Patents by Inventor Jin-won Lee

Jin-won Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210328245
    Abstract: A manufacturing apparatus of a membrane-electrode assembly for a fuel cell includes: an electrode film sheet unwinder for supplying upper and lower electrode film sheets having upper and lower electrode films with anode and cathode layers along a predetermined transfer path, an electrolyte membrane sheet unwinder that supplies an electrolyte membrane sheet, a driving bonding roll that has an engraved portion and an embossing portion, a driven bonding roll that is to be moved in the vertical direction toward the driving bonding roll, a film rewinder that recovers, by winding, the upper and lower electrode films, and a position aligning unit that aligns the positions of the anode layer and the cathode layer while switching the running directions of the upper and lower electrode film sheets and the upper and lower electrode films.
    Type: Application
    Filed: November 20, 2020
    Publication date: October 21, 2021
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Jin Won Lee
  • Publication number: 20210302002
    Abstract: Provided is a ventilation member for a vehicle lamp. The ventilation member includes a nanofiber membrane, a composite adhesive layer stacked on one surface of the nanofiber membrane, and a ventilation structure provided in a central portion of the composite adhesive layer and in contact with the nanofiber membrane. The composite adhesive layer includes an acrylic adhesive layer in contact with the nanofiber membrane and a silicone-based adhesive layer provided on one surface of the acrylic adhesive layer. The acrylic adhesive layer is in contact with the nanofiber membrane, the acrylic adhesive layer is infiltrated into the nanofiber membrane to a depth of 30 ?m or more. The ventilation member for a vehicle lamp has a water pressure resistance of 1.0 bar or more.
    Type: Application
    Filed: March 25, 2021
    Publication date: September 30, 2021
    Applicants: HYUNDAI MOBIS CO., LTD., AMOGREENTECH CO., LTD.
    Inventors: Jin Won LEE, Young Ho LEE, Jun Keun CHO, Kyoung Taek PARK, Hyoung Joo KIM, Sang Yeop SHIM, Sung Pil CHO
  • Publication number: 20210302005
    Abstract: An air permeable cap for a vehicle may include: a cover part formed in a cylindrical shape with a closed end part, and having a plurality of guide ribs radially formed on an inner circumferential surface thereof; a foam part inserted and installed in the cover part so as to be contacted with the guide ribs, and having a ventilation hole formed on one side thereof; a membrane part installed between the foam part and the cover part, and configured to block a flow of water through the ventilation hole and allow a flow of air through the ventilation hole; and an adhesion retention part coupled in a concave-convex shape to retain an adhesion force between the foam part and the cover part.
    Type: Application
    Filed: March 26, 2021
    Publication date: September 30, 2021
    Applicants: HYUNDAI MOBIS CO., LTD., AMOGREENTECH CO., LTD.
    Inventors: Jin Won LEE, Young Ho LEE, Jun Keun CHO, Kyoung Taek PARK, Hyoung Joo KIM, Sang Yeop SHIM, Sung Pil CHO
  • Publication number: 20210290118
    Abstract: An apparatus for controlling operations of a continuous glucose monitoring system. When a continuous glucose monitoring system is located within a certain distance from a user terminal, power of a battery is supplied to the continuous glucose monitoring system through a power switch switched on by an enable signal generated by a near field communication module, thereby operating the continuous glucose monitoring system without user intervention. The near field communication module provides connection information to the user terminal, thereby automatically performing a pairing connection with the user terminal using the near field communication module and a bluetooth communication module. When the pairing connection with the user terminal is completed, an enable signal generated by the bluetooth communication module is provided to the power switch, thereby maintaining the pairing connection with the user terminal even when the user terminal is outside of range for near field communication.
    Type: Application
    Filed: June 21, 2019
    Publication date: September 23, 2021
    Inventors: Jin Won LEE, Choong Beom YOU, Hyo Seon PARK, Ha Na LEE
  • Publication number: 20210289629
    Abstract: A substrate structure includes a first printed circuit board having a first side and a second side opposing each other, and a plurality of passive components connected to the first side of the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components of the plurality of first passive components and a smallest distance between adjacent second passive components of the plurality of second passive components. An electronic device includes a first printed circuit board disposed on a mainboard and having, on opposite sides thereof, a semiconductor chip and a plurality of passive components.
    Type: Application
    Filed: June 16, 2020
    Publication date: September 16, 2021
    Inventors: Seung Eun LEE, Yong Hoon KIM, Jin Won LEE
  • Patent number: 11114454
    Abstract: A semiconductor device includes a source structure penetrated by a first penetrating portion, a first stack structure disposed on the source structure and penetrated by a second penetrating portion overlapping the first penetrating portion.
    Type: Grant
    Filed: March 12, 2019
    Date of Patent: September 7, 2021
    Assignee: SK hynix Inc.
