Patents by Inventor Joachim Mahler

Joachim Mahler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic Component
    Publication number: 20130021766
    Abstract: An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.
    Type: Application
    Filed: July 19, 2011
    Publication date: January 24, 2013
    Applicant: Infineon Technologies AG
    Inventors: Joachim Mahler, Manfred Mengel, Khalil Hosseini, Klaus Schmidt, Franz-Peter Kalz
  • Semiconductor component having a stack of semiconductor chips and method for producing the same
    Patent number: 8354299
    Abstract: A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.
    Type: Grant
    Filed: February 9, 2005
    Date of Patent: January 15, 2013
    Assignee: Infineon Technologies AG
    Inventors: Michael Bauer, Thomas Engling, Alfred Haimerl, Angela Kessler, Joachim Mahler, Wolfgang Schober
  • LAMINATE ELECTRONIC DEVICE
    Publication number: 20130010446
    Abstract: A laminate electronic device comprises a first semiconductor chip, the first semiconductor chip defining a first main face and a second main face opposite to the first main face, and having at least one electrode pad on the first main face. The laminate electronic device further comprises a carrier having a first structured metal layer arranged at a first main surface of the carrier. The first structured metal layer is bonded to the electrode pad via a first bond layer of a conductive material, wherein the first bond layer has a thickness of less than 10 ?m. A first insulating layer overlies the first main surface of the carrier and the first semiconductor chip.
    Type: Application
    Filed: January 10, 2012
    Publication date: January 10, 2013
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ewe Henrik, Joachim Mahler, Anton Prueckl, Ivan Nikitin
  • Semiconductor device including electronic component coupled to a backside of a chip
    Patent number: 8350382
    Abstract: A semiconductor package includes a substrate, at least one chip including a first side and a backside opposite of the first side, the first side electrically coupled to the substrate, a conductive layer coupled to the backside of the at least one chip, and at least one electronic component coupled to the conductive layer and in electrical communication with the substrate.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: January 8, 2013
    Assignee: Infineon Technologies AG
    Inventors: Edward Fürgut, Joachim Mahler, Michael Bauer
  • METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE
    Publication number: 20130001803
    Abstract: A method for attaching a metal surface to a carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier.
    Type: Application
    Filed: June 30, 2011
    Publication date: January 3, 2013
    Applicant: Infineon Technologies AG
    Inventors: Manfred Mengel, Joachim Mahler, Khalil Hosseini, Horst Theuss
  • METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE
    Publication number: 20120327614
    Abstract: A method for attaching a metal surface to a carrier is provided, the method including: forming a first polymer layer over the metal surface; forming a second polymer layer over a surface of the carrier; and bringing the first polymer layer into physical contact with the second polymer layer such that at least one of an interpenetrating polymer structure and an inter-diffusing polymer structure is formed between the first polymer layer and the second polymer layer.
    Type: Application
    Filed: June 27, 2011
    Publication date: December 27, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz
  • Integrated circuit device and method for the production thereof
    Patent number: 8330252
    Abstract: An integrated circuit device includes a semiconductor chip and a control chip at different supply potentials. A lead chip island includes an electrically conductive partial region and an insulation layer. The semiconductor chip is arranged on the electrically conductive partial region of the lead chip island and the control chip is cohesively fixed on the insulation layer.
    Type: Grant
    Filed: October 10, 2007
    Date of Patent: December 11, 2012
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Reimund Engl, Thomas Behrens, Wolfgang Kuebler, Rainald Sander
  • ELECTRONIC MODULE
    Publication number: 20120306069
    Abstract: An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 ?m.
    Type: Application
    Filed: August 14, 2012
    Publication date: December 6, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Stefan Landau, Erwin Huber, Josef Hoeglauer, Joachim Mahler, Tino Karczeweski
  • Semiconductor device including spacer element
    Patent number: 8304884
    Abstract: A semiconductor device includes a metal carrier and a spacer element attached to the metal carrier. The semiconductor device includes a first sintered metal layer on the spacer element and a semiconductor chip on the first sintered metal layer.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: November 6, 2012
    Assignee: Infineon Technologies AG
    Inventors: Ivan Nikitin, Joachim Mahler, Thomas Behrens
  • Semiconductor Device and Bonding Wire
    Publication number: 20120267784
    Abstract: A semiconductor device includes a semiconductor chip, a contact pad of the semiconductor chip and a first layer arranged over the contact pad. The first layer includes niobium, tantalum or an alloy including niobium and tantalum.
    Type: Application
    Filed: April 19, 2011
    Publication date: October 25, 2012
    Applicant: Infineon Technologies AG
    Inventors: Khalil Hosseini, Manfred Mengel, Joachim Mahler
  • METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
    Publication number: 20120267774
    Abstract: One aspect is a method of manufacturing a semiconductor device and semiconductor device. One embodiment provides a plurality of modules. Each of the modules includes a carrier and at least one semiconductor chip attached to the carrier. A dielectric layer is applied to the modules to form a workpiece. The dielectric layer is structured to open at least one of the semiconductor chips. The workpiece is singulated to obtain a plurality of devices.
