Patents by Inventor Joachim Mahler

Joachim Mahler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • TEMPERATURE SENSOR
    Publication number: 20170082502
    Abstract: Temperature sensor devices and corresponding methods are provided. A temperature sensor may include a first layer being essentially non-conductive in a temperature range and a second layer having a varying resistance in the temperature range.
    Type: Application
    Filed: December 5, 2016
    Publication date: March 23, 2017
    Inventors: Christian Kegler, Johannes Georg Laven, Hans-Joachim Schulze, Guenther Ruhl, Joachim Mahler
  • Semiconductor device
    Patent number: 9583413
    Abstract: A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator and the first chip.
    Type: Grant
    Filed: February 13, 2009
    Date of Patent: February 28, 2017
    Assignee: Infineon Technologies AG
    Inventors: Ivan Nikitin, Joachim Mahler, Thomas Behrens
  • Semiconductor devices with transistor cells and thermoresistive element
    Patent number: 9576944
    Abstract: A semiconductor device includes a first load terminal electrically coupled to a source zone of a transistor cell. A gate terminal is electrically coupled to a gate electrode which is capacitively coupled to a body zone of the transistor cell. The source and body zones are formed in a semiconductor portion. A thermoresistive element is thermally connected to the semiconductor portion and is electrically coupled between the gate terminal and the first load terminal. Above a maximum operation temperature specified for the semiconductor device, an electric resistance of the thermoresistive element decreases by at least two orders of magnitude within a critical temperature span of at most 50 Kelvin.
    Type: Grant
    Filed: December 4, 2015
    Date of Patent: February 21, 2017
    Assignee: Infineon Technologies AG
    Inventors: Johannes Georg Laven, Christian Jaeger, Joachim Mahler, Daniel Pedone, Anton Prueckl, Hans-Joachim Schulze, Andre Schwagmann, Patrick Schwarz
  • Micromechanical semiconductor sensing device
    Patent number: 9567211
    Abstract: Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
    Type: Grant
    Filed: April 15, 2015
    Date of Patent: February 14, 2017
    Assignee: Infineon Technologies AG
    Inventors: Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Joachim Mahler, Manfred Mengel
  • Semiconductor Devices, a Semiconductor Diode and a Method for Forming a Semiconductor Device
    Publication number: 20170040431
    Abstract: A semiconductor device includes at least one highly doped region of an electrical device arrangement formed in a semiconductor substrate and a contact structure including an NTC (negative temperature coefficient of resistance) portion arranged adjacent to the at least one highly doped region at a front side surface of the semiconductor substrate. The NTC portion includes a negative temperature coefficient of resistance material.
    Type: Application
    Filed: August 5, 2016
    Publication date: February 9, 2017
    Inventors: Thomas Basler, Joachim Mahler, Hans-Joachim Schulze
  • Electronic component
    Patent number: 9559078
    Abstract: An electronic component includes an electrically conductive carrier. The electrically conductive carrier includes a carrier surface and a semiconductor chip includes a chip surface. One or both of the carrier surface and the chip surface include a non-planar structure. The chip is attached to the carrier with the chip surface facing towards the carrier surface so that a gap is provided between the chip surface and the carrier surface due to the non-planar structure of one or both of the carrier surface and the first chip surface. The electronic component further includes a first galvanically deposited metallic layer situated in the gap.
    Type: Grant
    Filed: December 23, 2014
    Date of Patent: January 31, 2017
    Assignee: Infineon Technologies AG
    Inventors: Joachim Mahler, Manfred Mengel, Khalil Hosseini, Klaus Schmidt, Franz-Peter Kalz
  • Primer composition, method of forming a primer layer on a semiconductor device, and method of encapsulating a semiconductor device
    Patent number: 9540539
    Abstract: A primer composition is provided. The primer composition includes at least one bi- or multi-functional benzoxazine compound; and at least one compound including a functional group having affinity for a metallic surface, and a cross-linkable group. A method of forming a primer layer on a semiconductor device, and a method of encapsulating a semiconductor device are also provided.