    Inventors: Jin Won Lee, Nam Jae Lee
  • Patent number: 11094955
    Abstract: A manufacturing apparatus of a membrane-electrode assembly for a fuel cell includes: an electrode film sheet supply unit supplying a first electrode film sheet including a first electrode film coated with an anode layer and a second electrode film sheet including a second electrode film coated with a cathode layer; an electrolyte membrane sheet supply unit supplying the electrolyte membrane between the anode layer of the first electrode film sheet and the cathode layer of the second electrode film sheet; a drive bonding roll rotatable by an operation of a first driver; and a driven bonding roll movable closer to or farther apart from the drive bonding roll and pressing the electrolyte membrane and the first and second electrode film sheets with the drive bonding roll. In particular, an engraved portion and an embossing portion are alternately formed on a circumference of the drive bonding roll.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: August 17, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Jin Won Lee
  • Patent number: 11094660
    Abstract: A semiconductor package includes: a connection structure having first and second surfaces opposing each other and including a redistribution layer; a semiconductor chip disposed on the first surface of the connection structure and having connection pads connected to the redistribution layer; an encapsulant disposed on the first surface of the connection structure and encapsulating the semiconductor chip; a passivation layer disposed on the second surface of the connection structure and having a plurality of first and second openings exposing, respectively, first and second regions of the redistribution layer; and a plurality of underbump metal layers connected to the first region of the redistribution layer through the plurality of first openings, respectively.
    Type: Grant
    Filed: September 4, 2019
    Date of Patent: August 17, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Soo Kim, Pyung Hwa Han, Sung Hawn Bae, Jin Won Lee
  • Patent number: 11075156
    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: July 27, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Jung Byun, Yong Duk Lee, Chang Hwa Park, Ki Ho Na, Je Sang Park, Jin Won Lee
  • Publication number: 20210193580
    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and core wiring layers and having a cavity penetrating through a portion of the first insulating body, an electronic component disposed in the cavity, an insulating material covering at least a portion of each of the core structure and the electronic component and disposed in at least a portion of the cavity, a wiring layer disposed on the insulating material, and a build-up structure disposed on the insulating material and including a second insulating body and a build-up wiring layer. A material of the first insulating body has a coefficient of thermal expansion (CTE) less than a CTE of the second insulating body, and the insulating material has a CTE less than a CTE of a material of the second insulating body.
    Type: Application
    Filed: March 13, 2020
    Publication date: June 24, 2021
    Inventors: Dae Jung BYUN, Chang Hwa PARK, Sang Ho JEONG, Ki Ho NA, Je Sang PARK, Yong Duk LEE, Jin Won LEE
  • Publication number: 20210193563
    Abstract: A substrate having an electronic component embedded therein includes a core structure including a first insulating body and first wiring layers and having a cavity, an electronic component embedded in the cavity, a build-up structure including a second insulating body, covering at least a portion of each of the core structure and the electronic component and filling a portion of the cavity, and second wiring layers, a first passivation layer disposed on a side of the core structure opposing a side of the core structure on which the build-up structure is disposed, and a second passivation layer disposed on a side of the build-up structure opposing a side of the build-up structure on which the core structure is disposed, wherein the first and second passivation layers include different types of materials.
    Type: Application
    Filed: March 3, 2020
    Publication date: June 24, 2021
    Inventors: Dae Jung Byun, Yong Duk Lee, Chang Hwa Park, Ki Ho Na, Je Sang Park, Jin Won Lee
  • Publication number: 20210182684
    Abstract: A method performed by a computing device includes determining a partition for depth-first processing by a multi-layer artificial neural network (ANN) of the computing device. The computing device comprising a processor, on-chip memory, and off-chip memory. The first partition determined based on an amount of on-chip memory used by the first partition, an available amount of on-chip memory, and a size of a write back to the off-chip memory. The method also includes processing, at the device via the multi-layer ANN, an input, using the depth-first processing in accordance with the partition.
    Type: Application
    Filed: December 14, 2020
    Publication date: June 17, 2021
    Inventors: Piero ZAPPI, Jin Won LEE, Christopher LOTT, Rexford Alan HILL
  • Publication number: 20210183774
    Abstract: A substrate embedded electronic component package includes a core member having a cavity in which a metal layer is disposed on a bottom surface thereof, an electronic component disposed in the cavity, an encapsulant filling at least a portion of the cavity and covering at least a portion of each of the core member and the electronic component, and a connection structure disposed on the encapsulant and including a first wiring layer connected to the electronic component. A wall surface of the cavity has at least one groove portion protruding outwardly from a center of the cavity, and the groove portion extends to a same depth in the core member as a depth of the cavity.
    Type: Application
    Filed: March 10, 2020
    Publication date: June 17, 2021
    Inventors: Dae Jung BYUN, Chang Hwa PARK, Sang Ho JEONG, Je Sang PARK, Mi Sun HWANG, Yong Duk LEE, Jin Won LEE, Yeo Il PARK
  • Publication number: 20210185822
    Abstract: An electronic component-embedded substrate includes a first wiring layer, a first electronic component disposed on the first wiring layer, a first insulating material covering at least a portion of each of the first wiring layer and the first electronic component, a second wiring layer disposed on the first insulating material, a second electronic component disposed on the second wiring layer and connected to the first electronic component in an electrical parallel connection, a second insulating material disposed on the first insulating material and covering at least a portion of each of the second wiring layer and the second electronic component, and a first via penetrating through the first insulating material and connecting the first electronic component and the second wiring layer.
