Patents by Inventor Johannes Classen

Johannes Classen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10017376
    Abstract: Measures are described which contribute simply and reliably to the mechanical decoupling of a MEMS functional element from the structure of a MEMS element. The MEMS element includes at least one deflectable functional element, which is implemented in a layered structure on a MEMS substrate, so that a space exists between the layered structure and the MEMS substrate, at least in the area of the functional element. According to the invention, a stress decoupling structure is formed in the MEMS substrate in the form of a blind hole-like trench structure, which is open to the space between the layered structure and the MEMS substrate and extends into the MEMS substrate to only a predefined depth, so that the rear side of the MEMS substrate is closed, at least in the area of the trench structure.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: July 10, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Johannes Classen, Jochen Reinmuth, Mirko Hattass, Ralf Reichenbach, Antoine Puygranier
  • Patent number: 9958348
    Abstract: A micromechanical pressure sensor device and a corresponding manufacturing method. The micromechanical pressure sensor device includes an ASIC wafer having a front side and a rear side, and a rewiring system, formed on the front side of the ASIC wafer, which includes a plurality of stacked strip conductor levels and insulation layers. The pressure sensor device also includes a MEMS wafer having a front side and a rear side, a first micromechanical functional layer which is formed above the front side of the MEMS wafer, and a second micromechanical functional layer which is formed above the first micromechanical functional layer.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: May 1, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Johannes Classen, Jochen Reinmuth, Arnd Kaelberer
  • Patent number: 9926188
    Abstract: A sensor unit including a first semiconductor component and a second semiconductor component, the first semiconductor component including a first substrate and a sensor structure. The second semiconductor component includes a second substrate, the first and second semiconductor components being connected to each other with the aid of a wafer connection, the sensor unit having a decoupling structure, which is configured in such a way that the sensor structure is decoupled thermally and/or mechanically from the second semiconductor component.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: March 27, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Johannes Classen, Torsten Kramer, Hubert Benzel, Jens Frey, Daniel Christoph Meisel, Christoph Schelling
  • Patent number: 9863781
    Abstract: A yaw rate sensor (10) includes a movable mass structure (12) and a drive component (13) which is suitable for setting the movable mass structure (12) in motion (14), and an analysis component (15) which is suitable for detecting a response (40) of the movable mass structure (12) to a yaw rate (?). A method for functional testing of a yaw rate sensor (10) includes the following steps: driving a movable mass structure (12), feeding a test signal (42) into a quadrature control loop (44) at a feed point (48) of the quadrature control loop (44), feeding back a deflection (40) of the movable mass structure (12), detecting a measure of the feedback of the movable mass structure (12), and reading out the response signal (47) from the quadrature control loop (44).
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: January 9, 2018
    Assignee: ROBERT BOSCH GMBH
    Inventors: Wolfram Bauer, Johannes Classen, Rainer Willig, Matthias Meier, Burkhard Kuhlmann, Mathias Reimann, Ermin Esch, Hans-Dieter Schwarz, Michael Veith, Christoph Lang, Udo-Martin Gomez
  • Patent number: 9840410
    Abstract: A method for manufacturing a micromechanical component, including: providing a MEMS wafer; structuring the MEMS wafer proceeding from a surface of a second substrate layer of the MEMS wafer, at least one electrically conducting connection being formed between a first substrate layer and the second substrate layer of the MEMS wafer; providing a cap wafer; joining the MEMS wafer to the cap wafer; structuring the MEMS wafer proceeding from a surface of the first substrate layer of the MEMS wafer; providing an ASIC wafer; and joining the ASIC wafer to the joint of the MEMS wafer and the cap wafer.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: December 12, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventor: Johannes Classen
  • Publication number: 20170341927
    Abstract: A micromechanical sensor that is produced surface-micromechanically includes at least one mass element formed in a third functional layer that is non-perforated at least in certain portions. The sensor has a gap underneath the mass element that is formed by removal of a second functional layer and at least one oxide layer. The removal of the at least one oxide layer takes place by introducing a gaseous etching medium into a defined number of etching channels arranged substantially parallel to one another. The etching channels are configured to be connected to a vertical access channel in the third functional layer.
    Type: Application
    Filed: April 28, 2017
    Publication date: November 30, 2017
    Inventors: Benny Pekka Herzogenrath, Johannes Classen
  • Patent number: 9751751
    Abstract: A micromechanical component includes a sensor chip and a cap chip connected to the sensor chip. A cavity is formed between the sensor chip and the cap chip. The sensor chip has a movable element situated in the cavity. The cap chip has a wiring level containing an electrically conductive electrode. The cap chip has a getter element situated in the cavity.