    Type: Grant
    Filed: May 27, 2014
    Date of Patent: January 10, 2017
    Assignee: Infineon Technologies AG
    Inventors: Swee Kah Lee, Joachim Mahler, Chew Theng Tai, Yik Yee Tan, Soon Lock Goh, Poh Cheng Lim, Jagen Krishnan, Peh Hean Teh
  • CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
    Publication number: 20170004979
    Abstract: A chip arrangement is provided, the chip arrangement, including a carrier; a first chip electrically connected to the carrier; a ceramic layer disposed over the carrier; and a second chip disposed over the ceramic layer; wherein the ceramic layer has a porosity in the range from about 3% to about 70%.
    Type: Application
    Filed: September 19, 2016
    Publication date: January 5, 2017
    Inventors: Manfred Mengel, Joachim Mahler, Khalil Hosseini, Franz-Peter Kalz
  • Micromechanical Semiconductor Sensing Device
    Publication number: 20170003180
    Abstract: A micromechanical semiconductor sensing device is disclosed. In an embodiment the sensing device includes a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, the piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal.
    Type: Application
    Filed: September 16, 2016
    Publication date: January 5, 2017
    Inventors: Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Khalil Hosseini, Joachim Mahler, Manfred Mengel
  • Method for forming electronic components
    Patent number: 9530752
    Abstract: A method which comprises arranging a plurality of electronic chips in a plurality of chip accommodation cavities each defined by a respective surface portion of a substrate and a wall delimited by a respective one of a plurality of holes in an electrically conductive frame arranged on the substrate, at least partially encapsulating the electronic chips in the chip accommodation cavities by an encapsulant, and forming electrically conductive contacts for electrically contacting the at least partially encapsulated electronic chips.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: December 27, 2016
    Assignee: Infineon Technologies AG
    Inventors: Ivan Nikitin, Petteri Palm, Joachim Mahler
  • Chip package and chip assembly
    Patent number: 9530754
    Abstract: A chip package is provided. The chip package may include an electrically conductive carrier; at least one first chip including a first side and a second side opposite of the first side, with its second side being electrically contacted to the electrically conductive carrier; an insulating layer over at least a part of the electrically conductive carrier and over at least a part of the first side of the chip; at least one second chip arranged over the insulating layer and next to the first chip; encapsulating material over the first chip and the second chip; and electrical contacts which extend through the encapsulation material to at least one contact of the at least one first chip and to at least one contact of the at least one second chip.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: December 27, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Khalil Hosseini, Joachim Mahler, Franz-Peter Kalz, Joachim Voelter, Ralf Wombacher
  • ARRANGEMENT OF MULTIPLE POWER SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160358886
    Abstract: A semiconductor power arrangement includes a chip carrier having a first surface and a second surface opposite the first surface. The semiconductor power arrangement further includes a plurality of power semiconductor chips attached to the chip carrier, wherein the power semiconductor chips are inclined to the first and/or second surface of the chip carrier.
    Type: Application
    Filed: June 2, 2016
    Publication date: December 8, 2016
    Applicant: Infineon Technologies AG
    Inventors: Georg Meyer-Berg, Edward Fuergut, Joachim Mahler
  • Temperature sensor
    Patent number: 9515243
    Abstract: Temperature sensor devices and corresponding methods are provided. A temperature sensor may include a first layer being essentially non-conductive in a temperature range and a second layer having a varying resistance in the temperature range.
