Patents by Inventor Jin-Woo Park

Jin-Woo Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10963014
    Abstract: A flexible display device is disclosed. The flexible display device includes a first body, a second body, a roller, and a flexible display. The flexible display includes a first region forming a plane surface and a second region of which a portion forms a curved surface around the roller. A plurality of engagement protrusions are formed on an outer circumferential surface of the roller, and a plurality of support bars are coupled to an inner surface of the second region. The engagement protrusions engage the support bars. When the second body moves relative to the first body, the roller rotates with the engagement protrusions engaging the support bars, and the second region is uniformly deformed and moves.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: March 30, 2021
    Assignee: LG ELECTRONICS INC.
    Inventors: Jin Woo Park, Ara Kim, Hang Seok Kim
  • Patent number: 10963109
    Abstract: The present application relates to a conductive structure body and a method for manufacturing the same. A conductive structure body according to an exemplary embodiment of the present application comprises a substrate; a metal layer provided on the substrate; and a light reflection reducing layer provided on at least one surface of the metal layer and comprising copper-manganese-nickel oxide.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: March 30, 2021
    Assignee: LG CHEM LTD.
    Inventors: Junghwan Yoon, Doohoon Song, Song Ho Jang, Jin Woo Park, Ki-Hwan Kim
  • Patent number: 10956764
    Abstract: An electronic device according to various embodiments of the present invention comprises: a display panel; a biometric sensor module disposed on the back surface of the display panel; a processor electrically connected to the display panel and the biometric sensor module, and configured to acquire biometric information by using the biometric sensor module; a first adhesive member filling the gap formed between the back surface of the display panel and the biometric sensor module; and a second adhesive member applied on the first adhesive member, wherein the biometric sensor module can be attached to the back surface of the display panel by using the second adhesive member. In addition, other embodiments are possible.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: March 23, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo Han Kim, Jin Man Kim, Byung Kyu Kim, Jin Woo Park, Young Bae Sim, Yeun Wook Lim
  • Patent number: 10950521
    Abstract: Provided are a thermal interface material layer and a package-on-package device including the same. The package-on-package device may include a thermal interface material layer interposed between lower and upper semiconductor packages and configured to have a specific physical property. Accordingly, it is possible to prevent a crack from occurring in a lower semiconductor chip, when a solder ball joint process is performed to mount the upper semiconductor package on the lower semiconductor package.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: March 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Ok Na, Jongkook Kim, Hyo-Chang Ryu, Jin-woo Park, BongJin Son, Jangwoo Lee
  • Patent number: 10950177
    Abstract: A display device may include a first pixel coupled to an emission control line, and an emission control stage for selectively coupling the emission control line to a first or second supply voltage line. The emission control stage may include: a first emission control transistor including a first electrode coupled to the first supply voltage line, a second electrode coupled to the emission control line, and a main gate electrode coupled to a first node; a second emission control transistor including a first electrode coupled to the emission control line, a second electrode coupled to the second supply voltage line, and a main gate electrode coupled to a second node; and a third emission control transistor including a first electrode coupled to the first supply voltage line, a second electrode coupled to the first node, a main gate electrode coupled to the second node, and a sub-gate electrode.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: March 16, 2021
    Inventors: Seong Min Wang, Young In Hwang, Jin Woo Park, Yong Ho Yang
  • Publication number: 20210065716
    Abstract: An electronic device and method are disclosed herein. The electronic device includes a network interface and processor. The processor implements the method, including receiving a voice input through a network interface as transmitted from a first external device, including a request to execute a function using at least one application which is not indicated in the voice input, extracting a first text from the voice input by executing automatic speech recognition (ASR), when the at least one application is identified based on the first text, transmitting, through the network interface to the first external device, second data associated with the identified at least one application for display by the first external device, and when the at least one application is not identified based at least in part on the first text, reattempting identification of the at least one application by executing natural language understanding (NLU) on the first text.
    Type: Application
    Filed: November 13, 2020
    Publication date: March 4, 2021
    Inventors: Joo Hyuk JEON, Woo Up KWON, Jin Woo PARK, Kyoung Gu WOO, Eun Taek LIM, Kyung Hak HYUN, Dong Ho JANG
  • Publication number: 20210066149
    Abstract: Methods of fabricating a semiconductor package may include forming a first barrier layer on a first carrier, forming a sacrificial layer, including an opening that exposes at least a portion of the first barrier layer, on the first barrier layer, and forming a second barrier layer on the first barrier layer and on the sacrificial layer. The second barrier layer may include a portion formed on the sacrificial layer.
    Type: Application
    Filed: May 5, 2020
    Publication date: March 4, 2021
    Inventors: Jung-Ho PARK, Jin-Woo PARK, Jae Gwon JANG, Gwang Jae JEON
  • Publication number: 20210057317
    Abstract: A semiconductor package having a redistribution structure including a first face and a second face and a first semiconductor chip mounted on the first face. The semiconductor package may further include a first redistribution pad exposed from the second face of the redistribution structure and a second redistribution pad exposed from the second face of the redistribution structure. The semiconductor package may further include a first solder ball being in contact with the first redistribution pad and a second solder ball being in contact with the second redistribution pad. In some embodiments, a first distance of the first redistribution pad is smaller than a second distance of the second redistribution pad, the first and second distances are measured with respect to a reference plane that intersects a lower portion of the first solder ball and a lower portion of the second solder ball.
