Patents by Inventor Jing Yi

Jing Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8885917
    Abstract: A mask pattern and a correcting method thereof are provided. The correcting method includes the following steps. An original pattern having a first original contour and a second original contour is provided. The first original contour has a first original corner. The second original contour has a second original corner, which is near the first original corner. The first and second original corners are cut to form a cut pattern. An optical proximity correction (OPC) process is applied to the cut pattern to form the mask pattern.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: November 11, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Te-Hsien Hsieh, Ming-Jui Chen, Cheng-Te Wang, Jing-Yi Lee
  • Patent number: 8880063
    Abstract: Techniques for efficiently performing public land mobile network (PLMN) list generation or PLMN search on user equipment for use in a mobile communication system are described. The user equipment is operating in a plurality of supported modes and each supported mode includes a plurality of frequency bands. The user equipment includes an antenna, two RF transceivers and a processor. The RF transceivers are coupled to the antenna for operating in the operating frequency bands via the antenna. The processor coupled to the RF transceivers receives a request requesting PLMN list generation or PLMN search, determines whether both or either of the RF transceivers are available for handling the PLMN list generation or PLMN search, respectively directs the RF transceivers to generate a PLMN list or perform a search for at least one selected operating frequency band according to the request and a dispatch rule, and provides a corresponding execution result.
    Type: Grant
    Filed: February 23, 2009
    Date of Patent: November 4, 2014
    Assignee: Mediatek Inc.
    Inventor: Jing-Yi Wu
  • Patent number: 8878226
    Abstract: A light emitting device includes a substrate, and a plurality of light emitting structures disposed thereon. Each of the light emitting structures includes an auxiliary electrode disposed on the substrate, a first insulating layer disposed on the substrate and covering the auxiliary electrode, an electrode disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and having a first opening exposing the electrode, an organic light emitting layer disposed in the first opening, a cathode disposed on the organic light emitting layer, at least a conductive structure penetrating through the first insulating layer and the second insulating layer, and a closed ring structure disposed on the second insulating layer and around the cathode, wherein a thickness of the closed ring structure is larger than that of the cathode.
    Type: Grant
    Filed: January 17, 2013
    Date of Patent: November 4, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Jing-Yi Yan, Shu-Tang Yeh, Chih-Chieh Hsu, Chen-Wei Lin, Kuang-Jung Chen
  • Publication number: 20140305483
    Abstract: A multi-layer thermoelectric module and a fabricating method thereof are provided. The module includes two thermoelectric element sets and a metal electrode set, in which the thermoelectric element sets are corresponding to different operating temperature ranges. Each thermoelectric element set includes a thermoelectric unit, an interfacial adhesion layer, a diffusion barrier layer and a high melting-point metal layer. In the method, the thermoelectric unit, the interfacial adhesion layer, and the diffusion barrier layer are sequentially formed on the thermoelectric unit. Then, two high melting-point metal layers are formed respectively on the electrode layers of the metal electrode set.
    Type: Application
    Filed: July 8, 2013
    Publication date: October 16, 2014
    Inventors: Jing-Yi HUANG, Huey-Lin HSIEH, Tung-Han CHUANG, Jenn-Dong HWANG, Chao-Chi JAIN
  • Patent number: 8861553
    Abstract: An asynchronous master-slave serial communication system, a data transmission method, and a control module using the same are disclosed. The asynchronous master-slave serial communication system comprises a master control module and a slave control module. The master control module generates a check code according to an address information and a data information, and generates a data package according to the address information, the data information, the check code and the master clock signal. The slave control module generates a decoding data according to the data package and a slave clock signal, and generates the address information, the data information and the check code according to the decoding data.
    Type: Grant
    Filed: August 12, 2011
    Date of Patent: October 14, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Chuan Chen, Ying-Min Chen, Chia-Ching Lin, Cheng-Xue Wu, Jing-Yi Huang
  • Publication number: 20140303329
    Abstract: This invention provides Chelating Complex Micelles as a drug carrier. The Chelating Complex Micelles can load drugs without changing their structure, and therefore extend the half-life of drugs in the human body. The chelating complex micelles contain a metal ion core, at least one polymer, and at least one drug molecule. The metal ion is considered as a Lewis acid while polymer chain and drug molecules are referred to as Lewis bases. The drug molecule is linked to the polymer via forming coordinate bonds with metal ion, and then self-assembled to form chelating complex micelles as a drug carrier.
    Type: Application
    Filed: June 17, 2014
    Publication date: October 9, 2014
    Inventors: Chau-Hui Wang, Chia-Hung Chen, Johnson Lin, Jing-Yi Chen, Wei-Chuan Liao
  • Publication number: 20140296451
    Abstract: This invention provides Chelating Complex Micelles as a drug carrier. The Chelating Complex Micelles can load drugs without changing their structure, and therefore extend the half-life of drugs in the human body. The chelating complex micelles contain a metal ion core, at least one polymer, and at least one drug molecule. The metal ion is considered as a Lewis acid while polymer chain and drug molecules are referred to as Lewis bases. The drug molecule is linked to the polymer via forming coordinate bonds with metal ion, and then self-assembled to form chelating complex micelles as a drug carrier.
