Abstract: An espresso extraction device and an espresso extraction method are described that utilize a control unit that controls an operation of a valve unit or a pressure unit that adjusts pressure applied to an extraction unit of the device based on sensing data of a sensor unit in the extraction unit. A portafilter can be mounted on a head of the extraction unit, removing bubbles in the pressure unit by filling the pressure unit with a fluid and controlling the operation of the valve unit, removing bubbles in the extraction unit by filling the extraction unit with a fluid and controlling the operation of the valve unit, extracting espresso by exerting pressure to a fluid contained in the extraction unit by operating the pressure unit, receiving extraction pressure in the extraction unit via a sensor unit, and controlling the operation of the pressure unit on the basis of extraction pressure.

Abstract: A semiconductor die stack structure includes a base die, a plurality of semiconductor die stack units, and bumps. Each of the plurality of semiconductor die stack units includes a lower semiconductor die and an upper semiconductor die. Each of the lower semiconductor die and the upper semiconductor die includes a body and a front-side pad structure. The front-side pad structure includes a front-side pad seed layer and a front-side pad pattern. The front-side pad pattern includes a first front-side pad portion, a second front-side pad portion, and a third front-side pad portion. The first front-side pad portion and the second front-side pad portion forms a staircase. The first front-side pad portion and the third front-side pad form a reverse staircase. The first front-side pad portion, the second front-side pad portion, and the third front-side pad include a same metal.

Abstract: Semiconductor packages and methods of fabricating the same are provided. The semiconductor package includes a first package substrate including a first area, a first semiconductor chip mounted on the first area, a second package substrate disposed on an upper surface of the first semiconductor chip and including a second area and a first hole penetrating through the second area, a second semiconductor chip mounted on the second area, a connection member electrically connecting the first package substrate and the second package substrate and between the first package substrate and the second package substrate, and a mold film covering the second semiconductor chip on the second package substrate, filling the first hole, and covering the first semiconductor chip and the connection member on the first package substrate.

Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.

Abstract: A semiconductor package including a first device layer including first semiconductor devices, a first cover insulating layer, and first through-electrodes passing through at least a portion of the first device layer, a second device layer second semiconductor devices, a second cover insulating layer, and second through-electrodes passing through at least a portion of the second device layer, the second semiconductor devices vertically overlapping the first semiconductor devices, respectively, the second cover insulating layer in contact with the first cover insulating layer a third device layer including an upper semiconductor chip, the upper semiconductor chip vertically overlapping both at least two of first semiconductor devices and at least two of the second semiconductor devices, and device bonded pads passing through the first and second cover insulating layers, the device bonded pads electrically connecting the first and second through-electrodes to the upper semiconductor chip may be provided.

Abstract: A temperature sensor includes a first electrode, second electrode, and a pyroelectric layer between the first electrode and the second electrode. The pyroelectric layer includes a ferroelectric polymer and an ionogel.

Abstract: A touch detection module, includes: a plurality of driving electrodes arranged side by side; a plurality of sensing electrodes staggered with respect to the driving electrodes; and a touch driving circuit configured to supply touch driving signals to the plurality of driving electrodes and to detect touch detection signals through the plurality of sensing electrodes to identify touch position coordinates, wherein the touch driving circuit is configured: to vary frequency modulation parameter set values in response to a change in a frequency of reference clocks, and to generate and supply a frequency of the touch driving signals by using the reference clocks and a varied frequency modulation parameter set value.

Abstract: A light-emitting element may include a first electrode, a second electrode facing the first electrode, a first hole transport layer disposed above the first electrode, a first electron transport layer disposed between the first hole transport layer and the second electrode. A first light-emitting part and a second light-emitting part that emit different light may be disposed between the first hole transport layer and the first electron transport layer. The first light-emitting part may include a first blue emission layer, a second electron transport layer, a charge generation layer, and a second blue emission layer, and the first blue emission layer may be disposed above the first hole transport layer. At least one of the first electron transport layer and the second electron transport layer may be directly disposed above at least one of the first blue emission layer and the second blue emission layer.

Abstract: A refrigerator door includes a color module which displays various colors by using LEDs. Accordingly, when a consumer desires to change the color of the refrigerator door, the color of the refrigerator door can be changed to color desired by the consumer.

Abstract: The present invention relates to a wearable pressure ulcer detection sensor, and the wearable pressure ulcer detection sensor according to the present invention includes a pressure sensor measuring pressure based on a change in capacitance caused by physical force, a temperature sensor measuring temperature based on a change in electrical conductivity due to electron hopping, and an impedance sensor including two electrodes spaced apart from each other and in contact with skin.