    Type: Application
    Filed: March 16, 2020
    Publication date: February 25, 2021
    Inventors: Jung-Ho PARK, Da Hye KIM, Jin-Woo PARK, Jae Gwon JANG
  • Publication number: 20210043700
    Abstract: Provided are an organic light emitting diode (OLED), a three-dimensional (3D) tactile display apparatus, and a manufacturing method thereof. The OLED includes a stretchable driving part including a stretchable field effect transistor (FET) and a stretchable light emitting part including a stretchable material on the stretchable driving part. The 3D tactile display apparatus includes a stretchable actuator having a driving layer formed of transparent rubber, a stretchable driving part having a stretchable FET, and a stretchable light emitting part including a stretchable material.
    Type: Application
    Filed: February 4, 2020
    Publication date: February 11, 2021
    Inventors: Jin Woo PARK, Jin Hoon KIM
  • Patent number: 10916670
    Abstract: The present disclosure relates to a semiconductor device and a photoelectronic device, both including a transition-metal dichalcogenide thin-film, and to a method for producing a transition-metal dichalcogenide thin-film. The transition-metal dichalcogenide thin-film includes: a first region including a stack of N+M transition-metal dichalcogenide molecular layers; and a second region including a stack of N transition-metal dichalcogenide molecular layers, wherein the second region is horizontally adjacent to the first region, wherein the N transition-metal dichalcogenide molecular layers of the second region respectively horizontally extend from the N transition-metal dichalcogenide molecular layers of the first region.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: February 9, 2021
    Assignee: Research & Business Foundation Sungkyunkwan University
    Inventors: Geun Young Yeom, Ki Seok Kim, Ki Hyun Kim, Jin Woo Park, Doo San Kim, You Jin Ji, Ji Young Byun, JiEun Kang
  • Publication number: 20210036022
    Abstract: Disclosed is a display device including a panel including an active area in which a plurality of subpixels is disposed, a through hole formed through the active area of the panel, a hole bezel zone disposed between the through hole and the active area so as to surround the through hole, and a plurality of data lines extending from a first active area of the active area to a second active area of the active area via the hole bezel zone, the plurality of data lines having a smaller wire pitch in the hole bezel zone than in the first active area and the second active area, wherein a first arrangement sequence of the plurality of data lines disposed in the first active area and a second arrangement sequence of the plurality of data lines disposed in the hole bezel zone are different from each other.
    Type: Application
    Filed: July 27, 2020
    Publication date: February 4, 2021
    Inventors: Jung-Woo HAN, Jin-Woo PARK, Kwang-Hyun BAEK
  • Publication number: 20210030200
    Abstract: A cooker control device and a cooker control method are disclosed. The cooker control method includes: recognizing a cooking ingredient based on vision recognition, inputting cooking information, and transmitting a cooking instruction corresponding to a detected recipe. According to the present disclosure, a cooker which cooks the recognized cooking ingredient may be controlled using an artificial intelligence (AI) model which performs machine learning (ML) through a 5G network.
    Type: Application
    Filed: January 3, 2020
    Publication date: February 4, 2021
    Applicant: LG ELECTRONICS INC.
    Inventors: Cherylyn CHUNG, Pil Suk Kang, Young Tak Kim, Jin Woo Park, Jung Hyun Lee
  • Publication number: 20210020608
    Abstract: A semiconductor package includes a first semiconductor chip including a first surface and a second surface which face each other, an alignment pattern formed on the first surface, a first redistribution layer arranged on the first surface of the first semiconductor chip, a second redistribution layer arranged on the second surface of the first semiconductor chip, and electrically connected with the semiconductor chip, and a first dielectric layer including the alignment pattern between the first redistribution layer and the semiconductor chip, the alignment pattern overlapping the first surface of the first semiconductor chip.
    Type: Application
    Filed: January 16, 2020
    Publication date: January 21, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jong Youn KIM, Dong Kyu Kim, Jin-Woo Park, Min Jun Bae, Gwang Jae Jeon
  • Patent number: 10894144
    Abstract: A delivery system for an intracorporeal device includes a sheath defining one or more lumens shaped to receive a delivery catheter or shaft and a guidewire. The system may include a delivery shaft having a distal coupling feature adapted to releasably couple with a proximal coupling feature of the intracorporeal device. The delivery system may further include a hub through which the delivery shaft and guidewire are passed. The delivery shaft may be coupled to a feature, such as a knob, that enables manipulation of the delivery shaft to decouple the distal fixation feature from the proximal fixation feature of the intracorporeal device in order to deploy the intracorporeal device within a patient.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: January 19, 2021
    Assignee: PACESETTER, INC.