    Type: Application
    Filed: June 17, 2014
    Publication date: October 2, 2014
    Inventors: Chau-Hui Wang, Chia-Hung Chen, Johnson Lin, Jing-Yi Chen, Wei-Chuan Liao
  • Publication number: 20140296435
    Abstract: This invention provides Chelating Complex Micelles as a drug carrier. The Chelating Complex Micelles can load drugs without changing their structure, and therefore extend the half-life of drugs in the human body. The chelating complex micelles contain a metal ion core, at least one polymer, and at least one drug molecule. The metal ion is considered as a Lewis acid while polymer chain and drug molecules are referred to as Lewis bases. The drug molecule is linked to the polymer via forming coordinate bonds with metal ion, and then self-assembled to form chelating complex micelles as a drug carrier.
    Type: Application
    Filed: June 17, 2014
    Publication date: October 2, 2014
    Inventors: Chau-Hui Wang, Chia-Hung Chen, Johnson Lin, Jing-Yi Chen, Wei-Chuan Liao
  • Publication number: 20140231811
    Abstract: A semiconductor device structure is provided. The semiconductor device structure may include a substrate, a semiconductor layer, a first conductive layer, a second conductive layer, a first dielectric layer and a second dielectric layer. The first dielectric layer is disposed on the substrate. The second dielectric layer is disposed on the first dielectric layer. The semiconductor layer is adjacent to the first dielectric layer or the second dielectric layer. The semiconductor layer is disposed on the first dielectric layer or the second dielectric layer. The first conductive layer is adjacent to the first dielectric layer or the second dielectric layer. The second conductive layer is disposed on the first dielectric layer or the second dielectric layer. The effective Young's modulus of the second dielectric layer may be smaller than the Young's modulus of the first dielectric layer.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 21, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Jing-Yi YAN, Chih-Chieh HSU, Liang-Hsiang CHEN, Chen-Wei LIN
  • Patent number: 8806391
    Abstract: A method of optical proximity correction (OPC) includes the following steps. At first, a layout pattern is provided to a computer system. Subsequently, the layout pattern is classified into at least a first region and at least a second region. Then, several iterations of OPC calculations are performed to the layout pattern, and a total number of OPC calculations performed in the first region is substantially larger than a total number of OPC calculations performed in the second region. Afterwards, a corrected layout pattern is outputted through the computer system onto a mask.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: August 12, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Te-Hsien Hsieh, Ming-Jui Chen, Cheng-Te Wang, Shih-Ming Kuo, Jing-Yi Lee
  • Publication number: 20140217400
    Abstract: A semiconductor element structure and a manufacturing method for the same are provided. The semiconductor element structure may comprise a gate electrode, a dielectric layer, an active layer, a source, a drain and a protective layer. The active layer and the gate electrode are disposed on opposing sides of the dielectric layer. The source is disposed on the active layer. The drain is disposed on the active layer. The protective layer is disposed on the active layer. The protective layer may have a hydrogen content less than or equal to 0.1 at % and a sheet resistance higher than or equal to 10? 10 Ohm/sq.
    Type: Application
    Filed: January 31, 2014
    Publication date: August 7, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Jing-Yi YAN, Chu-Yin HUNG, Liang-Hsiang CHEN, Hsiao-Chiang YAO, Wu-Wei TSAI
  • Publication number: 20140212371
    Abstract: This invention provides the controlled-release method for a pharmaceutical composition comprising of metals in the drug carrier. The specific chelator is used to trigger the release of active pharmaceutical ingredients from chelating complex micelles. The drug release rate and half-life can also be controlled by manipulating the dosing sequence and the concentration of metal and specific chelator.
    Type: Application
    Filed: January 31, 2013
    Publication date: July 31, 2014
    Inventors: Chia-Hung Chen, Chau-Hui Wang, John-Son Lin, Tieh-Hsiung Chiu, Jing-Yi Chen, Pi-Hung Liao, Chia-Chi Su, Wei-Chuan Liao
  • Patent number: 8785569
    Abstract: This invention provides Chelating Complex Micelles as a drug carrier. The Chelating Complex Micelles can load drugs without changing their structure, and therefore extend the half-life of drugs in the human body. The chelating complex micelles contain a metal ion core, at least one polymer, and at least one drug molecule. The metal ion is considered as a Lewis acid while polymer chain and drug molecules are referred to as Lewis bases. The drug molecule is linked to the polymer via forming coordinate bonds with metal ion, and then self-assembled to form chelating complex micelles as a drug carrier.
