Abstract: Method and device for reading data from a semiconductor device, where tR is a read operation time, tT is a buffer transfer time, and tH is a host transfer time, where at least two of tR, tT, and tH may be overlapped to reduce a total transfer time.

Abstract: There is provided a flash memory device capable of manipulating multi-bit and single-bit data. The flash memory device can include a memory cell array with a plurality of memory blocks. The flash memory device can also include a judgment circuit for storing multi-bit/single-bit information indicating whether each of the memory blocks is a multi-bit memory block or not, determining whether or not a memory block of an inputted block address is a multi-bit memory block according to the stored multi-bit/single-bit information and outputting an appropriate flag signal. A read/write circuit for selectively performing multi-bit and single-bit read/program operations of the memory block corresponding to the block address is also included, as well as control logic for controlling the read/write circuit such that the read/write circuit can perform multi-bit or single-bit read/program operations based on the flag signal.

Abstract: Multi-bit flash memory devices are provided. The multi-bit flash memory device includes an array of memory cells and a page buffer block including page buffers. Each of the page buffers has a single latch structure and performs a write operation with respect to memory cells according to loaded data. A buffer random access memory (RAM) is configured to store program data provided from an external host device during a multi-bit program operation. Control logic is provided that is configured to control the page buffer block and the buffer RAM so that program data stored in the buffer RAM is reloaded into the page buffer block whenever data programmed before the multi-bit program operation is compared with data to be currently programmed. The control logic is configured to store data to be programmed next in the buffer RAM before the multi-bit program operation is completed.

Abstract: A memory cell array includes a NAND string formed of a plurality of memory cells coupled in series between a string selection transistor and a ground selection transistor. The string selection transistor controls an electrical connection between the NAND string and a bit line based on a string selection voltage in a read operation. A row selection circuit is coupled to the memory cell array through a string selection line, ground selection line and a plurality of word lines. The row selection circuit selects a word line which is coupled to the read memory cell among the plurality of word lines based on a row address signal and a read voltage in a read operation. A voltage generation circuit generates the string selection voltage and the read voltage.

Abstract: Provided is a method of improving the read disturb characteristics of a flash memory array. According to the method, in a flash memory array having at least one cell string in which a string selection transistor, a plurality of memory cells, and a ground selection transistor are connected in series, first read voltage is applied to a string selection line connected to a gate of the string selection transistor and a ground selection line connected to a gate of the ground selection transistor. Ground voltage is applied to a word line of a memory cell selected from among the memory cells. Second read voltage is applied to word lines of memory cells, from among the memory cells that are not selected, which are adjacent to the string selection transistor and the ground selection transistor. Then, the first read voltage is applied to the other memory cells that are not selected. The second read voltage is lower than the first read voltage.

Abstract: A flash memory device includes a cell array and a voltage supplying and selecting portion. The cell array includes multiple word lines, and the voltage supplying and selecting portion is configured to generate at least two different voltages to be supplied to the word lines of the cell array during an erase operation.

Abstract: The present invention is directed to a dual chip package that is connected to a host and includes a first memory chip and a second memory chip. Each of the first and second memory chips includes a flash memory; an option pad connected to either a first or second voltage; a register configured to store a flag signal indicating whether a memory chip is selected; a comparator circuit configured to compare a flag signal stored in the register with a logic value apparent at the option pad to generate a flash access signal. Each of the first and second memory chips also includes a memory controller unit configured to access the flash memory in response to the flash access signal, and an interrupt controller unit configured to provide an interrupt signal to the host in response to the flash access signal and a control signal provided from the host.

Abstract: A memory device includes a non-volatile memory core that includes a memory cell array and a page buffer configured to store data to be programmed in the memory cell array. The device also includes a test data input buffer configured to receive test data from an external source, and control circuit that controls the non-volatile memory core and the test data input buffer. The control circuit is configured to load test data from the test data buffer to the page buffer, to program the loaded test data in the page buffer in the memory cell array, and to retain the test data in the page buffer for subsequent programming of the memory cell array. The device may further include a test data output buffer configured to receive data read from the memory cell array, and the control circuit may be operative to convey the read data from the test data output buffer to an external recipient.

Abstract: A flash memory device includes a memory cell array, a bulk voltage generator and a controller. The memory cell array is formed in a bulk area and including memory cells arranged in rows and columns. The bulk voltage generator is configured to supply a bulk voltage to the bulk area. The controller is configured to control the bulk voltage generator to vary an erase time based on a time when the bulk voltage reaches a target voltage.

Abstract: A row decoder preventing leakage current and a semiconductor memory device including the same are provided. The row decoder includes an address decoder and a selection signal generator. The address decoder decodes a predetermined address signal and activates an enable signal. The selection signal generator electrically connects a boosted voltage node to an output node to activate a block selection signal when the enable signal is activated and electrically breaks a path between the boosted voltage node and the output node and a path between the boosted voltage node and a ground voltage node when the enable signal is deactivated. The selection signal generator includes a feedback circuit, a switch, and a direct current (DC) path breaker. The feedback circuit is electrically connected to the output node to generate an output voltage that varies with a voltage level of the block selection signal. The switch transmits the output voltage of the feedback circuit to the output node.

