Kim, Chan Gil Kim, Ho Chul Kang, Ji Hyung Chae, Su Jae Lee, Eun Jung Baek, Chae Ok Yun, Jin Won Lee, Young Su Lim, Je Min Choi, Dae Hyun Ha, Hyung Sik Won, Seung Han Son
  • Publication number: 20200083179
    Abstract: A substrate having an embedded interconnect structure includes an interconnect structure including a circuit member including circuit layers and a passive device disposed in parallel with the circuit member and including an external electrode, and a printed circuit board including an insulating layer covering the interconnect structure, a first wiring layer disposed on the insulating layer, a first wiring via penetrating through at least a portion of the insulating layer and electrically connecting the first wiring layer to an uppermost circuit layer, among the circuit layers, and a second wiring via penetrating through at least a portion of the insulating layer and electrically connecting the first wiring layer to the external electrode of the passive device. A top surface of the uppermost circuit layer, contacting the first wiring via, is coplanar with a top surface of the external electrode, contacting the second wiring via.
    Type: Application
    Filed: November 28, 2018
    Publication date: March 12, 2020
    Inventors: Doo Hwan LEE, Yong Hoon KIM, Tae Je CHO, Jin Won LEE
  • Publication number: 20200035702
    Abstract: A semiconductor device includes a source structure penetrated by a first penetrating portion, a first stack structure disposed on the source structure and penetrated by a second penetrating portion overlapping the first penetrating portion.
    Type: Application
    Filed: March 12, 2019
    Publication date: January 30, 2020
    Applicant: SK hynix Inc.
    Inventors: Jin Won LEE, Nam Jae LEE
  • Patent number: 10506990
    Abstract: Aspects of the subject matter described in this disclosure can be implemented in a fall detection device and method. One or more motion sensors can access a user's acceleration data. The acceleration data can be segmented using a segmentation algorithm to identify a potential fall event. The segmentation algorithm can determine a cumulative sum of the acceleration data, where the cumulative sum is based on acceleration values being greater than or less than an acceleration threshold value, and a potential fall event can be identified where the cumulative sum is greater than a cumulative sum threshold value. Statistical features can be extracted from the segmented acceleration data and aggregated, and a determination can be made as to whether the potential fall event is a fall event based at least in part on the statistical features.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: December 17, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Jin Won Lee, Xinzhou Wu, Rashid Ahmed Akbar Attar, Feng Han