Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a base semiconductor chip, a chip structure on the base semiconductor chip, a connection terminal between the base semiconductor chip and the chip structure, and a molding layer surrounding the chip structure and the connection terminal. The chip structure includes a first semiconductor chip including a first frontside pad and a first backside pad, and a second semiconductor including a second frontside pad and a second backside pad. A lateral surface of the first semiconductor chip is aligned with that of the second semiconductor chip. The first backside pad and the second frontside pad partially overlap each other when viewed in plan while being in direct contact with each other. The first backside pad and the second frontside pad include the same metal and are formed into a single unitary piece.

Abstract: A method for light-weighting an artificial neural network model, the method comprising is provided. The method includes the steps of: learning, on the basis of a channel length of a 1×1 pruning unit applied in a channel direction to each of a plurality of kernels included in an artificial neural network model, a pruning factor for each of the pruning units and a weight for each of the pruning units; and determining, on the basis of at least one of the learned pruning factors and weights, which of the pruning units is to be removed from the artificial neural network model, wherein the channel length of the pruning unit is shorter than a channel length of at least a part of the plurality of kernels.

Abstract: A protective film is provided. The protective film includes a release film, a base film which is disposed on the release film and comprises a protective part and a first pull tab part protruding from a first side surface of the protective part, and a first dummy film which is disposed on the release film, does not overlap the base film in a plan view, and comprises a part partially surrounding the first pull tab part, where edges of the base film and edges of the first dummy film are disposed inside edges of the release film in the plan view.

Abstract: A tubular structure for a rectangular battery can for an electric vehicle, which is thin and has very high dimensional accuracy in order to contain as much electrolyte as possible within a limited size, and a method of manufacturing the same are disclosed. In particular, extrusion of a material to a predetermined thickness is performed, and drawing of the extruded material to a thickness desired by a final product is performed. Accordingly, desired thickness uniformity of the final product is maintained.

Abstract: A preparation process of 5-ethylidene-2-norbornene, including: introducing dicyclopentadiene into a dicyclopentadiene decomposition reactor to thermally decompose the dicyclopentadiene; introducing a product of the above step into a cyclopentadiene purification tower; introducing 1,3-butadiene, a solvent, and cyclopentadiene separated from the top of the cyclopentadiene purification tower into a Diels-Alder reactor to react the same; introducing a product of the immediate above step into a 1,3-butadiene removal tower to recover 1,3-butadiene from the top; introducing a mixture at the bottom of the 1,3-butadiene removal tower into a desolvation tower, and recycling a solvent and unreacted raw materials recovered from the top of the desolvation tower to the dicyclopentadiene decomposition reactor; introducing a mixture at the bottom of the desolvation tower into a 5-vinyl-2-norbornene separation tower to separate 5-vinyl-2-norbornene; and introducing the 5-vinyl-2-norbornene into an isomerization reactor to rea

Abstract: Disclosed are semiconductor packages and/or methods of fabricating the same. The semiconductor package comprises a package substrate, a first semiconductor chip mounted on the package substrate, a second semiconductor chip mounted on a top surface of the first semiconductor chip, and a first under-fill layer that fills a space between the package substrate and the first semiconductor chip. The package substrate includes a cavity in the package substrate, and a first vent hole that extends from a top surface of the package substrate and is in fluid communication with the cavity. The first under-fill layer extends along the first vent hole to fill the cavity.

Abstract: A semiconductor package includes a substrate; a substrate pad on the substrate; a first semiconductor chip and a second semiconductor chip on the substrate; a connective terminal between the substrate pad and the first semiconductor chip and between the substrate pad and the second semiconductor chip; a dummy pad on the substrate, and spaced apart from the substrate pad, wherein the dummy pad is between the first semiconductor chip and the second semiconductor chip; and an underfill material layer interposed between the substrate and the first semiconductor chip and between the substrate and the second semiconductor chip, wherein the dummy pad and the substrate pad include a same material.

Abstract: An aluminum plate coiling device capable of coiling an extruded and rolled aluminum plate without generating distortion or deformation of the aluminum plate is disclosed. The aluminum plate coiling device has a simple structure, thereby being capable of achieving a reduction in installation space and a reduction in installation cost.

Abstract: An aluminum plate manufacturing method capable of achieving an enhancement in productivity through a reduction in the number of processes and a reduction in processing time is disclosed. In the aluminum plate manufacturing method, a plate is rolled after being extruded to a desired thickness. Accordingly, it is possible to reduce the number of processes and a processing time and, as such, achieving an enhancement in productivity, as compared to a conventional manufacturing process using only rolling.

Abstract: Provided is a portable isothermal amplification device for amplifying a nucleic acid using an isothermal amplification method, the device comprising: a tube insertion part into which a PCR tube is to be inserted, which is provided in an upper portion of the portable isothermal amplification device; a cover for covering the tube insertion part; a storage space for accommodating a heating device and a storage space cover for blocking the storage space from an outside, which is provided in a lower portion of the portable isothermal amplification device; and a heat insulator for blocking heat from the outside and a heat-sensing sticker capable of measuring a temperature of heat generated by the heating device, which is provided inside the storage space.