Abstract: There is provided a flash memory device capable of manipulating multi-bit and single-bit data. The flash memory device can include a memory cell array with a plurality of memory blocks. The flash memory device can also include a judgment circuit for storing multi-bit/single-bit information indicating whether each of the memory blocks is a multi-bit memory block or not, determining whether or not a memory block of an inputted block address is a multi-bit memory block according to the stored multi-bit/single-bit information and outputting an appropriate flag signal. A read/write circuit for selectively performing multi-bit and single-bit read/program operations of the memory block corresponding to the block address is also included, as well as control logic for controlling the read/write circuit such that the read/write circuit can perform multi-bit or single-bit read/program operations based on the flag signal.

Abstract: An internal clock generator, system and method of generating the internal clock are disclosed. The method comprises detecting the level of an operating voltage within the system, comparing the level of the operating voltage to a target voltage level and generating a corresponding detection signal, and selecting between a normal clock and an alternate clock having a period longer than the period of the normal clock in relation to the detection signal and generating an internal clock on the basis of the selection.

Abstract: Method and device for reading data from a semiconductor device, where tR is a read operation time, tT is a buffer transfer time, and tH is a host transfer time, where at least two of tR, tT, and tH may be overlapped to reduce a total transfer time.

Abstract: An erase voltage generation circuit providing a uniform erase execution time and a non-volatile semiconductor memory device having the same, in which the erase voltage generation circuit includes a high voltage generation unit a voltage level detection unit, an execution time checking unit and a discharging unit. The high voltage generation unit generates an erase voltage. The voltage level detection unit detects the erase voltage and generates a level detection signal. The level detection signal is activated when the erase voltage reaches a target voltage. The execution time checking unit generates an execution end signal that is activated in response to the lapse of an erase execution time from the activation of the level detection signal. The discharging unit discharges the erase voltage as a discharge voltage. The high voltage generation unit is disabled in response to the activation of the execution end signal, and the discharging unit is enabled in response to the activation of the execution end signal.

Abstract: Provided are a test system and a related high voltage measurement method. The method includes applying an external voltage signal to one or more of a plurality of DUTs via the shared channel, comparing the external voltage signal with a high voltage signal internally generated by the one or more DUTs and generating a corresponding comparison result, and determining a voltage level for each respective high voltage signal in accordance with the comparison result.

Abstract: The disclosure is a NAND flash memory with the function of error checking and correction during a page copy operation. The NAND flash memory is able to prohibit transcription of erroneous bits to a duplicate page from a source page. Embodiments of the inventive flash memory include a correction circuit for correcting bit errors of source data stored in a page buffer, a circuit configured to provide the source data to the correction circuit and to provide correction data to the page buffer, and a copy circuit configured to copy the source data to the page buffer, and to store the correction data in the other page from the page buffer.

Abstract: Some embodiments of the present invention provide programming operations for reducing a program time for a nonvolatile memory device. A nonvolatile semiconductor memory device is programmed by receiving data to be programmed into memory cells from a host, programming the data into the memory cells, performing a verify read operation to determine whether the data has been successfully programmed into the memory cells, and performing a Y-scan operation while performing the verify read operation to sequentially scan and output data read from bit lines coupled to the memory cells.

Abstract: A nonvolatile memory device comprises a memory cell array comprising memory cells arranged in rows and first columns and flag cells arranged in the rows and second columns. The device further comprises a page buffer configured to read flag data bits from flag cells in a selected row via the second columns, and a judgment unit configured to judge whether memory cells in the selected row are programmed with MSB data based on the flag data bits read by the page buffer.

Abstract: According to an example embodiment, a method of changing a block size in a flash memory device having a multi-plane scheme may include decoding an external input address and changing the block size of the flash memory device from a first block size to a second block size. The external input address may be decoded into a block address and a page address. The block size of the flash memory device may be changed from the first block size to the second block size by shifting at least one bit of the block address to the page address or shifting at least one bit of the page address to the block address.

Abstract: An erase voltage generation circuit providing a uniform erase execution time and a non-volatile semiconductor memory device having the same, in which the erase voltage generation circuit includes a high voltage generation unit, a voltage level detection unit, an execution time checking unit and a discharging unit. The high voltage generation unit generates an erase voltage. The voltage level detection unit detects the erase voltage and generates a level detection signal. The level detection signal is activated when the erase voltage reaches a target voltage. The execution time checking unit generates an execution end signal that is activated in response to the lapse of an erase execution time from the activation of the level detection signal. The discharging unit discharges the erase voltage as a discharge voltage.