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: September 5, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Jochen Reinmuth, Johannes Classen
  • Publication number: 20170203958
    Abstract: A sensor unit including a first semiconductor component and a second semiconductor component, the first semiconductor component including a first substrate and a sensor structure. The second semiconductor component includes a second substrate, the first and second semiconductor components being connected to each other with the aid of a wafer connection, the sensor unit having a decoupling structure, which is configured in such a way that the sensor structure is decoupled thermally and/or mechanically from the second semiconductor component.
    Type: Application
    Filed: February 5, 2015
    Publication date: July 20, 2017
    Inventors: Johannes CLASSEN, Torsten KRAMER, Hubert BENZEL, Jens FREY, Daniel Christoph MEISEL, Christoph SCHELLING
  • Patent number: 9709451
    Abstract: A micromechanical pressure sensor device includes: an MEMS wafer having a front side and a rear side; a first micromechanical functional layer formed above the front side of the MEMS wafer; and a second micromechanical functional layer formed above the first micromechanical functional layer. A deflectable first pressure detection electrode is formed in one of the first and second micromechanical functional layers. A fixed second pressure detection electrode is formed spaced apart from and opposite the deflectable first pressure detection electrode. An elastically deflectable diaphragm area is formed above the front side of the MEMS wafer. An external pressure is applied to the diaphragm area via an access opening in the MEMS wafer, and the wafer is connected to the deflectable first pressure detection electrode via a plug-like joining area.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: July 18, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Arnd Kaelberer, Jochen Reinmuth, Johannes Classen
  • Patent number: 9689676
    Abstract: A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: June 27, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Reinhard Neul, Johannes Classen, Torsten Ohms, Burkhard Kuhlmann, Axel Franke, Oliver Kohn, Daniel Christoph Meisel, Joerg Hauer, Udo-Martin Gomez, Kersten Kehr
  • Patent number: 9650236
    Abstract: A micromechanical sensor device includes: a MEMS element; an ASIC element; a bonding structure provided between the MEMS element and the ASIC element; a layer assemblage having insulating layers and functional layers disposed alternatingly on one another; a sensing element movable in a sensing direction provided in at least one of the functional layers; a spacing element for providing a defined spacing between the MEMS element and the ASIC element being provided by way of a further functional layer; an abutment element having the spacing element and a first bonding layer being disposed on the sensing element; and an insulating layer being disposed on the ASIC element in an abutment region of the abutment element.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: May 16, 2017
    Assignee: Robert Bosch GmbH
    Inventor: Johannes Classen
  • Patent number: 9650240
    Abstract: Measures are provided for improving and simplifying metallic bonding processes which enable a reliable initiation of the bonding process and thus contribute to a uniform bonding. The present method provides a further option for using bonding layers. The method in the case of which the two semiconductor elements are bonded to one another via a bond of at least one metallic starting layer and at least one further starting layer provides that the two starting layers are structured in such a way that the layer areas which are assigned to one another have differently sized areal extents. Moreover, the layer thicknesses of the two starting layers should be selected in such a way that the layer areas which are assigned to one another meet the material ratio necessary for the bonding process.
    Type: Grant
    Filed: June 4, 2015
    Date of Patent: May 16, 2017
    Assignee: Robert Bosch GmbH
    Inventors: Mirko Hattass, Heiko Stahl, Jochen Reinmuth, Julian Gonska, Johannes Classen
  • Patent number: 9651377
    Abstract: A yaw rate sensor includes: a first sensor structure having a first oscillating mass and configured to detect a first yaw rate around a first axis of rotation; a second sensor structure having a second oscillating mass and configured to detect second and third yaw rates around second and third axes of rotation, respectively; and a drive structure coupled to the first and second oscillating masses. The first oscillating mass is drivable into a first drive oscillation along a first oscillation direction, and the second oscillating mass is drivable into a second drive oscillation along a second oscillation direction different from the first oscillation direction. The first axis of rotation is perpendicular to the first oscillation direction, and the second and third axes of rotation are perpendicular to the second oscillation direction.
    Type: Grant
    Filed: June 24, 2014
    Date of Patent: May 16, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Thorsten Balslink, Hendrik Specht, Johannes Classen
  • Publication number: 20170096331
    Abstract: Measures are described which contribute simply and reliably to the mechanical decoupling of a MEMS functional element from the structure of a MEMS element. The MEMS element includes at least one deflectable functional element, which is implemented in a layered structure on a MEMS substrate, so that a space exists between the layered structure and the MEMS substrate, at least in the area of the functional element. According to the invention, a stress decoupling structure is formed in the MEMS substrate in the form of a blind hole-like trench structure, which is open to the space between the layered structure and the MEMS substrate and extends into the MEMS substrate to only a predefined depth, so that the rear side of the MEMS substrate is closed, at least in the area of the trench structure.