Abstract: A method for analyzing a visitor on the basis of a video in an edge computing environment is provided. The method includes the steps of: extracting feature data from a captured video of an offline space; generating detection data on a location and an appearance of an object contained in the captured video from the feature data using an artificial neural network-based detection model; and integrating detection data of a location and an appearance of a target object.

Abstract: Disclosed is a method of processing a substrate. The method may include: a substrate loading operation of loading a substrate into a treating space of a chamber; a film removal operation of removing a film provided on the substrate; a protective film formation operation of forming a protective film containing oxygen on the substrate; and a substrate unloading operation of unloading the substrate from the treating space.

Abstract: A semiconductor package includes a first substrate, a memory semiconductor package on a first surface of the first substrate, an adhesive layer between the first surface of the first substrate and the memory semiconductor package, a wire extending from an upper surface of the memory semiconductor package and connected to the first substrate, a logic semiconductor chip on the first surface of the first substrate, a first connection terminal between the first surface of the first substrate and the logic semiconductor chip, and a molding layer, wherein a first height of the memory semiconductor package is smaller than a second height of the logic semiconductor chip, and wherein an uppermost surface of the molding layer and the upper surface of the logic semiconductor chip are coplanar.

Abstract: A computer implemented method, system and device are provided. The method transmits an energizing signal from an external antenna, coupled to a local external device (LED), to an implanted antenna of a passive implanted medical device (PIMD). The energizing signal is transmitted while the external antenna is at first and second positions. The method receives, at the external antenna, first and second energy transfer characteristic (ETC) values associated with the first and second positions, respectively. The method is under control of one or more processors configured with program instructions. The method analyzes the first and second ETC values to determine a difference therebetween. The method provides an energy transfer level (ETL) indicator based on the difference between the first and second ETC values. The ETL indicator provides feedback regarding a degree of energy transfer associated with at least one of the first and second positions.

Abstract: A system and method are provided for determining a pressure associated with a lumen of a body. A wireless sensor is positioned in the lumen of the body. The sensor comprises an LC resonant circuit having a resonant frequency configured to vary in response to changes in pressure in the lumen. One or more sensor calibration parameters are stored at an external base unit. The external based unit generates and transmits an energizing signal. A ring down response is received from the wireless sensor. The system and method determine the resonant frequency of the LC resonant circuit from the ring down response and calculate the pressure in the lumen from the resonant frequency of the LC resonant circuit utilizing the one or more sensor calibration parameters associated with the LC resonant circuit.

Abstract: A semiconductor package includes a package substrate, substrate pads provided on a top surface of the package substrate, at least one core ball on at least one of the substrate pads, a redistribution substrate provided on the top surface of the package substrate, and a semiconductor chip mounted on the redistribution substrate. The redistribution substrate is electrically connected to the package substrate through a plurality of solder balls provided on a bottom surface of the redistribution substrate. The at least one core ball is electrically connected to the redistribution substrate. A diameter of the at least one core ball is greater than a diameter of each of the plurality of solder balls.

Abstract: A display device includes a first pixel area including a first pixel electrode and a first organic light emitting layer, a tandem pixel area including a tandem pixel electrode, a first tandem organic light emitting layer and a second tandem organic light emitting layer, a capping layer including a first capping layer corresponding to the first organic light emitting layer and a tandem capping layer corresponding to both the first tandem organic light emitting layer and the second tandem organic light emitting layer, and a common electrode between the first capping layer and the first organic light emitting layer and between the tandem capping layer and the second tandem organic light emitting layer. Each of the first capping layer and the tandem capping layer has a thickness, and the thickness of the tandem capping layer is smaller than the thickness of the first capping layer.

Abstract: A circuit stage including a first transistor including a first electrode and a gate electrode, the first electrode being coupled to a first input terminal and the gate electrode being coupled to a second input terminal configured to receive a first clock signal, an output circuit coupled to the second input terminal and a second power input terminal, an input circuit coupled to a second electrode of the first transistor and to a third input terminal, the third input terminal being configured to receive a first control clock signal, the input circuit being configured to control voltages of the second node and a third node, a first driving circuit coupled to a first power input terminal and to a fourth input terminal configured to receive a second control clock signal, and a second driving circuit coupled to the fourth input terminal and the third node.

Abstract: A display device including a display panel including a plurality of transistors and displaying an image on a front surface thereof; and a sensing module on a rear surface of the display panel, wherein the display panel includes a first region that overlaps the sensing module and a second region that does not overlap the sensing module, a W/L ratio of one of the transistors in the first region is greater than a W/L ratio of another of the transistors in the second region, the W/L ratio being obtained by dividing a width of a channel of the transistor by a length of the channel.

Abstract: A touch screen panel including a substrate having an effective area and a pad area, sensing electrodes disposed in the effective area, pads disposed in the pad area, wirings connecting the sensing electrodes and the pads, respectively, the wirings each having different lengths, and an electrostatic dispersion pad disposed adjacent to a sensing electrode disposed closest to the pad area among the sensing electrodes.