    Type: Grant
    Filed: November 21, 2012
    Date of Patent: July 22, 2014
    Assignee: Original Biomedicals Co., Ltd.
    Inventors: Chau-Hui Wang, Chia-Hung Chen, Johnson Lin, Jing-Yi Chen, Wei-Chuan Liao
  • Patent number: 8763243
    Abstract: A fabricating method of a substrate board is provided. The substrate board includes a substrate having rigid areas and flexible areas, and at least an electronic component disposed on the substrate, wherein each of the rigid areas is thicker than the flexible areas. A patterned high-extensive material may be additionally disposed on the substrate to improve reliability thereof. The rigid areas and the flexible areas may be formed by molds or cutters. By using an above structure, the electronic component is less affected when the substrate is under stress, so that good characteristics are maintained.
    Type: Grant
    Filed: June 18, 2012
    Date of Patent: July 1, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Jing-Yi Yan, Shu-Tang Yeh
  • Publication number: 20140178371
    Abstract: This invention concerns in general treatment of diseases and pathological conditions with anti-VEGF antibodies. More specifically, the invention concerns the treatment of human patients susceptible to or diagnosed with cancer using an anti-VEGF antibody, preferably in combination with one or more additional anti-tumor therapeutic agents for the treatment of ovarian cancer.
    Type: Application
    Filed: January 16, 2014
    Publication date: June 26, 2014
    Applicant: GENENTECH, INC.
    Inventors: Jakob Dupont, Cornelia Irl, Amreen Husain, Mika A. Sovak, Jing Yi, Hoa Nguyen
  • Publication number: 20140160710
    Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.
    Type: Application
    Filed: December 6, 2013
    Publication date: June 12, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Jing-Yi Yan, Shu-Tang Yeh, Sheng-Wei Chen, Kuang-Jung Chen
  • Patent number: 8745547
    Abstract: A method for making a photomask layout is disclosed. A graphic data of a photomask is provided. A first correction step is performed to the graphic data. A first verification step is performed to all of the graphic data which has been subjected to the first correction step, wherein at least one failed pattern not passing the first verification step is found. A second correction step is performed to the at least one failed pattern, so as to obtain at least one modified pattern. A second verification step is performed only to at least one buffer region covering the at least one modified pattern, wherein the buffer region has an area less than a whole area of the photomask. Besides, each of the first correction step, the first verification step, the second correction step and the second verification step is executed by a computer.
    Type: Grant
    Filed: July 11, 2013
    Date of Patent: June 3, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Shih-Ming Kuo, Ming-Jui Chen, Te-Hsien Hsieh, Cheng-Te Wang, Jing-Yi Lee
  • Publication number: 20140143468
    Abstract: A real-time sampling device for being coupled to a processing unit includes a first register, a second register, a third register, a trigger output element and a timer for outputting an interrupt signal. The first register externally receives and processes a first input signal to produce processed data. The second register retrieves the processed data from the first register upon receiving the interrupt signal, and the processing unit, upon receiving the interrupt signal, retrieves the processed data from the second register and performs calculation thereon to produce a processed data calculation value and temporarily store the processed data calculation value in the third register. The trigger output element outputs the processed data calculation value in the third register in real time upon receiving the interrupt signal. The real-time sampling device an be applied to digital control systems in order to perform real-time sampling on controlled subjects.
    Type: Application
    Filed: October 24, 2013
    Publication date: May 22, 2014
    Applicant: Industrial Technology Research Institute
    Inventors: Ying-Min CHEN, Wen-Chuan CHEN, Jing-Yi HUANG, Yi-Hsueh YANG, Feng-Chi LEE
  • Patent number: 8678862
    Abstract: A HomePlug having a panel replacement structure includes a HomePlug body and a panel. The HomePlug body has an operation side and a network port. The operation side has an insertion portion and a first coupling portion. The panel has an opening and second coupling portion. The second coupling portion can be coupled to the first coupling portion so as to allow the opening to correspond in position to the insertion portion. Changes in the appearance of the HomePlug are brought about by panel replacement. A heat dissipation vent is disposed at the junction of the operation side and an adjacent side, such that heat dissipation takes place at the adjacent side-neighboring portion of the heat dissipation vent when the panel is coupled to the operation side and covers the operation side.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: March 25, 2014
    Assignee: Askey Computer Corp.
    Inventors: Jing-Yi Peng, Shih-Po Lo
  • Patent number: 8648042
    Abstract: A pharmaceutical polymer and a method for quenching free radicals is described. The pharmaceutical polymer comprises a glycopeptide covalently bound to an aminothiol moiety. The pharmaceutical polymer and method can be applied before or after the occurrence of radiation exposure.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: February 11, 2014
    Assignee: Taiwan Hopax Chems. Mfg. Co., Ltd.
    Inventors: Chau-Hui Wang, Chia-Hung Chen, Jing-Yi Chen, Chih-Wei Hsu