    Type: Application
    Filed: May 29, 2015
    Publication date: April 6, 2017
    Inventors: Johannes Classen, Jochen Reinmuth, Mirko Hattass, Ralf Reichenbach, Antoine Puygranier
  • Patent number: 9606141
    Abstract: A micromechanical sensor device, having a first unhoused sensor unit, and at least one second unhoused sensor unit, the sensor units being functionally connected to one another, the sensor units being essentially vertically configured one over the other so that a sensor unit having a larger footprint completely covers a sensor unit having a smaller footprint.
    Type: Grant
    Filed: November 6, 2014
    Date of Patent: March 28, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Jens Frey, Arnd Kaelberer, Jochen Reinmuth, Johannes Classen
  • Publication number: 20170081177
    Abstract: An interposer is provided which is made up of a flat carrier substrate including at least one front wiring plane, in which front terminal pads are formed for mounting a component on the interposer, including at least one rear wiring plane, in which rear terminal pads are formed for mounting on a component carrier, the front terminal pads and the rear terminal pads being arranged offset from each other; and including vias for electrical connection of the at least one front wiring plane and the at least one rear wiring plane. The carrier substrate includes at least one edge section and at least one center section, which are at least largely mechanically decoupled via a stress-decoupling structure. The front terminal pads are arranged exclusively on the center section for mounting the component, while the rear terminal pads are arranged exclusively on the edge section for mounting on a component carrier.
    Type: Application
    Filed: May 29, 2015
    Publication date: March 23, 2017
    Applicant: Robert Bosch GmbH
    Inventors: Reinhard Neul, Johannes Classen, Torsten Kramer, Jochen Reinmuth, Mirko Hattass, Lars Tebje, Daniel Christoph Meisel, Ralf Reichenbach, Friedjof Heuck, Antoine Puygranier
  • Publication number: 20170081180
    Abstract: A method for manufacturing a micromechanical component, including: providing a MEMS wafer; structuring the MEMS wafer proceeding from a surface of a second substrate layer of the MEMS wafer, at least one electrically conducting connection being formed between a first substrate layer and the second substrate layer of the MEMS wafer; providing a cap wafer; joining the MEMS wafer to the cap wafer; structuring the MEMS wafer proceeding from a surface of the first substrate layer of the MEMS wafer; providing an ASIC wafer; and joining the ASIC wafer to the joint of the MEMS wafer and the cap wafer.
    Type: Application
    Filed: September 16, 2016
    Publication date: March 23, 2017
    Inventor: Johannes Classen
  • Patent number: 9593948
    Abstract: A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: March 14, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Reinhard Neul, Johannes Classen, Torsten Ohms, Burkhard Kuhlmann, Axel Franke, Oliver Kohn, Daniel Christoph Meisel, Joerg Hauer, Udo-Martin Gomez, Kersten Kehr
  • Patent number: 9593949
    Abstract: A yaw-rate sensor having a substrate and a plurality of movable substructures that are mounted over a surface of the substrate, the movable substructures being coupled to a shared, in particular, central spring element, means being provided for exciting the movable substructures into a coupled oscillation in a plane that extends parallel to the surface of the substrate, the movable substructures having Coriolis elements, means being provided for detecting deflections of the Coriolis elements induced by a Coriolis force, a first Coriolis element being provided for detecting a yaw rate about a first axis, a second Coriolis element being provided for detecting a yaw rate about a second axis, the second axis being oriented perpendicularly to the first axis.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: March 14, 2017
    Assignee: ROBERT BOSCH GMBH
    Inventors: Reinhard Neul, Johannes Classen, Torsten Ohms, Burkhard Kuhlmann, Axel Franke, Oliver Kohn, Daniel Christoph Meisel, Joerg Hauer, Udo-Martin Gomez, Kersten Kehr
  • Publication number: 20170059852
    Abstract: A pivot apparatus, in particular a pivot apparatus for a micromirror, a fixed base frame being connected, directly or indirectly via an intermediate frame, to a pivotable carrier element. Spring elements having flexural springs are respectively disposed between the base frame and carrier element, base frame and intermediate frame, and intermediate frame and carrier element. The use of flexural springs enables good thermal coupling between the individual components, and an increase in robustness. The pivot apparatus can be embodied in particular as a microelectromechanical system.
    Type: Application
    Filed: August 19, 2016
    Publication date: March 2, 2017
    Inventors: Johannes Classen, Ralf Noltemeyer, Arnd Kaelberer, Peter Sudy, Hans Artmann