    Inventors: Tracee Eidenschink, Jin Woo Park, Jason A. White
  • Patent number: 10896917
    Abstract: In some embodiments, 3-dimensional semiconductor memory device includes a semiconductor substrate extending horizontally in a first direction and a second direction crossing the first direction. A stacked memory cell array is formed on the semiconductor substrate. The memory device further includes a separation pattern including a plurality of separation lines extending in the first direction and arranged in the second direction, and dividing the stacked memory cell array into a plurality of memory cell structures extending in the first direction and arranged in the second direction. An upper insulating layer is formed above the plurality of memory cell structures and separation lines, and a passivation layer is formed above the upper insulating layer. The passivation layer includes a plurality of first regions having a first vertical thickness. A plurality of gap regions in the passivation layer are formed between the plurality of first regions.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: January 19, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min Sung Song, Heung Jin Joo, Kwan Yong Kim, Jin Woo Park, Du Heon Song, He Jueng Lee, Myung Ho Jung
  • Publication number: 20200405149
    Abstract: A computer implemented method, system and device are provided. The method transmits an energizing signal from an external antenna, coupled to a local external device (LED), to an implanted antenna of a passive implanted medical device (PIMD). The energizing signal is transmitted while the external antenna is at first and second positions. The method receives, at the external antenna, first and second energy transfer characteristic (ETC) values associated with the first and second positions, respectively. The method is under control of one or more processors configured with program instructions. The method analyzes the first and second ETC values to determine a difference therebetween. The method provides an energy transfer level (ETL) indicator based on the difference between the first and second ETC values. The ETL indicator provides feedback regarding a degree of energy transfer associated with at least one of the first and second positions.
    Type: Application
    Filed: June 25, 2019
    Publication date: December 31, 2020
    Inventors: Jin Woo Park, Michael Fonseca, William D. Barrett, Philip M. FitzSimons
  • Publication number: 20200365678
    Abstract: An organic light emitting diode display includes a substrate, a scan line on the substrate for transferring a scan signal, a data line crossing the scan line and for transferring a data signal, a driving voltage line crossing the scan line and for transferring a driving voltage, a switching thin film transistor coupled to the scan line and the data line, a driving thin film transistor coupled to a switching drain electrode of the switching thin film transistor, and an organic light emitting diode (OLED) coupled to a driving drain electrode of the driving thin film transistor, wherein a driving semiconductor layer of the driving thin film transistor is bent and in a plane substantially parallel to the substrate.
    Type: Application
    Filed: August 3, 2020
    Publication date: November 19, 2020
    Inventors: Se-Ho Kim, Jin-Woo Park, Won-Se Lee
  • Publication number: 20200365555
    Abstract: A semiconductor package including a first device layer including first semiconductor devices, a first cover insulating layer, and first through-electrodes passing through at least a portion of the first device layer, a second device layer second semiconductor devices, a second cover insulating layer, and second through-electrodes passing through at least a portion of the second device layer, the second semiconductor devices vertically overlapping the first semiconductor devices, respectively, the second cover insulating layer in contact with the first cover insulating layer a third device layer including an upper semiconductor chip, the upper semiconductor chip vertically overlapping both at least two of first semiconductor devices and at least two of the second semiconductor devices, and device bonded pads passing through the first and second cover insulating layers, the device bonded pads electrically connecting the first and second through-electrodes to the upper semiconductor chip may be provided.
    Type: Application
    Filed: July 29, 2020
    Publication date: November 19, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ji-seok HONG, Jin-woo PARK
  • Patent number: 10839806
    Abstract: An electronic device and method are disclosed herein. The electronic device includes a network interface and processor. The processor implements the method, including receiving a voice input through a network interface as transmitted from a first external device, including a request to execute a function using at least one application which is not indicated in the voice input, extracting a first text from the voice input by executing automatic speech recognition (ASR), when the at least one application is identified based on the first text, transmitting, through the network interface to the first external device, second data associated with the identified at least one application for display by the first external device, and when the at least one application is not identified based at least in part on the first text, reattempting identification of the at least one application by executing natural language understanding (NLU) on the first text.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: November 17, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo Hyuk Jeon, Woo Up Kwon, Jin Woo Park, Kyoung Gu Woo, Eun Taek Lim, Kyung Hak Hyun, Dong Ho Jang
  • Patent number: 10809557
    Abstract: A liquid crystal display panel including a first substrate, a second substrate, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate includes a first base substrate, a thin film transistor disposed on the first base substrate, a color filter disposed on the first base substrate, and a first alignment layer disposed on the thin film transistor and the color filter. The second substrate includes a second base substrate, a second alignment layer disposed on a first surface of the second base substrate, a touch electrode disposed on a second surface of the second base substrate, a connecting electrode disposed on the second surface, and a connecting line disposed on the second surface. The first surface faces the first substrate, and the second surface is opposite to the first surface. The touch electrode includes a crystallized indium tin oxide.
    Type: Grant
    Filed: September 16, 2019
    Date of Patent: October 20, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Seong Mo Hwang, Jin Woo Park