    Type: Application
    Filed: March 5, 2020
    Publication date: June 17, 2021
    Inventors: Seung Eun Lee, Jin Won Lee, Yong Hoon Kim
  • Publication number: 20210171763
    Abstract: The present disclosure relates to a composition for a rack housing member of a vehicle having excellent dimensional stability, and a rack housing member of a vehicle formed therefrom. In an embodiment, the composition for a rack housing member of a vehicle comprises 100 parts by weight of a base resin containing polybutylene terephthalate, an acrylonitrile-styrene-acrylate copolymer, and polyethylene terephthalate, and 40 to 75 parts by weight of an inorganic filler, wherein the inorganic filler includes a glass fiber and a plate-shaped mineral filler.
    Type: Application
    Filed: December 4, 2020
    Publication date: June 10, 2021
    Inventors: Jin Won LEE, Jeong Jae PARK, Yeong Ah CHEON, Sang Ho BANG, Seung Soo HONG, Dong Chang LEE
  • Publication number: 20210158166
    Abstract: A method for pruning weights of an artificial neural network based on a learned threshold includes designating a group of pre-trained weights of an artificial neural network to be evaluated for pruning. The method also includes determining a norm of the group of pre-trained weights, and performing a process based on the norm to determine whether to prune the entire group of pre-trained weights.
    Type: Application
    Filed: February 4, 2021
    Publication date: May 27, 2021
    Inventors: Kambiz AZARIAN YAZDI, Tijmen Pieter Frederik BLANKEVOORT, Jin Won LEE, Yash Sanjay BHALGAT
  • Patent number: 10983414
    Abstract: A camera module includes a lens unit including one or more lenses, wherein at least some of the one or more lenses are movable along a path corresponding to optical axes of the one or more lenses, and a driving unit to move the at least some lenses along the path. The driving unit includes a magnet physically connected with the at least some lenses, a coil to form a magnetic field such that the magnet moves along the path, and a magnetic substance disposed on one surface of the coil opposite to another surface of the coil, which is adjacent to the magnet. The magnetic substance adapts the at least some lenses, which are physically connected with the magnet, to a specified position of the path by using magnetic force between the magnet and the magnetic substance, which is formed as the coil approaches the magnet.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: April 20, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwang Seok Byon, Jae Mu Yun, Young Jae Hwang, Jin Won Lee
  • Publication number: 20210110268
    Abstract: A method for pruning weights of an artificial neural network based on a learned threshold includes determining a pruning threshold for pruning a first set of pre-trained weights of multiple pre-trained weights based on a function of a classification loss and a regularization loss. The first set of pre-trained weights is pruned in response to a first value of each pretrained weight in the first set of pre-trained weights being greater than the pruning threshold. A second set of pre-trained weights of the multiple pre-trained weights is fine-tuned or adjusted in response to a second value of each pre-trained weight in the second set of pre-trained weights being greater than the pruning threshold.
    Type: Application
    Filed: October 9, 2020
    Publication date: April 15, 2021
    Inventors: Kambiz AZARIAN YAZDI, Tijmen Pieter Frederik BLANKEVOORT, Jin Won LEE, Yash Sanjay BHALGAT
  • Publication number: 20210085225
    Abstract: The present invention relates to a method for managing biometric information and, more specifically, to a method for managing biometric information capable of preventing a use of a sensor module of which an expiration date has expired or a defective sensor module, by determining the validity of a sensor module of a continuous biometric information measuring device on the basis of the generation date of sensor usage information or production lot information received from the continuous biometric information measuring device, and preventing re-use or shared use of the sensor module on the basis of user information provided in a measurement message received from the continuous biometric information measuring device.
    Type: Application
    Filed: January 24, 2019
    Publication date: March 25, 2021
    Inventors: Jeong Je PARK, Jin Won LEE, Ji Seon NAH, Hyo Seon PARK, Jin Ho KIM
  • Publication number: 20210028104
    Abstract: There are provided a semiconductor memory device and a manufacturing method of the semiconductor memory device. A semiconductor memory device includes a lower stack structure on the substrate and including a plurality of lower layers stacked in a vertical direction, an intermediate stack structure on the lower stack structure and including a plurality of intermediate layers stacked in the vertical direction, a plurality of grooves in the contact region and penetrating the intermediate stack structure, the plurality of grooves exposing the lower stack structure at different depths, and a plurality of steps formed along sidewalls of the grooves.
    Type: Application
    Filed: November 21, 2019
    Publication date: January 28, 2021
    Applicant: SK hynix Inc.
    Inventors: Jin Won LEE, Nam Jae LEE