Abstract: The present disclosure relates to a plurality of host materials, an organic electroluminescent compound, and an organic electroluminescent device comprising the same. By comprising a specific combination of host compounds and/or an organic electroluminescent compound according to the present disclosure as an organic electroluminescent material, an organic electroluminescent device having low driving voltage and/or high luminous efficiency and/or long lifespan characteristics can be provided.

Abstract: A semiconductor package includes a first package substrate having a first region and a second region, which do not overlap each other, a first connection element having a first height on the first region, a first semiconductor chip having a second height connected to the first connection element, a second connection element having a third height on the second region, a third connection element having a fourth height on the second connection element and electrically connected to the second connection element, a second package on the third connection element, the second package including a second package substrate and a second semiconductor chip, and a first mold layer covering at least a portion of the first semiconductor chip, covering at least a portion of the second connection element, covering the first package substrate, exposing upper surfaces of the first semiconductor chip and the second connection element, and having a fifth height.

Abstract: Disclosed herein are a decoding method and apparatus and an encoding method and apparatus for deriving an intra-prediction mode. An intra-prediction mode may be derived using a method for deriving an intra-prediction mode based on a neighbor block of the target block, a method for deriving an intra-prediction mode using signaling of the intra-prediction mode of the target block, or a method for deriving an adaptive intra-prediction mode based on the type of a target slice. An MPM list may be used to derive the intra-prediction mode, and a temporal neighbor block or the like may be used to configure the MPM list.

Abstract: Provided are a method and apparatus for providing a network switching service to a user equipment.

Abstract: The present invention provides a pharmaceutical composition for prevention or treatment of a stress disease and depression, the pharmaceutical composition be safely useable without toxicity and side effects by using an extract of leaves of Vaccinium bracteatum Thunb., which is natural resource of Korea, so that the reduction of manufacturing and production costs and the import substitution and export effects can be expected through the replacement of a raw material for preparation with a plant inhabiting in nature.

Abstract: A semiconductor package includes a first package substrate having a first area and a second area that is distinct and separate from the first area, a first connection element disposed on the first area and having a first thickness, a first semiconductor chip connected to the first connection element, a second connection element disposed on the second area and having a second thickness that is greater than the first thickness, a third connection element disposed on the second connection element and electrically connected to the second connection element, a second package substrate disposed on the third connection element, and a second semiconductor chip disposed on the second package substrate.

Abstract: Disclosed is a case for a battery module including a body having an internal space; and an end plate disposed on an end of the body, wherein the body includes a bottom plate on which a coolant flow path through which a coolant flows is formed, and wherein the end plate includes a coolant flow tube through which the coolant flows and a connection portion extending from the coolant flow tube and coupled to the coolant flow path.

Abstract: Provided are a method and apparatus for a user equipment, a core network, and a second device to enable bidirectional communication for second devices. The method of the second device may include receiving internet protocol (IP) configuration information for automatically configuring an IP version 6 (IPv6) address of the second device from a core network through a user equipment; generating the IPv6 address using information in the IP configuration information; and transmitting the generated IPv6 address to the core network through the UE.

Abstract: Discussed are a light-emitting device and a light-emitting display device having improved efficiency and increased lifespan. A plurality of stacks is provided between an anode and a cathode for at least a subpixel to emit a predetermined color, and emissive layers in different stacks include the same color-based materials having different luminous properties.

Abstract: An optical imaging system includes a first lens having positive refractive power, a second lens having negative refractive power, a third lens, a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens disposed in order from an object side. A refractive index of the second lens is greater than a refractive index of each of the first lens and the third lens. The optical imaging system satisfies TTL/(2×IMG HT)<0.6 and 0<f1/f<1.4, where TTL is a distance on an optical axis from an object-side surface of the first lens to an imaging plane, IMG HT is half a diagonal length of the imaging plane, f is a total focal length of the optical imaging system, and f1 is a focal length of the first lens.

Abstract: An image encoding/decoding method is provided. An image decoding method of the present invention may comprise deriving an intra-prediction mode of a current luma block, deriving an intra-prediction mode of a current chroma block based on the intra-prediction mode of the current luma block, generating a prediction block of the current chroma block based on the intra-prediction mode of the current chroma block, and the deriving of an intra-prediction mode of a current chroma block may comprise determining whether or not CCLM (Cross-Component Linear Mode) can be performed for the current chroma block.

Abstract: A removable fastening system includes a rail unit located in a vehicle, an electrode portion located at the inner side of the rail unit, a fixing unit having one end inserted to be fixed to the rail unit, and a mounting unit mounted at another end of the fixing unit, wherein the fixing unit is inserted into the rail unit and has a conductive portion rotated to be brought into contact with the electrode portion.

Abstract: An ultrasonic image providing method of the present disclosure includes: receiving ultrasonic images; measuring a plurality of similarities for a plurality of measurement items for at least one of the ultrasonic images; comparing the plurality of similarities with corresponding default thresholds, respectively; when none of the plurality of similarities is greater than the corresponding default threshold, selecting a measurement item maintaining the greatest similarity among the plurality of similarities for a reference time; and providing an ultrasonic image for the selected measurement item as an ultrasonic image.

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a first substrate, a first semiconductor chip on the first substrate, a molding layer on the first substrate and the first semiconductor chip and has a plurality of recesses, a plurality of substrate connection terminals on the first substrate and in the plurality of recesses, and a second semiconductor chip on the plurality of substrate connection terminals. The plurality of recesses and the plurality of substrate connection terminals are horizontally spaced apart from the first semiconductor chip. The molding layer is spaced apart from the second semiconductor chip.

Abstract: A display apparatus including a display and a supporter. The supporter being mounted on the display and configured to support the display and rotate the display module between a first position and a second position. The supporter including a drive motor, a first gear, and a detection sensor. The drive motor configured to supply a driving force to rotate the display. The first gear configured to rotate together with the display by receiving the driving force from the drive motor. The detection sensor configured to detect a rotation amount of a second gear configured to rotate in with the first gear.

Abstract: A battery module including at least one battery cell; a module case in which the at least one battery cell is accommodated, and including a lower plate and a side plate forming an internal space; and a thermally conductive coating layer formed on an internal surface of the lower plate or an internal surface of the lower plate and an internal surface of the side plate, and having a thickness of 70 ?m to 130 ?m, wherein the thermally conductive coating layer includes a polymeric binder resin and an inorganic filler, is disclosed.

Abstract: The present invention relates to a method of non-destructively measuring a thickness of a reinforcement membrane, and more particularly, to a method of non-destructively measuring a thickness of a hydrogen ion exchange reinforcement membrane for a fuel cell, in which the reinforcement membrane has a symmetric three-layer structure including a reinforcement base layer and pure water layers disposed at opposing sides of the reinforcement base layer, including performing total non-destructive inspection and omitting a process of analyzing a position by means of a thickness peak of a power spectrum of the respective layers of the reinforcement membrane.

Abstract: Examples relate to a die interconnect substrate comprising a bridge die comprising at least one bridge interconnect connecting a first bridge die pad of the bridge die to a second bridge die pad of the bridge die. The die interconnect substrate further comprises a substrate structure comprising a substrate interconnect electrically insulated from the bridge die, wherein the bridge die is embedded in the substrate structure. The die interconnect substrate further comprises a first interface structure for attaching a semiconductor die to the substrate structure, wherein the first interface structure is connected to the first bridge die pad. The die interconnect substrate further comprises a second interface structure for attaching a semiconductor die to the substrate structure, wherein the second interface structure is connected to the substrate interconnect. A surface of the first interface structure and a surface of the second interface structure are at the same height.