    Type: Application
    Filed: June 14, 2012
    Publication date: October 25, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Henrik Ewe, Joachim Mahler, Anton Prueckl
  • Method of manufacturing semiconductor devices
    Patent number: 8288207
    Abstract: A method of manufacturing a semiconductor device. The method includes providing a metal carrier, attaching chips to the carrier, and applying a metal layer over the chips and the metal carrier to electrically couple the chips to the metal carrier. The metal carrier is segmented, after applying the metal layer, to obtain metal contact elements.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: October 16, 2012
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Edward Fuergut, Manfred Mengel
  • Electronic component with buffer layer
    Patent number: 8283756
    Abstract: An electronic component includes a metal substrate, a semiconductor chip configured to be attached to the metal substrate, and a buffer layer positioned between the metal substrate and the semiconductor chip configured to mechanically decouple the semiconductor chip and the metal substrate. The buffer layer extends across less than an entire bottom surface of the semiconductor chip.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: October 9, 2012
    Assignee: Infineon Technologies AG
    Inventors: Ivan Galesic, Joachim Mahler, Alexander Heinrich, Khalil Hosseini
  • SEMICONDUCTOR COMPONENT AND PRODUCTION METHOD
    Publication number: 20120223424
    Abstract: Semiconductor component and method for production of a semiconductor component. The invention relates to a semiconductor component having a semiconductor chip, which is arranged on a substrate, in one embodiment on a chip carrier, and an encapsulation material, which at least partially surrounds the semiconductor chip. The chip carrier is at least partly provided with a layer of polymer foam.
    Type: Application
    Filed: May 1, 2012
    Publication date: September 6, 2012
    Applicant: Infineon Technologies AG
    Inventors: Joachim Mahler, Alfred Haimerl, Michael Bauer, Angela Kessler, Wolfgang Schober
  • Electronic module
    Patent number: 8253241
    Abstract: An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 ?m.
    Type: Grant
    Filed: May 20, 2008
    Date of Patent: August 28, 2012
    Assignee: Infineon Technologies AG
    Inventors: Stefan Landau, Erwin Huber, Josef Hoeglauer, Joachim Mahler, Tino Karczeweski
  • Device Including Two Semiconductor Chips and Manufacturing Thereof
    Publication number: 20120187565
    Abstract: A device includes a first semiconductor chip with a first contact pad on a first face and a second semiconductor chip with a first contact pad on a first face. The second semiconductor chip is placed over the first semiconductor chip, wherein the first face of the first semiconductor chip faces the first face of the second semiconductor chip. Exactly one layer of an electrically conductive material is arranged between the first semiconductor chip and the second semiconductor chip. The exactly one layer of an electrically conductive material electrically couples the first contact pad of the first semiconductor chip to the first contact pad of the second semiconductor chip.
    Type: Application
    Filed: January 25, 2011
    Publication date: July 26, 2012
    Inventors: Henrik Ewe, Joachim Mahler, Anton Prueckl, Stefan Landau
  • Method of manufacturing a semiconductor device
    Patent number: 8201326
    Abstract: One aspect is a method of manufacturing a semiconductor device and semiconductor device. One embodiment provides a plurality of modules. Each of the modules includes a carrier and at least one semiconductor chip attached to the carrier. A dielectric layer is applied to the modules to form a workpiece. The dielectric layer is structured to open at least one of the semiconductor chips. The workpiece is singulated to obtain a plurality of devices.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: June 19, 2012
    Assignee: Infineon Technologies AG
    Inventors: Henrik Ewe, Joachim Mahler, Anton Prueckl
  • DIE ARRANGEMENT AND METHOD OF FORMING A DIE ARRANGEMENT
    Publication number: 20120146201
    Abstract: A die arrangement includes a carrier having a first side and a second side opposite the first side, the carrier including an opening leading from the first side of the carrier to the second side of the carrier; a first die disposed over the first side of the carrier and electrically contacting the carrier; a second die disposed over the second side of the carrier and electrically contacting the carrier; and an electrical contact structure leading through the opening in the carrier and electrically contacting the second die.
    Type: Application
    Filed: December 14, 2010
    Publication date: June 14, 2012
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Frank Daeche, Joachim Mahler, Anton Prueckl, Stefan Landau, Josef Hoeglauer
  • Integrated circuit device and method
    Patent number: 8187964
    Abstract: An integrated circuit device includes a semiconductor chip with a metallization layer on the chip. A gas-phase deposited insulation layer is disposed on the metallization layer.
    Type: Grant
    Filed: October 19, 2009
    Date of Patent: May 29, 2012
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Thomas Behrens, Ivan Galesic
  • Semiconductor component and production method
    Patent number: 8178390
    Abstract: A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provided with a layer of polymer foam.
    Type: Grant
    Filed: February 20, 2006
    Date of Patent: May 15, 2012
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Alfred Haimerl, Michael Bauer, Angela Kessler, Wolfgang Schober