Abstract: A system and method are provided for determining a pressure associated with a lumen of a body. A wireless sensor is positioned in the lumen of the body. The sensor comprises an LC resonant circuit having a resonant frequency configured to vary in response to changes in pressure in the lumen. One or more sensor calibration parameters are stored at an external base unit. The external based unit generates and transmits an energizing signal. A ring down response is received from the wireless sensor. The system and method determine the resonant frequency of the LC resonant circuit from the ring down response and calculate the pressure in the lumen from the resonant frequency of the LC resonant circuit utilizing the one or more sensor calibration parameters associated with the LC resonant circuit.

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a base semiconductor chip, a chip structure on the base semiconductor chip, a connection terminal between the base semiconductor chip and the chip structure, and a molding layer surrounding the chip structure and the connection terminal. The chip structure includes a first semiconductor chip including a first frontside pad and a first backside pad, and a second semiconductor including a second frontside pad and a second backside pad. A lateral surface of the first semiconductor chip is aligned with that of the second semiconductor chip. The first backside pad and the second frontside pad partially overlap each other when viewed in plan while being in direct contact with each other. The first backside pad and the second frontside pad include the same metal and are formed into a single unitary piece.

Abstract: A method for light-weighting an artificial neural network model, the method comprising is provided. The method includes the steps of: learning, on the basis of a channel length of a 1×1 pruning unit applied in a channel direction to each of a plurality of kernels included in an artificial neural network model, a pruning factor for each of the pruning units and a weight for each of the pruning units; and determining, on the basis of at least one of the learned pruning factors and weights, which of the pruning units is to be removed from the artificial neural network model, wherein the channel length of the pruning unit is shorter than a channel length of at least a part of the plurality of kernels.

Abstract: A protective film is provided. The protective film includes a release film, a base film which is disposed on the release film and comprises a protective part and a first pull tab part protruding from a first side surface of the protective part, and a first dummy film which is disposed on the release film, does not overlap the base film in a plan view, and comprises a part partially surrounding the first pull tab part, where edges of the base film and edges of the first dummy film are disposed inside edges of the release film in the plan view.

Abstract: A tubular structure for a rectangular battery can for an electric vehicle, which is thin and has very high dimensional accuracy in order to contain as much electrolyte as possible within a limited size, and a method of manufacturing the same are disclosed. In particular, extrusion of a material to a predetermined thickness is performed, and drawing of the extruded material to a thickness desired by a final product is performed. Accordingly, desired thickness uniformity of the final product is maintained.

Abstract: A preparation process of 5-ethylidene-2-norbornene, including: introducing dicyclopentadiene into a dicyclopentadiene decomposition reactor to thermally decompose the dicyclopentadiene; introducing a product of the above step into a cyclopentadiene purification tower; introducing 1,3-butadiene, a solvent, and cyclopentadiene separated from the top of the cyclopentadiene purification tower into a Diels-Alder reactor to react the same; introducing a product of the immediate above step into a 1,3-butadiene removal tower to recover 1,3-butadiene from the top; introducing a mixture at the bottom of the 1,3-butadiene removal tower into a desolvation tower, and recycling a solvent and unreacted raw materials recovered from the top of the desolvation tower to the dicyclopentadiene decomposition reactor; introducing a mixture at the bottom of the desolvation tower into a 5-vinyl-2-norbornene separation tower to separate 5-vinyl-2-norbornene; and introducing the 5-vinyl-2-norbornene into an isomerization reactor to rea

Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.

Abstract: A semiconductor package includes a substrate; a substrate pad on the substrate; a first semiconductor chip and a second semiconductor chip on the substrate; a connective terminal between the substrate pad and the first semiconductor chip and between the substrate pad and the second semiconductor chip; a dummy pad on the substrate, and spaced apart from the substrate pad, wherein the dummy pad is between the first semiconductor chip and the second semiconductor chip; and an underfill material layer interposed between the substrate and the first semiconductor chip and between the substrate and the second semiconductor chip, wherein the dummy pad and the substrate pad include a same material.

Abstract: An aluminum plate coiling device capable of coiling an extruded and rolled aluminum plate without generating distortion or deformation of the aluminum plate is disclosed. The aluminum plate coiling device has a simple structure, thereby being capable of achieving a reduction in installation space and a reduction in installation cost.

Abstract: An aluminum plate manufacturing method capable of achieving an enhancement in productivity through a reduction in the number of processes and a reduction in processing time is disclosed. In the aluminum plate manufacturing method, a plate is rolled after being extruded to a desired thickness. Accordingly, it is possible to reduce the number of processes and a processing time and, as such, achieving an enhancement in productivity, as compared to a conventional manufacturing process using only rolling.