    Type: Grant
    Filed: December 22, 2014
    Date of Patent: December 6, 2016
    Assignee: Infineon Technologies AG
    Inventors: Christian Kegler, Johannes Georg Laven, Hans-Joachim Schulze, Guenther Ruhl, Joachim Mahler
  • Integrated circuit and method of manufacturing an integrated circuit
    Patent number: 9496228
    Abstract: In various embodiments, an integrated circuit is provided. The integrated circuit may include a semiconductor chip and an electrically conductive composite material fixed to the semiconductor chip, wherein the electrically conductive composite material may include a metal, and wherein a coefficient of thermal expansion (CTE) value of the electrically conductive composite material may be lower than the CTE value of the metal.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: November 15, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Edward Fuergut, Joachim Mahler, Ivan Nikitin
  • Multichip power semiconductor device
    Patent number: 9443760
    Abstract: An electronic device includes a first chip carrier and a second chip carrier isolated from the first chip carrier. A first power semiconductor chip is mounted on and electrically connected to the first chip carrier. A second power semiconductor chip is mounted on and electrically connected to the second chip carrier. An electrically insulating material is configured to at least partially surround the first power semiconductor chip and the second power semiconductor chip. An electrical interconnect is configured to electrically connect the first power semiconductor chip to the second power semiconductor chip, wherein the electrical interconnect has at least one of a contact clip and a galvanically deposited conductor.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: September 13, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Joachim Mahler, Thomas Bemmerl, Anton Prueckl
  • Chip package and method for manufacturing the same
    Patent number: 9437548
    Abstract: Various embodiments provide a chip package. The chip package may include a metallic chip carrier; at least one chip carried by the metallic chip carrier; encapsulation material encapsulating the at least one chip and the metallic chip carrier; and a plurality of redistribution layers disposed over the at least one chip opposite the metallic chip carrier, wherein at least one redistribution layer of the plurality of redistribution layers is electrically coupled with the at least one chip.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: September 6, 2016
    Assignee: INFINEON TECHNOLOGIES AUSTRIA AG
    Inventors: Henrik Ewe, Anton Prueckl, Joachim Mahler, Frank Daeche, Josef Hoeglauer, Riccardo Pittassi
  • Method for Electrophoretically Depositing a Film on an Electronic Assembly
    Publication number: 20160240449
    Abstract: A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements.
    Type: Application
    Filed: April 11, 2016
    Publication date: August 18, 2016
    Inventors: Joachim Mahler, Manfred Mengel, Khalil Hosseini, Franz-Peter Kalz
  • Electronic power device and method of fabricating an electronic power device
    Patent number: 9420731
    Abstract: An electronic device comprises a power module comprising a first main surface and a second main surface opposite to the first main surface, wherein at least a portion of the first main surface is configured as a heat dissipating surface without electrical power terminal functionality. The electronic device comprises a porous metal layer arranged on the portion of the first main surface.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: August 16, 2016
    Assignee: Infineon Technologies Austria AG
    Inventors: Khalil Hosseini, Joachim Mahler, Ivan Nikitin
  • INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT
    Publication number: 20160211226
    Abstract: In various embodiments, an integrated circuit is provided. The integrated circuit may include a semiconductor chip and an electrically conductive composite material fixed to the semiconductor chip, wherein the electrically conductive composite material may include a metal, and wherein a coefficient of thermal expansion (CTE) value of the electrically conductive composite material may be lower than the CTE value of the metal.
    Type: Application
    Filed: January 5, 2016
    Publication date: July 21, 2016
    Inventors: Edward Fuergut, Joachim Mahler, Ivan Nikitin
  • Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit
    Patent number: 9397018
    Abstract: A chip arrangement is provided, the chip arrangement, including a carrier; at least one chip electrically connected to a carrier top side; an encapsulation material at least partially surrounding the at least one chip and the carrier top side, wherein the encapsulation material is formed on one or more lateral sides of the carrier; and a ceramic material disposed on a carrier bottom side, and on at least one side of the encapsulation material.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: July 19, 2016
    Assignee: Infineon Technologies AG
    Inventors: Ralf Otremba, Josef Hoeglauer, Juergen Schredl, Xaver Schloegel, Wolfram Hable, Manfred Mengel, Joachim Mahler, Khalil Hosseini